A54SX32-1BGG329 - 32K-Gate FPGA, 280MHz, 329-BGA | Microchip
MPN: A54SX32-1BGG329 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $681.24 | $681.24 |
| 10 | $647.18 | $6,471.80 |
| 100 | $613.12 | $61,312.00 |
| 500 | $579.05 | $289,525.00 |
| 1,000 | $544.99 | $544,990.00 |
Drop-in alternatives for A54SX32-1BGG329 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A54SX32-1BG329
β Drop-Inπ Reference alternative (not in catalog)
A54SX32-2BGG329I
β Drop-Inβ In Stock
$88.9 / Unit
View Datasheet βA54SX32-BGG329I
β Drop-Inπ Reference alternative (not in catalog)
A54SX32-PBGG329I
β Drop-Inπ Reference alternative (not in catalog)
A54SX32A-1BGG329
β Drop-Inπ Reference alternative (not in catalog)
A54SX32A-1BGG329M
β Drop-Inπ Reference alternative (not in catalog)
A54SX32-1BGG329 Maximum Ratings & Electrical Characteristics
| Family | Actel SX (SX) FPGA |
| Equivalent Gate Count | 32000 gates |
| Logic Cells (CLBs) | 2880 |
| Number of User I/O | 249 |
| Maximum Clock Frequency | 280 MHz |
| I/O Voltage Support | 3.3 V / 5 V (per SX family datasheet) |
| Programming Technology | Antifuse, one-time programmable |
| Architecture | Sea-of-modules |
| Package | 329-ball PBGA (BGG329) |
| Ball Pitch | 1.27 mm |
| Mounting Type | Surface Mount |
| Process Technology | CMOS |
| Speed Grade | -1 |
| RoHS Status | RoHS Compliant |
| Lead Free Status | Lead Free |
A54SX32-1BGG329 329-ball pbga (bgg329) Pin Configuration Guide
Complete pinout information for A54SX32-1BGG329 (329-ball pbga (bgg329) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32-1BGG329.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32-1BGG329 is suitable for 6 applications: Industrial Automation Control, Communications Line Cards, Avionics and Defense Legacy Sustainment, Test and Measurement Equipment, High-Speed Bus Interface Bridging, Security and Surveillance System Logic.
Industrial Automation Control
The A54SX32-1BGG329 fits industrial automation controllers where 2880 logic cells and 249 user I/O integrate sequencers, encoders, and bus interfaces in one antifuse device. Its 280 MHz maximum clock and deterministic sea-of-modules routing give predictable cycle times for high-speed motion and machine-vision trigger logic, while instant-on antifuse configuration eliminates FPGA boot delay at power-up - important for safety interlocks that must be active within milliseconds. The 329-ball PBGA supports wide parallel I/O to PLC backplanes. Trade-off: as an OTP device, logic revisions require new silicon, so freeze the control design before programming.
Recommended
Communications Line Cards
In telecom and networking line cards, the SX32 provides glueless bridging between backplane buses, PHY devices, and framer logic. The 249 I/O handle wide parallel POS/PHY and TDM interfaces, and the 280 MHz clock ceiling supports line-rate data-path plumbing at legacy telecom speeds. According to the SX family datasheet, antifuse interconnect delivers consistent routing delays, simplifying timing closure on multi-gigabit companion PHY handoff interfaces. The 3.3V/5V I/O tolerance per the datasheet eases interfacing with legacy 5V TTL line-card circuitry. Note that OTP programming means each board revision needs freshly programmed devices in inventory.
Recommended
Avionics and Defense Legacy Sustainment
Antifuse SX FPGAs were widely designed into avionics and defense platforms, and the A54SX32-1BGG329 remains a sustainment choice for those programs. Instant-on configuration with no external boot flash removes a common failure point in high-vibration environments, and the non-volatile antifuse fabric resists configuration upset relative to SRAM FPGAs. The 32K-gate capacity covers MIL-STD-1553 interfaces, ARINC bus glue, and discrete I/O consolidation. For new flight designs requiring radiation tolerance, migrate to the RTAX-S/SL family; for ground-based and legacy in-service boards, this commercial-grade 329-BBGA part preserves the existing footprint and design files.
Recommended
Test and Measurement Equipment
Bench and automated test instruments use the SX32 for timing generators, pattern generators, and instrument bus glue logic. Deterministic antifuse routing means timing skews measured during calibration stay stable over production, since there is no reconfiguration variance; the 280 MHz toggle capability supports fast edge generation for stimulus electronics. The 249 I/O enable dense channel multiplexing to relay matrices and ADC front ends. Because the device is one-time programmable, instrument firmware changes require socketed or reworked devices - design programming access accordingly. Pair with precision ADCs and reference ICs for complete measurement subsystems.
Recommended
High-Speed Bus Interface Bridging
The device excels at bridging legacy processor buses (VME, PCI-era local buses, proprietary parallel backplanes) to modern peripherals. Wide 32/64-bit buses map directly onto the 249 I/O budget, and 5V-tolerant I/O per the SX family datasheet connects directly to TTL-era bus transceivers without level shifting. Predictable interconnect delay makes synchronous bus timing easy to close at 280 MHz-class internal clocks. The 1.27 mm ball pitch PBGA is reworkable with standard BGA reflow equipment, supporting field repair. Implement parity, byte-swap, and wait-state generation in the C-cell/R-cell fabric without consuming external glue logic.
Recommended
Security and Surveillance System Logic
Surveillance and access-control equipment leverages the SX32 for camera interface formatting, frame-sync generation, and encrypted-channel glue logic. The antifuse configuration cannot be read out or altered in the field, providing a hardware root of trust not available in SRAM FPGAs whose bitstreams reside in external flash - a genuine security advantage for tamper-sensitive installations. With 249 I/O the device consolidates multiple sensor links, and the 280 MHz ceiling supports real-time timestamp and overlay generation. Cost-effective for mid-volume deployments where board area and instant-on behavior matter more than in-field reconfigurability.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32-1BGG329 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32-1BG329 | A54SX32-2BGG329I | A54SX32-PBGG329I | A54SX32A-1BGG329 | A54SX32A-1BGG329M |
|---|---|---|---|---|---|---|
| Package | 329-ball PBGA (BGG329), 1.27 mm pitch | 329-ball PBGA - same | 329-ball PBGA - same | 329-ball PBGA - same | 329-ball PBGA - same | 329-ball PBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 32,000 | 32,000 | 32,000 | 32,000 | 32,000 | 32,000 |
| Logic Cells (CLBs) | 2880 | 2880 | 1800 cells (SX-A class per FindIC) | 2880 | 1800 cells (SX-A per FindIC) | 1800 cells (SX-A per FindIC) |
| Max Clock Frequency | 280 MHz | 280 MHz | 238 MHz (SX-A class per FindIC) | 240 MHz | 238 MHz | 238 MHz |
| User I/O | 249 | 249 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Supply | [DATA_NEEDED] | [DATA_NEEDED] | 2.5 V (SX-A per FindIC) | [DATA_NEEDED] | 2.5 V | 2.5 V |
| Temperature Grade / Compliance | Commercial (per ordering code); RoHS compliant, lead free | Commercial; RoHS compliant | Industrial (-I) | Industrial (-I) | [DATA_NEEDED] | Military (M suffix) |
Key Differentiators
- Highest clock rate in this comparison set (vs A54SX32-PBGG329I)
- Original SX die with 3.3V/5V I/O (vs A54SX32A-1BGG329)
- Lower supply complexity than SX-A parts (vs A54SX32A-1BGG329M)
- Honest trade-off: slower and older process than SX-A refresh (vs A54SX32A-1BGG329)
Design Notes
Antifuse devices are one-time programmable: once the A54SX32-1BGG329 is burned, the design cannot be modified. Complete simulation, timing closure, and hardware validation (often with a prototype or emulation path) before production programming, and stock spare programmed devices for field service. Also confirm the exact ordering-code suffix - the SX32 family includes commercial, industrial (-I), and military (M) temperature variants in the same 329-ball footprint, and mixing grades across a build can cause system-level temperature failures.
The SX (0.35 um-class) family supports 3.3V/5V I/O operation per the family datasheet, while the SX-A refresh (A54SX32A) moves to a 2.5 V core. When reusing an SX-class PCB layout for SX-A parts, verify all core and I/O rails against the new datasheet before adopting the SX-A in the same footprint - an unchecked rail swap can overstress the device. Estimate static and dynamic current with Microchip's power calculator during design; antifuse parts draw lower static power than SRAM FPGAs of similar capacity.
The 329-ball PBGA with 1.27 mm pitch routes comfortably on a 4-6 layer board with via-in-pad or dogbone fanout. Follow the Microchip SX datasheet PCB layout guidance: place 0.1 uF ceramic decoupling capacitors at the VCC/VCCA ball clusters and a solid ground plane under the package to control return paths for the 280 MHz-class internal clocks. Provide JTAG (TDI/TDO/TMS/TCK) header access for programming and boundary-scan test, since the OTP device must be programmed after board assembly.
Compliance Information
RoHS Compliant and Lead Free per digchip datasheet summary for A54SX32-1BGG329. REACH, halogen-free, and conflict-minerals status not stated in provided data.
