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ADATA Technology

AEM532HE8S-0CAR - 32GB eMMC 5.1 153-FBGA | ADATA Technology

Teilenummer: AEM532HE8S-0CAR ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
3.3 V ±5% Vdss 153-ball FBGA Package 200 MHz DDR (HS400 mode) Speed eMMC 5.1 (JESD84-B51) Memory
Ab $5.95 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-13
Mengenpreise
Menge Stückpreis Gesamt
1 $12.5 $12,50
10 $11.2 $112,00
100 $9.85 $985,00
500 $8.4 $4.200,00
1.000 $7.1 $7.100,00
3.000 $5.95 $17.850,00
ℹ️ Alle Preise sind in USD

AEM532HE8S-0CAR Übersicht

The ADATA AEM532HE8S-0CAR is a 32 GB embedded MultiMediaCard (eMMC) 5.1 compliant NAND flash memory device housed in a 153-ball FBGA package with 8-bit bus width support. It operates at VCC = 3.3 V ±5% and VCCQ = 1.8 V ±5%, with HS400 interface speed up to 200 MHz DDR mode. The device integrates a flash controller and MLC NAND die for managed NAND applications in industrial, automotive, and embedded systems.

An eMMC (embedded MultiMediaCard) is a managed NAND flash storage standard defined by JEDEC (JESD84-B51). It packages a flash controller together with raw NAND die in one BGA package, exposing a standardized MMC interface so the host CPU does not have to manage ECC, block management, or wear leveling. This makes eMMC the canonical boot/storage medium for SoCs that lack a native NAND controller, sitting between raw NAND and removable SD cards in the storage hierarchy.

Key features of the AEM532HE8S-0CAR include 32 GB user density, HS400 DDR 200 MHz interface, 8-bit bus width, sequential read performance suitable for fast boot, and write performance supporting continuous logging. It supports boot partitions, RPMB (Replay-Protected Memory Block), and the standard eMMC command set including CMD6 (SWITCH), CMD8 (SEND_EXT_CSD), and CMD44/45/46 (secure erase/sanitize/trust zone). Per JESD84-B51, the device is backward-compatible with eMMC 4.5/5.0 hosts.

Architecturally, the AEM532HE8S-0CAR uses an ADATA-proprietary flash controller fronting MLC NAND. The controller handles ECC, bad-block management, wear leveling, and host protocol translation. Operating temperature spans industrial-grade ranges, and the FBGA package enables compact PCB integration typical of mobile and IoT platforms.

Typical applications include industrial gateways, IoT edge devices, automotive infotainment boot storage, point-of-sale (POS) terminals, and embedded Linux/Android platforms where a managed boot/storage medium is required.

When designing with this part, ensure the host SoC supplies both VCC (3.3 V) and VCCQ (1.8 V) rails; VCCQ may be tied to 1.8 V from the SoC's LDO. Decoupling per JEDEC recommendations and proper PCB trace impedance for the 200 MHz DDR interface are essential.

This page synthesizes distributor pricing, datasheet specifications, and cross-reference alternatives not found on the manufacturer's product page, providing actionable guidance for engineers qualifying managed NAND in embedded designs.

Drop-in-Alternativen für AEM532HE8S-0CAR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

AEM332HE8S-0CAR

✅ Drop-In
📦 153-ball FBGA
same 32GB density and FBGA footprint, but HS200 (single data rate) instead of HS400 - interface speed halved, pin-to-pin compatible

📋 Referenzalternative (nicht im Katalog)

AEM532HE8S-0DA

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 153-ball FBGA
same die/package, different firmware revision - functionally identical for most use cases, pin-to-pin compatible

📋 Referenzalternative (nicht im Katalog)

AEM532HE8S-1CAR

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 153-ball FBGA
same 32GB eMMC 5.1, minor firmware revision for industrial temperature extension - pin-to-pin compatible, near-identical specs

📋 Referenzalternative (nicht im Katalog)

SDINBDA4-32G

✅ Drop-In
📦 153-ball FBGA
Western Digital 32GB eMMC 5.1, same JEDEC standard pinout (JESD84-B51), pin-to-pin compatible, HS400 DDR 200 MHz

📋 Referenzalternative (nicht im Katalog)

THGBF2G9L8LBAD7

✅ Drop-In
📦 153-ball FBGA
Kioxia 32GB eMMC 5.1, JEDEC JESD84-B51 standard 153-ball FBGA, HS400 - pin-to-pin compatible per eMMC standard

📋 Referenzalternative (nicht im Katalog)

EMMC32G-1DB08

✅ Drop-In
📦 153-ball FBGA
Kingston 32GB eMMC 5.1, same 153-ball FBGA JEDEC footprint, HS400 DDR 200 MHz interface, pin-to-pin compatible

📋 Referenzalternative (nicht im Katalog)

AEM532HE8S-0CAR Grenzwerte & elektrische Eigenschaften

Speichertyp eMMC 5.1 (JESD84-B51)
Density (User) 32 GB
Interface Bus Width 8-bit
Maximale Taktfrequenz 200 MHz DDR (HS400 mode)
VCC (NAND Supply) 3.3 V ±5%
VCCQ (Interface Supply) 1.8 V ±5%
NAND Technology MLC NAND
Gehäuse 153-ball FBGA
Boot Partition Support Yes (per JESD84-B51)
RPMB Support Yes
HS400 Mode Supported
Command Queuing Supported (eMMC 5.1)
RoHS-Status Compliant
Lead-free / Halogen-free Yes

AEM532HE8S-0CAR 153-ball fbga Pinbelegungsleitfaden

Pinbelegung für AEM532HE8S-0CAR (153-ball fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für AEM532HE8S-0CAR im 153-ball fbga-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für AEM532HE8S-0CAR.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

AEM532HE8S-0CAR ist geeignet für 7 Anwendungs: Industrial IoT Gateway, Automotive Infotainment Boot Storage, Point-of-Sale (POS) Terminal, Embedded Linux Single-Board Computer, Smart Home Hub / Edge AI Device, Industrial HMI Touch Panel, Medical Point-of-Care Diagnostic Device.

🏭

Industrial IoT Gateway

The AEM532HE8S-0CAR provides 32 GB managed NAND storage for industrial IoT gateways running Linux or embedded RTOS. With HS400 DDR 200 MHz interface delivering up to 400 MB/s read throughput, the device handles fast OS boot (typically <3 seconds from power-on), persistent data buffering for sensor telemetry, and OTA firmware updates. The eMMC 5.1 standard (JESD84-B51) integrates ECC and wear leveling, eliminating the need for external flash controllers on resource-constrained gateways. Operating at 3.3 V VCC and 1.8 V VCCQ, the part draws power from common industrial 24V-to-3.3V buck rails and the SoC's 1.8 V LDO, simplifying BOM. The 153-ball FBGA package footprint is JEDEC-standard across eMMC vendors, enabling second-source flexibility across ADATA, Western Digital, and Kioxia equivalents.

🚗

Automotive Infotainment Boot Storage

The AEM532HE8S-0CAR serves as the primary boot and media storage medium in automotive infotainment head units. Its 32 GB capacity accommodates the head-unit firmware, navigation maps, and media libraries. The eMMC 5.1 HS400 DDR mode enables rapid boot to user-display state, critical for the automotive cold-start requirement of under 5 seconds. The managed NAND architecture with on-die ECC and wear leveling handles the high write-cycle demands of OTA updates and continuous logging. With VCC at 3.3 V and VCCQ at 1.8 V, the part integrates directly with typical NXP i.MX and Renesas R-Car automotive SoC power trees. For safety-critical ECUs, AEC-Q100 qualified ADATA automotive-grade eMMC variants are recommended.

💳

Point-of-Sale (POS) Terminal

The AEM532HE8S-0CAR delivers reliable managed storage for POS terminals requiring fast transaction logging and secure boot. The 32 GB capacity holds the Linux OS, payment applications, and local transaction journal. RPMB (Replay-Protected Memory Block) per JESD84-B51 enables secure storage of cryptographic keys used in EMV chip card authentication. HS400 DDR 200 MHz interface minimizes transaction latency, while eMMC 5.1 command queuing optimizes throughput under mixed read/write workloads typical of POS peripherals. The industrial temperature range and 153-ball FBGA package suit compact sealed terminal enclosures. Cross-vendor JEDEC pinout enables straightforward substitution between ADATA, Western Digital, and Kingston equivalents during supply-chain constraints.

🖥️

Embedded Linux Single-Board Computer

The AEM532HE8S-0CAR is the canonical boot/storage medium for single-board computers based on NXP i.MX 6/7/8, Allwinner, or Rockchip SoCs that lack native NAND controllers. Its 32 GB capacity supports mainstream Linux distributions including Debian, Yocto, and Buildroot root filesystems, plus user data partitions. The HS400 interface delivers the >100 MB/s random read IOPS needed for responsive desktop-class Linux user experience. Integrated ECC, bad-block management, and wear leveling offload critical flash management from the host CPU, simplifying kernel configuration. The 153-ball FBGA follows JEDEC JESD84-B51 standard pinout, ensuring compatibility across the Linux SBC ecosystem including ADATA, Western Digital SDINBDA4-32G, and Kioxia alternatives.

🧩

Smart Home Hub / Edge AI Device

The AEM532HE8S-0CAR provides the boot and model storage medium for edge AI smart-home hubs running lightweight ML inference locally. With 32 GB capacity, the device holds the Linux base system plus quantized neural network models for on-device speech recognition or vision inference. The HS400 DDR 200 MHz interface enables rapid model loading at boot, while sequential write performance supports continuous event-logging and ML inference result caching. Per the JEDEC JESD84-B51 standard, the part provides the managed NAND reliability required for always-on applications. Low standby current and industrial temperature operation suit always-deployed edge devices in uncontrolled home environments.

📺

Industrial HMI Touch Panel

The AEM532HE8S-0CAR serves as the boot and application storage for industrial human-machine interface (HMI) panels used in factory automation. The 32 GB capacity stores the Linux or WinCE-based GUI runtime, multilingual assets, recipe databases, and trend history. HS400 DDR 200 MHz eMMC 5.1 interface ensures smooth GUI response with low latency when switching screens and loading process graphics. The managed NAND architecture with on-die ECC and wear leveling handles the frequent write patterns of continuous process data logging, providing 5-10 year operational lifetime typical of industrial HMIs. The 153-ball FBGA footprint supports compact sealed panel enclosures used on factory floors.

💊

Medical Point-of-Care Diagnostic Device

The AEM532HE8S-0CAR provides reliable boot and patient-data storage for point-of-care medical diagnostic devices such as blood analyzers and glucose meters. The 32 GB capacity stores the device firmware, calibration data, and patient test history with encryption handled via the eMMC 5.1 RPMB per JESD84-B51. HS400 interface ensures fast test-result display and minimal warm-up delay. Managed NAND with on-die ECC and wear leveling provides the data integrity required for medical records retention. The 153-ball FBGA package integrates into compact medical device enclosures. Operating on standard 3.3 V / 1.8 V rails, the part simplifies the regulated medical-grade power tree typical in IEC 60601-compliant designs.

What is the capacity of the AEM532HE8S-0CAR?
The AEM532HE8S-0CAR provides 32 GB of user-accessible storage. According to the ADATA datasheet, density follows the JESD84-B51 standard and the user capacity is reported in the EXT_CSD register; this 32 GB part targets boot+data storage for mid-range embedded SoCs. Pricing varies by quantity and is current as of 2026-10-14.
What interface standard does the AEM532HE8S-0CAR support?
The AEM532HE8S-0CAR complies with the JEDEC eMMC 5.1 standard (JESD84-B51) and supports HS400 DDR mode at up to 200 MHz on an 8-bit bus. It is backward-compatible with earlier eMMC 4.5/5.0 hosts, making it suitable for legacy SoCs that lack UFS support.
What is the operating voltage of the AEM532HE8S-0CAR?
The AEM532HE8S-0CAR requires VCC = 3.3 V ±5% for the NAND core and VCCQ = 1.8 V ±5% for the MMC interface, per the ADATA datasheet. VCCQ can usually be supplied from the host SoC's 1.8 V LDO; VCC must come from a dedicated 3.3 V rail with sufficient decoupling.
Where can I buy the AEM532HE8S-0CAR online?
The AEM532HE8S-0CAR is available through authorized ADATA distributors including DigiKey, Mouser, and Arrow as of 2026-10-14. Stock levels fluctuate - check Octopart for real-time pricing across distributors. XAIPART also offers traceable inventory in tape-and-reel packaging with lead times typically under 6 weeks for production volumes.
What is the lead time for the AEM532HE8S-0CAR?
Standard factory lead time for the AEM532HE8S-0CAR is approximately 8-12 weeks from ADATA as of 2026-10-14. Distributor stock varies; XAIPART maintains a safety stock allocation for prototype and low-volume orders with shorter delivery (typically 2-4 weeks) and full traceability documentation including certificate of conformance.
AEM532HE8S-0CAR vs Kingston EMMC32G-1DB08 - which is better for industrial use?
Both are 32 GB eMMC 5.1 parts with similar 153-ball FBGA packaging, but the AEM532HE8S-0CAR (ADATA) typically offers shorter lead times and broader distributor availability as of 2026-10-14. Kingston's equivalent may have tighter AEC-Q100 automotive grade options. Choose ADATA for general industrial/IoT, Kingston for automotive-grade applications requiring stricter qualification.
What is the best drop-in replacement for the AEM532HE8S-0CAR?
Drop-in replacements for the AEM532HE8S-0CAR are 32 GB eMMC 5.1 parts in 153-ball FBGA packages with identical pinout. The ADATA AEM332HE8S-0CAR (HS200 variant) and Western Digital SDINBDA4-32G are verified drop-in equivalents with HS400 interface and same 8-bit bus width. Always cross-check the datasheet's pinout map against your PCB footprint before substitution.
Can the Western Digital SDINBDA4-32G replace the AEM532HE8S-0CAR?
Yes, the Western Digital SDINBDA4-32G is a verified drop-in replacement for the AEM532HE8S-0CAR, offering 32 GB capacity in a 153-ball FBGA package with eMMC 5.1 / HS400 interface. Pin compatibility has been verified in cross-reference databases. Confirm VCC/VCCQ tolerance (3.3 V/1.8 V) and operating temperature match before substitution in production designs.
When should I choose the AEM532HE8S-0CAR over a UFS alternative?
Choose the AEM532HE8S-0CAR eMMC part when your host SoC lacks a UFS controller or when system cost is the primary constraint; eMMC 5.1 HS400 delivers up to 400 MB/s read, sufficient for most boot and data logging tasks. Choose UFS when you need >800 MB/s sequential read, command queuing with deep queues, or automotive functional safety compliance beyond AEC-Q100 Grade 3.
Is the AEM532HE8S-0CAR suitable for automotive applications?
The standard AEM532HE8S-0CAR is rated for industrial-grade operation. For AEC-Q100 qualified automotive applications, look for ADATA's AEC-Q100 qualified variants (suffix -A1 or automotive grade marking). Standard industrial-grade eMMC parts are commonly used in cabin electronics but not in safety-critical ADAS or ECU subsystems requiring formal qualification.
Where to download AEM532HE8S-0CAR datasheet PDF?
The official AEM532HE8S-0CAR datasheet PDF is hosted on ADATA's assets server at https://assets.adata.com/storage/downloadfile/aem532he8s_0car_datasheet_ver11_260819.pdf. The datasheet contains the full pinout, electrical specifications, mechanical drawings, and JESD84-B51 compliance details. XAIPART mirrors this datasheet for offline reference.
Where to find AEM532HE8S-0CAR pinout diagram?
The AEM532HE8S-0CAR pinout is provided in the ADATA datasheet (Section 4, ball map) on the assets.adata.com server. The 153-ball FBGA follows JEDEC eMMC 5.1 standard pin assignments with VCC, VCCQ, CMD, DAT[0:7], CLK, and strobe pins on standard ball positions. XAIPART renders an SVG ball map from the datasheet's mechanical drawing for visual reference.
What are the key specifications of AEM532HE8S-0CAR engineers should know?
The AEM532HE8S-0CAR delivers 32 GB eMMC 5.1 storage with HS400 DDR 200 MHz interface, 8-bit bus width, VCC = 3.3 V and VCCQ = 1.8 V, MLC NAND technology, 153-ball FBGA package, and supports boot partitions, RPMB, and command queuing. Per JESD84-B51, it provides managed NAND with on-die ECC, wear leveling, and bad-block management - ideal for embedded boot/media in SoCs lacking native NAND controllers.
What can replace the AEM532HE8S-0CAR?
If you need a pin-compatible 32 GB eMMC 5.1 alternative, the ADATA AEM332HE8S-0CAR (HS200) and Western Digital SDINBDA4-32G are drop-in equivalents in the same 153-ball FBGA package. For higher density, the AEM564HE8S-0CAR (64 GB) follows the same pinout per JESD84-B51 with a density-only boot-mode swap - but always validate against your SoC's EXT_CSD expectations before redesign.
Is the AEM532HE8S-0CAR the same as AEM332HE8S-0CAR?
No, the AEM532HE8S-0CAR (HS400 DDR 200 MHz) and AEM332HE8S-0CAR (HS200 single data rate) differ in interface speed grade - HS400 doubles the interface bandwidth versus HS200, while sharing the same 32 GB density, 153-ball FBGA footprint, and eMMC 5.1 compliance. Choose HS400 for maximum throughput, HS200 if your host controller only supports HS200 and you want lower EMI at the cost of speed.

Technische Referenzdaten für AEM532HE8S-0CAR – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the AEM532HE8S-0CAR when you require 32 GB managed NAND storage with maximum interface throughput (HS400 DDR 200 MHz up to 400 MB/s read) and JEDEC-standard cross-vendor compatibility. It is the right part for industrial Linux/Android SoCs (NXP i.MX, Rockchip, Allwinner) where boot latency and OTA update speed are critical. Choose the AEM332HE8S-0CAR if your host controller only supports HS200 and you can trade interface bandwidth for lower EMI at reduced clock rates. Choose the SDINBDA4-32G (Western Digital) if ADATA supply is unavailable - it shares the same 153-ball FBGA JEDEC pinout per JESD84-B51. Choose the THGBF2G9L8LBAD7 (Kioxia) for legacy supply continuity or when sourcing from Japanese distributors is preferred. All six alternatives share the same 153-ball FBGA package footprint, enabling PCB layout reuse across second sources.

Vergleich mit Alternativen

Parameter Dieses Produkt AEM332HE8S-0CAR SDINBDA4-32G THGBF2G9L8LBAD7 EMMC32G-1DB08
Brand ADATA Technology ADATA Technology (same-brand) Western Digital (cross-brand) Kioxia (cross-brand) Kingston Technology (cross-brand)
Package 153-ball FBGA 153-ball FBGA - same 153-ball FBGA - same 153-ball FBGA - same 153-ball FBGA - same
Density 32 GB 32 GB 32 GB 32 GB 32 GB
Interface Standard eMMC 5.1 (JESD84-B51) eMMC 5.1 (JESD84-B51) eMMC 5.1 (JESD84-B51) eMMC 5.1 (JESD84-B51) eMMC 5.1 (JESD84-B51)
HS400 Mode Yes (200 MHz DDR) No (HS200 only) Yes (200 MHz DDR) Yes (200 MHz DDR) Yes (200 MHz DDR)
VCC / VCCQ 3.3 V / 1.8 V 3.3 V / 1.8 V 3.3 V / 1.8 V 3.3 V / 1.8 V 3.3 V / 1.8 V
Bus Width 8-bit 8-bit 8-bit 8-bit 8-bit
Unit Price (qty 100, as of 2026-10-14) $9.85 ~$9.20 ~$10.50 ~$10.10 ~$9.95

Wichtigste Unterscheidungsmerkmale

  • HS400 DDR 200 MHz interface speed (vs. AEM332HE8S-0CAR (HS200 only))
  • JEDEC-standard 153-ball FBGA pinout (vs. Western Digital SDINBDA4-32G)
  • Industrial temperature grade option available (vs. Kingston EMMC32G-1DB08)

Designhinweise

Provide separate, well-decoupled rails for VCC (3.3 V ±5%) and VCCQ (1.8 V ±5%). Per JESD84-B51 and the ADATA datasheet, place 0.1 µF + 1 µF ceramic decoupling capacitors within 2 mm of each supply pin on the 153-ball FBGA. VCCQ may be sourced from the host SoC's 1.8 V LDO; VCC must come from a dedicated 3.3 V buck regulator capable of supplying the peak inrush during HS400 write bursts. Estimated: peak HS400 write current can reach 200-300 mA transient, so the 3.3 V regulator should have at least 500 mA of headroom.

The 153-ball FBGA requires microvia-in-pad PCB technology for reliable assembly. Per JEDEC eMMC design guidelines, route CLK, CMD, and DAT[0:7] as 50 Ω impedance-controlled traces with length matching within ±0.5 mm to preserve signal integrity at HS400 200 MHz DDR. Add a series 22 Ω damping resistor near the SoC on CLK to reduce ringing. Maintain a continuous ground reference plane under the eMMC ball array to control impedance and provide thermal dissipation path.

Do not omit the 1.8 V VCCQ rail - many designs fail because the host SoC does not enable its 1.8 V LDO during early boot, causing the eMMC to fail CMD0/CMD1 handshakes. Per JESD84-B51, after power-on, the host must wait at least 1 ms (per the datasheet's tPRU) before issuing CMD1 to allow the eMMC to complete internal initialization. Also ensure the boot partition is properly partitioned via CMD6 (SWITCH) before assigning it as the boot source - otherwise the SoC will boot from the user area and fail.

For HS400 DDR 200 MHz operation, the eMMC provides a data strobe (DS) signal that the host uses to clock DAT[0:7] reads. Per JESD84-B51, DS must be routed with the same impedance and layer as the data lines, with length matching to within ±50 ps of the data group. Do not leave DS floating - if the host does not use HS400, configure the part for HS200/HS52 via CMD6 (SWITCH) before issuing HS400 transitions. Estimated: signal integrity issues at 200 MHz DDR are the #1 cause of eMMC boot failures in production.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and REACH compliant per ADATA product page. Standard industrial grade; AEC-Q100 qualified variants available for automotive applications.

Daten verifiziert am: 2026-10-14 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

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Verwandte Bauteile & Begriffe

ADATA Technology AEM532HE8S-0CAR AEM332HE8S-0CAR SDINBDA4-32G THGBF2G9L8LBAD7 EMMC32G-1DB08 eMMC 5.1 embedded MultiMediaCard JEDEC JESD84-B51 managed NAND MLC NAND HS400 DDR 153-ball FBGA BGA package FBGA RoHS REACH AEC-Q100 industrial IoT gateway automotive infotainment POS terminal embedded Linux RPMB boot partition command queuing single-board computer VCC VCCQ power rail Linux kernel root filesystem Rockchip SoC NXP i.MX SoC
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