A54SX32-BGG329I - 32K-Gate SX FPGA, 249 I/O, 329-BGA | Microchip
MPN: A54SX32-BGG329I ✓ Active| Qty | Unit Price | Extended |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for A54SX32-BGG329I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX32-1BGG329I
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$88.9 / Unit
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A54SX32-BGG329I Maximum Ratings & Electrical Characteristics
| System Gates | 32000 |
| Logic Cells / Logic Modules | 2880 |
| User I/O | 249 |
| Internal System Performance | 320 MHz |
| Internal Operating Frequency | 240 MHz |
| Clock-to-Out (Pin-to-Pin) | 3.7 ns |
| Input Setup Time | 0.1 ns |
| Clock Skew | 0.25 ns |
| PCI Interface Support | 66 MHz PCI |
| Process Technology | 0.35 um CMOS |
| Supply Voltage | 3.3 V core / 5 V I/O |
| Logic Family | CMOS |
| Programmable Interconnect | Antifuse (one-time programmable) |
| Package | 329-Ball BGA (329-BBGA) |
| Mounting Type | Surface Mount |
| Architecture | Sea-of-modules, Actel SX family |
A54SX32-BGG329I 329-ball bga (329-bbga) Pin Configuration Guide
Complete pinout information for A54SX32-BGG329I (329-ball bga (329-bbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32-BGG329I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32-BGG329I is suitable for 6 applications: 66 MHz PCI Bus Interface, Industrial Control and Automation, Aerospace and Defense Logic Integration, Communications Line Cards, CPLD and FPGA Consolidation (Single-Chip Integration), Secure and Instant-On Embedded Systems.
66 MHz PCI Bus Interface
The A54SX32-BGG329I implements single-chip 66 MHz PCI interfaces thanks to 0.1 ns input setup time, 0.25 ns clock skew, and 3.7 ns pin-to-pin clock-to-out. The sea-of-modules architecture gives deterministic routing delays, so the tight PCI timing budget closes reliably without place-and-route iterations. In a typical design the FPGA hosts the PCI state machines, target/initiator logic, and application glue logic across its 249 user I/O, integrating what previously required a CPLD plus FPGA. Because the antifuse interconnect is non-volatile, the PCI board powers up already configured - no host-side configuration controller or boot flash is needed, improving bus bring-up time and system availability.
Recommended
Industrial Control and Automation
Industrial controllers benefit from the A54SX32-BGG329I's industrial temperature grade (I suffix), 5V-tolerant I/O, and non-volatile antifuse configuration. Legacy factory equipment commonly runs 5V logic; the SX32's dual 3.3V core / 5V I/O operation lets it interface directly with older PLC I/O modules and sensors without level shifters. Its 32,000 gates and 2,880 logic cells integrate sequencers, counters, and interface logic that once required multiple 22V10-class CPLDs. Because the configuration cannot be read back or disturbed by power glitches, the device suits noisy motor-control cabinets and systems where an SRAM FPGA's configuration upset or missing boot image would halt production.
Recommended
Aerospace and Defense Logic Integration
The antifuse SX architecture has long been favored in aerospace and defense payloads for configuration security and latch-up-resistant operation. The A54SX32-BGG329I's one-time-programmable interconnect leaves no readable bitstream in the system, supporting design IP protection for mission hardware, and there is no configuration memory to upset in radiation environments (for full rad-tolerance Microchip offers the related RTAX family). Designers use the 32K gates to integrate telemetry formatting, bus bridges, and redundancy/voting logic in a single 329-BBGA. Instant-on behavior means FPGA-based sequencers are active within nanoseconds of power application - valuable in payload power-switching and safe-and-arm style subsystems.
Recommended
Communications Line Cards
Telecom and datacom line cards use the A54SX32-BGG329I for framing, multiplexing, and backplane interface logic. The 240 MHz internal operating frequency supports high-throughput serial-to-parallel conversion at line rates, while 249 I/O accommodate wide parallel backplanes. The sea-of-modules routing keeps timing closure predictable across design revisions - important when a line card must pass compliance across multiple builds. Its 5V-tolerant I/O eases interoperation with legacy 5V backplane standards common in installed chassis. Because the device configures itself from antifuse state at power-up, hot-swappable cards resume operation immediately without a configuration controller consuming board area.
Recommended
CPLD and FPGA Consolidation (Single-Chip Integration)
The SX family datasheet explicitly markets the A54SX32 as a single-chip solution for CPLD and FPGA integration, and this cost-reduction role is its most common use. Boards that combined a fast CPLD for decode/state machines with a mid-range FPGA for datapath logic can consolidate both functions into one A54SX32-BGG329I, saving a device position, two assembly steps, and the inter-device routing that degraded timing. The 320 MHz internal performance and 0.25 ns clock skew support the decode logic traditionally done in CPLDs, while 32K gates handle the datapath. For legacy redesigns, consolidating into one BGA also improves board reliability by removing one solder-joint-heavy package.
Recommended
Secure and Instant-On Embedded Systems
Systems that must be active within microseconds of power and must not expose their configuration - payment terminals, secure comm units, anti-tamper subsystems - fit the A54SX32-BGG329I's antifuse profile. Unlike SRAM FPGAs that fetch a bitstream from external flash (a visible, interceptable image), the antifuse pattern is physically programmed at the factory or programming station and cannot be read back. The device draws no configuration current and has no boot latency, so mission-critical control logic, key handling state machines, or watchdog functions implemented in the SX32 are live before a software processor finishes reset. The 329-BBGA also resists casual probing relative to smaller-pitch packages.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32-BGG329I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32-1BGG329I | A54SX32-2BGG329I | A54SX32-BGG329 | A54SX32-1BGG329 | A54SX32-2BGG329 | A54SX32A-BGG329 |
|---|---|---|---|---|---|---|---|
| Package | 329-BBGA | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000-class SX-A die |
| Logic Cells | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 |
| User I/O | 249 | 249 | 249 | 249 | 249 | 249 | 249 |
| Internal Performance | 320 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Higher (SX-A enhanced) |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Commercial | Commercial | Commercial | Commercial |
| Interconnect Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
Key Differentiators
- Industrial temperature qualification with full 249 I/O in 329-BBGA (vs A54SX32-BGG329)
- Guaranteed higher timing grades for timing-critical PCI logic (vs A54SX32-1BGG329I)
- Deterministic one-time-programmable antifuse with configuration security (vs A54SX32A-BGG329 (SX-A))
Design Notes
The A54SX32-BGG329I is one-time programmable: once programmed, the device cannot be erased or reconfigured. Always exhaust simulation, static timing analysis, and (where possible) a programmed sample validation before committing production units. Program a small pilot lot first - a logic error discovered after programming all stock means scrapping the entire lot. Reserve I/O and internal routing margin in your design so small bug fixes can sometimes be routed around without changing the pinout, but do not rely on this as a substitute for thorough verification.
For the 329-ball BGA, obtain the exact ball-map and mechanical drawing from the Microchip SX family datasheet and generate the footprint from the Libero/Designer pin report rather than third-party diagrams - I/O bank assignments are user-definable and the datasheet pin tables show function, not a fixed netlist. Follow manufacturer guidance for via-in-pad or dogbone fanout with 1.27 mm-class BGA pitch, and place 0.1 uF decoupling capacitors for each supply ball group as close as routing allows. Define unused I/O as grounded per datasheet recommendations to avoid floating inputs.
The device operates from 3.3V core with 5V-tolerant I/O per the SX family datasheet. Estimated: power dissipation depends heavily on toggle rates, so use the Microchip power calculator (or Designer tool power estimator) with your actual netlist rather than rule-of-thumb numbers. Supply both rails in the correct sequence per the datasheet power-up specification, and verify that 5V-domain inputs never exceed the absolute maximum ratings during transients. A solid ground plane under the BGA is required for both power integrity and the 0.25 ns clock-skew figure at 66 MHz PCI operation.
At 66 MHz PCI and 240 MHz internal operation, match trace lengths on the PCI clock and control group and follow the PCI SIG layout guidelines for loading (maximum trace length and capacitance per PCI revision). The SX32's 0.1 ns setup and 0.25 ns skew figures give generous internal margin, but board-level reflections can still violate receiver thresholds - terminate per the PCI specification and simulate stubs on the 329-BBGA breakout fanout, which adds inductive stubs if vias are placed far from the balls.
Compliance Information
Third-party specification records list the BGG329 package family as ROHS COMPLIANT plastic BGA. REACH, lead-free, halogen-free, and conflict-minerals status were not stated in the verified web data - confirm certificates with Microchip before BOM release.