A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip
MPN: A3PE3000L-FGG484M ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $395 | $395.00 |
| 10 | $375.2 | $3,752.00 |
| 100 | $348 | $34,800.00 |
| 500 | $322.5 | $161,250.00 |
| 1,000 | $298 | $298,000.00 |
Drop-in alternatives for A3PE3000L-FGG484M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1A3PE3000L-FGG484M
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-FGG484
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-1FGG484I
✅ Drop-In✓ In Stock
$104.5 / Unit
View Datasheet →A3PE3000L-FG484M
✅ Drop-In✓ In Stock
$129 / Unit
View Datasheet →A3PE3000L-1FG484I
✅ Drop-In✓ In Stock
$89.9 / Unit
View Datasheet →A3PE3000L-FGG484M Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (ProASIC3 Low Power) |
| Logic Elements / Cells | 75264 |
| System Gates | 3000000 |
| Number of I/Os | 341 |
| Embedded Memory | 516096 bits |
| Core Voltage | 1.2 V to 1.5 V |
| Mounting Style | SMD/SMT |
| Package / Case | FBGA-484 (FGG484) |
| Package Dimensions | 23 x 23 mm, 2.23 mm height, 1.0 mm pitch |
| Minimum Operating Temperature | -55 C |
| Maximum Operating Temperature | +125 C |
| Temperature Grade | Military (M suffix) |
| Technology | Flash-based, non-volatile, Flash*Freeze |
| Packaging | Tray |
| RoHS Status | Compliant |
| Terminal Form | Ball |
| Product Series | A3PE3000L |
A3PE3000L-FGG484M 23 x 23 mm, 2.23 mm height, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000L-FGG484M (23 x 23 mm, 2.23 mm height, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FGG484M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FGG484M is suitable for 6 applications: Military and Aerospace Systems, Industrial Automation Controllers, Communications Line Cards, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Control.
Military and Aerospace Systems
The -55C to +125C military temperature rating of the A3PE3000L-FGG484M makes it directly suited to defense electronics such as avionics controllers, radar interface boards, and missile guidance subsystems. The 3M-gate fabric with 341 I/Os absorbs glue logic, bus interfaces, and sensor preprocessing in a single 23 x 23 mm package, while the non-volatile flash fabric delivers instant-on operation with no configuration PROM - a key reliability advantage in systems with tight power-sequencing windows. Flash*Freeze mode cuts static power substantially while retaining register and memory state, useful in event-driven payloads that idle between bursts. Designs should recompile bitstreams in Libero SoC and verify conduction-cooling thermal margins at the +125C junction limit.
Recommended
Industrial Automation Controllers
In factory automation and motion-control backplanes, the A3PE3000L-FGG484M consolidates deterministic I/O handling, encoder interpolation, and fieldbus interfacing into one flash FPGA. Its 1.2V to 1.5V core voltage lowers switching losses, and per the Microchip datasheet the L family cuts dynamic power about 40% versus the standard ProASIC3, reducing cabinet heat in sealed enclosures. The 341 user I/Os drive multiple isolated I/O banks at 3.3V and mixed voltages, while 516 kbit of embedded memory buffers process data without external SRAM. Single-chip flash configuration eliminates the config PROM, improving uptime in vibration-prone environments. Use the FGG484 footprint for consistent reflow assembly with lead-free processes.
Recommended
Communications Line Cards
Telecom and datacom line cards benefit from the A3PE3000L's combination of fabric density and I/O count: 341 user I/Os map cleanly to multi-port backplane interfaces, Serdes-adjacent glue logic, and LED or alarm aggregation. The high PSRR-friendly 1.5V core simplifies power-tree design behind point-of-load converters, and Flash*Freeze lets standby line cards drop static power roughly 50% versus equivalent ProASIC3 silicon while preserving state for fast reactivation. Non-volatile configuration means a card can enumerate within microseconds of hot-swap insertion, simplifying redundant-architecture bring-up. Designers should verify I/O banking rules in the DS50003268 datasheet against backplane voltage standards before pin freezing.
Recommended
Medical Instrumentation
Diagnostic imaging front ends, patient-monitoring bases, and laboratory analyzers use the A3PE3000L-FGG484M to time acquisitions, preprocess sensor streams, and manage display and communication interfaces. The flash fabric powers up instantly with no external configuration, shortening instrument boot time - a user-visible benefit in clinical workflows. Low static power, further reduced by Flash*Freeze between scans, extends the thermal and battery budget of portable and bedside units. The 23 x 23 mm FGG484 package with 1.0 mm pitch supports standard surface-mount assembly used in medical manufacturing. Note that the M temperature grade exceeds typical medical requirements; the industrial A3PE3000L-1FGG484I on the same footprint is usually the more economical pick for this sector.
Recommended
Test and Measurement Equipment
Bench instruments, automated test fixtures, and protocol analyzers exploit the A3PE3000L's reprogrammability and abundant I/O for pattern generation, capture buffering, and DUT interface adaptation. Embedded flash memory (516,096 bits) implements small lookup tables and configuration snapshots locally, while the fabric's low dynamic power keeps thermal noise contributions predictable in sensitive analog signal chains. Instant-on flash configuration means instruments are measurement-ready in under a typical USB-enumeration interval. The 484-ball package provides ample power and ground balls for low-inductance distribution to fast I/O banks. Instrument makers commonly dual-source the FGG484 and FG484M ball-finish variants across production sites - confirm RoHS requirements per region before qualifying the FG lead-finish options.
Recommended
Secure Embedded Control
Applications that must protect design IP - such as encryption key handling modules, license-control dongles, and proprietary industrial controllers - benefit from the A3PE3000L's non-volatile flash bitstream storage. Because the configuration lives on-chip, there is no external bitstream to intercept at power-up, a structural security advantage over SRAM FPGAs. The -55C to +125C M grade extends deployment to harsh outdoor and vehicle-mounted controllers. Designers can partition sensitive logic in the 75,264-cell fabric while using the 341 I/Os for tamper-detection loops and multi-voltage sensor interfaces. Follow Microchip security application notes for flash-lock and design-readback-disable settings, and recompile with current Libero SoC releases to carry latest security fixes.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FGG484M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1A3PE3000L-FGG484M | A3PE3000L-FGG484 | A3PE3000L-1FGG484I | A3PE3000L-FG484M | A3PE3000L-1FG484I |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (FGG484), 23 x 23 mm, 1.0 mm pitch | FBGA-484 (FGG484) - same | FBGA-484 (FGG484) - same | FBGA-484 (FGG484) - same | FBGA-484 (FG484) - same footprint, lead-finish variant | FBGA-484 (FG484) - same footprint, lead-finish variant |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology (M1 rebrand) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates / Cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells |
| User I/Os | 341 | 341 | 341 | 341 | 341 | 341 |
| Operating Temperature | -55C to +125C (Military) | -55C to +125C (Military) | [DATA_NEEDED: exact commercial/industrial range] | -40C to +100C (Industrial) | -55C to +125C (Military) | -40C to +100C (Industrial) |
| Speed Grade | Standard | Standard | Standard | -1 (faster) | Standard | -1 (faster) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | Yes | Yes |
| RoHS / Lead Finish | RoHS compliant (GGG lead-free balls) | Yes (GGG) | Yes (GGG) | Yes (GGG) | Non-RoHS FG finish per Xecor comparison | Non-RoHS FG finish |
Key Differentiators
- Military temperature range in the same FGG484 footprint (vs A3PE3000L-1FGG484I)
- ~40% lower dynamic and ~50% lower static power than ProASIC3 (vs A3PE3000-FGG484)
- Dual-sourcing via M1 rebrand (vs M1A3PE3000L-FGG484M)
Design Notes
Provide independent, well-decoupled 1.2V and 1.5V core rails plus I/O bank supplies (typically 3.3V/2.5V/1.8V per bank). Use at least 10uF bulk plus 0.1uF ceramic per power ball group, placed within 2 mm of the ball via. Verify power-on ramp rates against the DS50003268 datasheet power-up requirements; the non-volatile flash fabric means the device becomes active immediately, so I/O banks must be valid before or with the core to prevent bus contention during hot insertion. Use Microchip's power calculator to estimate static and dynamic current before selecting regulators, and account for Flash*Freeze entry/exit current transients.
The FGG484 is a 1.0 mm pitch, 23 x 23 mm BGA; standard 0.5 mm via-in-pad with via filled and capped, or dog-bone fanout on 1.0 mm pitch, both work. Plan at least four signal layers plus two dedicated planes for a comfortable 341-I/O breakout. Solder mask-defined vs non-solder-mask-defined pads must match Microchip's land-pattern recommendation to ensure reliable ball wetting. For the military M grade, specify X-ray inspection of BGA joints per your quality process, and store trays per MSL rating before reflow - bake if the floor-life clock is exceeded.
Three recurring mistakes: (1) copying the pinout from an A3PE3000 (non-L) datasheet - verify against the ProASIC3L FGG484 table in DS50003268; (2) leaving the Flash*Freeze pin floating or mis-assigned, which either blocks low-power entry or causes unintended state retention behavior - assign it deliberately in Libero before layout freeze; (3) assuming the FG and FGG suffixes are interchangeable - they differ in ball lead finish (RoHS), which matters for procurement and process qualification even though the electrical pinout is identical. Always recompile the design for the exact target MPN and speed grade.
Compliance Information
RoHS Code 'Yes' per Xecor comparison data for the FGG484M variant; the FG (non-GGG) ball-finish siblings are flagged non-RoHS in the same source. REACH, halogen-free, and conflict-minerals status not stated in provided data.
