A54SX32-BGG329 - 32K Gate SX FPGA, 240MHz, 329-BGA | Microchip
Teilenummer: A54SX32-BGG329 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $600.58 | $600,58 |
| 10 | $580 | $5.800,00 |
| 100 | $555 | $55.500,00 |
| 500 | $535 | $267.500,00 |
| 1.000 | $515.58 | $515.580,00 |
A54SX32-BGG329 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer wires together after manufacturing. Within the programmable-logic hierarchy, the SX family sits among one-time-programmable (OTP) antifuse FPGAs, which sit above SPLDs/CPLDs in gate density. Unlike SRAM FPGAs, antifuse devices are non-volatile, secure, and require no configuration PROM, making them attractive for high-reliability and space-constrained systems.
Key features include a sea-of-modules architecture that yields high routing efficiency and deterministic timing, 3.7 ns pin-to-pin clock-to-output, 0.1 ns input setup, and 0.25 ns clock skew. The device supports 66 MHz PCI integration as a single-chip solution, combining CPLD and FPGA functions without external glue logic.
Technically, the SX family uses a fine-grained sea-of-modules fabric built around C-cells (combinational) and R-cells (register), giving near-ASIC logic utilization. The antifuse interconnect provides low parasitic capacitance, supporting the 240 MHz internal clock rate and lower static power than equivalent SRAM FPGAs.
Typical applications include industrial control, communications and networking line cards, avionics and military subsystems requiring design security, and PCI-compliant interface bridging where the 66 MHz PCI capability eliminates a separate bridge chip.
Designers should note that this is a one-time-programmable device: the design must be finalized before programming, and speed-grade selection (-1, -2, standard) directly affects the achievable internal frequency. Verify I/O bank assignments and 329-BGA ballout against the manufacturer datasheet before layout.
This page adds value beyond the datasheet by synthesizing distributor pricing, drop-in same-package alternatives (SX and SX-A family speed grades), and practical design notes for obsolescence management of this mature Actel/Microsemi product line.
Drop-in-Alternativen für A54SX32-BGG329 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A54SX32-BGG329 (gleiche Bauform und Footprint) – abweichend in Package, Family, System Gates, Supply Voltage, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A54SX32-1BGG329
✅ Drop-In✓ Auf Lager
$544.99 / Stück
Datenblatt ansehen →A54SX32-BGG329I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A54SX32-BG329I
✅ Drop-In✓ Auf Lager
$560 / Stück
Datenblatt ansehen →A54SX32-2BGG329I
✅ Drop-In✓ Auf Lager
$88.9 / Stück
Datenblatt ansehen →A54SX32A-BGG329
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A54SX32A-BG329I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A54SX32A-1BGG329M
✅ Drop-In✓ Auf Lager
$82 / Stück
Datenblatt ansehen →A54SX32-BGG329 Grenzwerte & elektrische Eigenschaften
| System Gates | 32000 gates |
| Logic Cells | 2880 |
| User I/O | 249 |
| Maximum Internal Frequency | 240 MHz |
| Clock-to-Out (Pin-to-Pin) | 3.7 ns |
| Input Setup Time | 0.1 ns |
| Clock Skew | 0.25 ns |
| Process Technology | 0.35 um CMOS |
| Versorgungsspannung | 3.3 V / 5 V |
| Programming Technology | Antifuse (one-time programmable) |
| Architecture | Sea-of-modules (Actel SX family) |
| Gehäuse | 329-BBGA (31 x 31 mm) |
| Package Ball Pitch | 1.27 mm |
| Logic Family | CMOS |
| Montageart | Surface Mount |
| RoHS-Status | ROHS COMPLIANT |
| PCI Integration | 66 MHz PCI single-chip solution |
| ECCN | 3A991.d.2 |
A54SX32-BGG329 1.27 mm Pinbelegungsleitfaden
Pinbelegung für A54SX32-BGG329 (1.27 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A54SX32-BGG329.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A54SX32-BGG329 ist geeignet für 6 Anwendungs: 66 MHz PCI Interface Bridging, Industrial Control and Automation, Avionics and Defense Subsystems, Communications and Networking Line Cards, Design-Secure Embedded Systems, Legacy System Life Extension (Obsolescence Management).
66 MHz PCI Interface Bridging
The A54SX32-BGG329 was explicitly characterized by Actel/Microsemi as a single-chip 66 MHz PCI solution, integrating bridge and glue logic that would otherwise require a CPLD plus an FPGA. Its 3.7 ns pin-to-pin clock-to-out and 0.25 ns clock skew meet PCI timing budgets at 66 MHz when combined with the -1 or -2 speed grades. In a typical design, the device sits between a host bus and peripheral logic, with 249 user I/O providing ample width for address/data multiplexing. Because it is antifuse-based, the PCI configuration is fixed at power-up with zero configuration latency - important for PCI enumeration windows.
Empfohlen
Industrial Control and Automation
In industrial controllers, the A54SX32-BGG329 consolidates sequencer, interlock, and interface logic into one 32K-gate device, replacing multiple CPLDs and discrete glue. The 3.3V/5V I/O support lets it talk directly to legacy 5V TTL PLC signaling and 3.3V microprocessors on the same board, a common requirement in retrofit automation equipment. Deterministic antifuse routing gives fixed propagation delays, which simplifies safety-interlock timing analysis. With 2880 logic cells and 249 I/O, a typical implementation carries a motor-control state machine, encoder interfaces, and fieldbus glue with margin. Designers should budget for the one-time-programmable workflow by freezing logic before production programming.
Empfohlen
Avionics and Defense Subsystems
Antifuse FPGAs like the A54SX32-BGG329 were widely deployed in avionics, military radio, and mission-critical subsystems because the programmed interconnect cannot be read back or disturbed by configuration upsets the way SRAM fabrics can. The M-suffix and industrial-grade siblings (A54SX32A-1BGG329M) extend temperature ranges for harsh environments. In these systems the 32K gates typically implement bus interfaces (MIL-STD-1553 glue, ARINC formatting), and the 240 MHz internal performance covers signal-formatting pipelines. The non-volatile, instant-on behavior also matters for systems with strict power-up sequencing requirements, eliminating configuration-watchdog circuitry entirely.
Empfohlen
Communications and Networking Line Cards
Telecom line cards used the SX family's sea-of-modules fabric to implement framing, formatting, and backplane interface logic with deterministic timing. The 0.25 ns clock skew supports synchronous high-speed data paths across the 249 I/O, and the low parasitic capacitance of antifuse routing reduces per-node switching power compared with SRAM FPGAs of the era - beneficial in dense card cages. The A54SX32-BGG329 typically implements T1/E1 or backplane glue functions alongside PHY devices. Because the fabric is fine-grained (C-cell/R-cell), register-heavy framing logic achieves high utilization, often fitting designs that would need larger SRAM devices.
Empfohlen
Design-Secure Embedded Systems
Where bitstream theft is a concern, the A54SX32-BGG329 offers inherent security: there is no external configuration image to intercept, and the programmed antifuse pattern is practically unobservable. This made SX devices a default choice for products with proprietary algorithms - encryption front-ends, license-control logic, and anti-cloning partitions in industrial and consumer hardware. The 2880 logic cells accommodate a compact AES-class datapath or custom cipher of the period, and the 240 MHz fabric supports pipelined implementations. Boards can ship with zero configuration memory BOM cost, and power-up is immediate with no load cycle that could be glitched by an attacker.
Empfohlen
Legacy System Life Extension (Obsolescence Management)
Many fielded systems still depend on the A54SX32-BGG329 years after its estimated 2021 EOL date. Sustaining engineers can extend life by qualifying same-footprint alternatives - A54SX32-1BGG329 and A54SX32-BGG329I share the exact 329-ball BGA ballout, so existing PCBs accept them without rework and only the programming file changes. Strategic last-time buys from remaining stock (for example, 3,520 pieces reported at Heisener as of 2026-09-03) combined with a documented migration path to Microchip ProASIC3 devices provides a two-track strategy: bridge with authentic old stock while a recompiled ProASIC3 design is qualified for the next production phase.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A54SX32-BGG329 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A54SX32-1BGG329 | A54SX32-BGG329I | A54SX32-2BGG329I | A54SX32A-BGG329 |
|---|---|---|---|---|---|
| Package | 329-BBGA | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 32000 | 32000 | 32000 | 32000 | 32000 |
| Logic Cells | 2880 | 2880 | 2880 | 2880 | 1800 cells (FindIC) |
| Maximum Internal Frequency | 240 MHz | 280 MHz | 240 MHz | 320 MHz | up to 320 MHz |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 2.5 V core |
| Process Technology | 0.35 um | 0.35 um | 0.35 um | 0.35 um | 0.25 um |
| Temperature Grade | Commercial | Commercial | Industrial | Industrial | Commercial |
| Lifecycle Status | EOL (est. 2021, limited supply) | EOL (legacy stock) | EOL (legacy stock) | EOL (legacy stock) | EOL (legacy stock) |
Wichtigste Unterscheidungsmerkmale
- Fastest same-package speed grade available as drop-in (vs. A54SX32-2BGG329I)
- Extended temperature availability within the same footprint (vs. A54SX32-BGG329I)
- 5V-tolerant 3.3V/5V I/O vs SX-A core voltage (vs. A54SX32A-BGG329)
- Zero configuration latency vs SRAM/flash FPGAs (vs. A3PE600-2FGG484)
Designhinweise
The A54SX32-BGG329 requires 3.3V and 5V rails per Microchip datasheet data. Estimated: antifuse FPGA static power is dominated by I/O loading, so estimate rail current by summing (toggle rate x load capacitance x V^2 x f) per output bank plus the device quiescent figure from the 54SX family power calculator. Because there is no configuration surge, inrush is limited to ordinary decoupling recharge; still, provide at least 10 uF bulk plus 0.1 uF per power ball as a starting point and verify against the Microchip power estimation tool for your design.
This is a one-time-programmable antifuse device: you cannot reflash in-circuit. Program speed grade and design in Libero IDE/Designer before committing production devices, and always hold spare programmed units - a logic bug after programming means scrapping the package. Also note the lifecycle risk: estimated EOL 2021 with limited supply and a reported high counterfeit threat level (~69 pct) in the open market per datasheet-directory data, so buy only from franchised distributors and require date-code and provenance verification for broker stock.
The 329-BBGA uses a 1.27 mm ball pitch on a 31 x 31 mm body. For reliable assembly, design fanout with via-in-pad or dogbone escape on the inner ball rows, and follow the manufacturer package drawing for keep-out and stencil guidance. Connect all VCC/GND balls as drawn in the datasheet ballout - antifuse devices rely on every listed supply ball, and omitting decoupling on a shared ball grid invites ground-bounce-induced timing errors. The commercial-grade A54SX32-BGG329 should not be substituted into industrial-temperature sockets without derating analysis.
The SX family achieves 0.25 ns clock skew across the fabric, but board-level clock distribution still dominates pin-to-pin timing. Estimated: at 66 MHz PCI operation, the 3.7 ns clock-to-out budget leaves roughly 3.8 ns for board flight time in a 15 ns cycle; keep clock traces length-matched and short, and series-terminate 5V-tolerant outputs driving heavy buses. Simulate I/O banking with the datasheet output buffer models before final routing, since the 249 I/O are banked and mixed-standard assignment affects timing.
Compliance-Informationen
Distributor data (digchip) lists the part as ROHS COMPLIANT. REACH, lead-free, halogen-free, and conflict-minerals statuses were not stated in the provided data and are marked unknown.
