EP1AGX20CF484I6N - 484-FBGA FPGA, 21.6K LE, Industrial | Intel
Teilenummer: EP1AGX20CF484I6N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $225 | $112.500,00 |
| 1.000 | $210 | $210.000,00 |
EP1AGX20CF484I6N Übersicht
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and block RAM. After fabrication, the device's internal look-up tables, routing, and I/O standards are configured by loading a user bitstream into on-chip SRAM. FPGAs occupy a position in the digital logic hierarchy between discrete glue logic and ASICs, providing ASIC-class performance with mask-set-free reprogrammability for prototyping, low-volume production, and applications requiring post-deployment logic updates.
Key features of the Arria GX family include dedicated multi-gigabit transceivers supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI at data rates up to 3.125 Gbps. The architecture combines these transceivers with on-chip TriMatrix memory, embedded DSP blocks for signal processing, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The -6 speed grade and industrial temperature range make the EP1AGX20CF484I6N particularly suited for harsh-environment systems.
Designers typically use this device in serial-interface bridge cards, telecom line cards, video processing pipelines, and industrial imaging where a balance of logic capacity, transceiver count, and cost matters more than the very highest transceiver throughput. The 230 user I/Os provide ample parallel interfacing for memory buses, control signals, and external PHY connectivity alongside the serial links. JTAG (IEEE 1149.1) configuration and on-chip Active Serial configuration support simplify board-level bring-up.
When designing with the EP1AGX20CF484I6N, observe Altera's recommended decoupling guidelines, maintain continuous reference planes for each transceiver power rail, and follow the PCB footprint and thermal recommendations in the FBGA layout guide. Quartus II software (version 13.0 or later with the Arria GX device support installed) is the supported design environment.
This page combines distributor pricing, drop-in alternatives drawn from the same Arria GX family, and practical engineering notes not aggregated in the Altera datasheet itself.
Drop-in-Alternativen für EP1AGX20CF484I6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1AGX20CF484I6N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Transceivers, Operating Temperature, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1AGX20CF484I6
✅ Drop-In✓ Auf Lager
$108 / Stück
Datenblatt ansehen →EP1AGX20CF484C7N
✅ Drop-In✓ Auf Lager
$95 / Stück
Datenblatt ansehen →EP1AGX20CF484C6N
✅ Drop-In✓ Auf Lager
$110 / Stück
Datenblatt ansehen →EP1AGX20CF484C7
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1AGX20CF484C6
✅ Drop-In✓ Auf Lager
$153.72 / Stück
Datenblatt ansehen →EP1AGX20CF484C3
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1AGX20CF484I6N Grenzwerte & elektrische Eigenschaften
| Family | Arria GX |
| Process Technology | 90 nm |
| Logic Elements | 21,580 |
| LABs / CLBs | 1,079 |
| Total RAM Bits | 1,229,184 |
| User I/O Count | 230 |
| I/O Supply Voltage | 2.5 V / 3.3 V |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Betriebs-Sperrschichttemperatur | -40C to +100C (Industrial) |
| Speed Grade | -6 |
| Gehäuse | 484-pin FC-FBGA (23x23 mm) |
| Montageart | Surface Mount |
| Configuration Method | JTAG, Active Serial |
| RoHS-Status | Compliant |
EP1AGX20CF484I6N 484-pin fc-fbga (23x23 mm) Pinbelegungsleitfaden
Pinbelegung für EP1AGX20CF484I6N (484-pin fc-fbga (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1AGX20CF484I6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1AGX20CF484I6N ist geeignet für 6 Anwendungs: PCI Express Endpoint Card, Telecom Line Card Interface, Video Processing Pipeline, Industrial Imaging System, Serial Bridge / Protocol Converter, Military / Aerospace Communication.
PCI Express Endpoint Card
The EP1AGX20CF484I6N's dedicated multi-gigabit transceivers support data rates up to 3.125 Gbps, which is sufficient for PCI Express Gen1 (2.5 Gbps) and Gen2 with oversampling. Its 21,580 logic elements and 1,229,184 bits of embedded RAM are more than adequate for typical endpoint designs including transaction layer, data link layer, and user-application logic. The 230 user I/Os in the 484-FBGA package provide ample parallel connectivity for memory buses, board control signals, and external PHY interfacing. The I6N industrial temperature rating ensures reliability in server-room and edge-computing environments. Quartus II IP cores for PCIe hard IP simplify integration.
Empfohlen
Telecom Line Card Interface
Telecom line cards require reliable serial-interface bridging across backplanes and to external networks. The EP1AGX20CF484I6N supports standard telecom protocols including Gigabit Ethernet, Serial RapidIO, and XAUI through its multi-gigabit transceivers. With 21,580 logic elements available, designers can implement packet processing, framing, and link-layer functions alongside the PHY interface. The industrial temperature range (-40C to +100C junction) suits outdoor cabinet and central-office deployments. The 484-FBGA package with 230 user I/Os accommodates TDM bus, memory, and management interface connectivity typical of line-card designs.
Empfohlen
Video Processing Pipeline
Broadcast and professional video systems benefit from the EP1AGX20CF484I6N's combination of DSP blocks, embedded RAM, and high-speed transceivers. SDI (Serial Digital Interface) at 270 Mbps, HD-SDI at 1.485 Gbps, and 3G-SDI at 2.97 Gbps all fall well within the device's 3.125 Gbps transceiver capability. The 1,229,184 bits of block RAM enable line-buffer and frame-buffer implementation for real-time video processing. The 230 user I/Os support parallel video buses (BT.656, BT.1120) and external memory interfaces. The I6N industrial temperature grade suits broadcast-equipment rack environments.
Empfohlen
Industrial Imaging System
Machine-vision and industrial imaging systems require deterministic, low-latency processing of high-bandwidth sensor data. The EP1AGX20CF484I6N's transceivers can interface with CoaXPress, Camera Link, or proprietary high-speed serial sensor protocols at rates up to 3.125 Gbps per lane. Its 21,580 logic elements support real-time image processing pipelines including filtering, color-space conversion, and feature extraction. The industrial temperature grade (-40C to +100C junction) is critical for factory-floor and outdoor installations. The 484-FBGA package's 230 user I/Os accommodate multiple parallel sensor interfaces, GPIO, and host connectivity.
Empfohlen
Serial Bridge / Protocol Converter
Protocol-conversion bridges between serial standards are a common Arria GX use case. The EP1AGX20CF484I6N's multiple multi-gigabit transceivers allow simultaneous support of multiple protocols: converting XAUI to Serial RapidIO, PCIe to Ethernet, or custom serial formats to parallel bus interfaces. With 21,580 logic elements and dedicated block RAM, the device can buffer and reframe data across protocols while maintaining line-rate throughput. The industrial temperature rating suits outdoor telecom and industrial-automation deployments. Quartus II provides IP cores for most common serial protocols, accelerating development.
Empfohlen
Military / Aerospace Communication
Ruggedized communication systems for defense and aerospace applications leverage the EP1AGX20CF484I6N's industrial temperature range (-40C to +100C junction) and radiation-tolerant Arria GX architecture. The device's transceivers support secure serial links, while its logic capacity enables encryption, error correction, and protocol handling. The 484-FBGA package provides the mechanical robustness required for vibration-prone environments. Note that for true space-grade applications, specific radiation-hardened variants or additional lot screening may be required; consult Intel/Altera aerospace documentation for flight-grade qualification status.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1AGX20CF484I6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1AGX20CF484I6 | EP1AGX20CF484C7N | EP1AGX20CF484C6N | EP1AGX20CF484C7 | EP1AGX20CF484C6 | EP1AGX20CF484C3 |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 |
| Total RAM (bits) | 1,229,184 | 1,229,184 | 1,229,184 | 1,229,184 | 1,229,184 | 1,229,184 | 1,229,184 |
| User I/O | 230 | 230 | 230 | 230 | 230 | 230 | 230 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -6 | -6 | -7 | -6 | -7 | -6 | -3 |
| Lead Finish | Pb-free (N suffix) | Pb (non-N) | Pb-free (N suffix) | Pb-free (N suffix) | Pb (non-N) | Pb (non-N) | Pb (non-N) |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature rating for harsh environments (vs. EP1AGX20CF484C7N)
- RoHS-compliant lead finish (Pb-free) (vs. EP1AGX20CF484I6)
- -6 speed grade balance of performance and cost (vs. EP1AGX20CF484C7N)
Designhinweise
The EP1AGX20CF484I6N requires a 1.15 V to 1.25 V core supply and 2.5 V/3.3 V I/O rails, plus dedicated analog PLL and transceiver TX/RX supplies that must be filtered separately per the Arria GX datasheet. Each power pin requires a local bulk capacitor (10-22 uF) plus 0.1 uF and 1 nF high-frequency ceramics placed within 0.5 inches of the pin. Estimated core current draw under typical utilization is 0.5-2 A depending on clock rate and logic activity; use a voltage regulator with at least 20% margin. Power sequencing must follow the Altera-recommended order to prevent latch-up.
The 484-FBGA package dissipates significant power through the bottom balls. Implement thermal vias in the PCB land pattern directly beneath the BGA, connecting to inner ground planes for heat spreading. For applications exceeding 3-5 W total power dissipation, attach a heatsink with thermal interface material. Maximum junction temperature is 100C for the industrial-grade device; derate power budget to maintain margin. Estimate: at 3 W dissipation and theta_JA of approximately 15 C/W (with proper thermal design), junction temperature rise is 45C above ambient.
Route high-speed transceiver traces with controlled-impedance differential pairs (typically 100 ohm or 85 ohm differential). Maintain continuous reference planes under all transceiver traces; avoid routing across plane splits. Match trace lengths within the tolerance specified by the protocol (PCIe requires 5 mil, XAUI requires 25 mil). Place AC-coupling capacitors as close to the transmitter as possible. The 484-FBGA fanout requires at least 4 PCB routing layers with microvia technology for breakout; plan stackup accordingly.
Multi-gigabit transceiver signals require careful signal-integrity analysis. Use IBIS or HSPICE models from Altera for channel simulation before PCB fabrication. Maintain 100 ohm differential impedance for transceiver lanes; use series capacitors for AC coupling (typically 100 nF). Clock signals should be routed with controlled impedance and matched lengths. Apply source termination on high-speed outputs if recommended by the protocol specification. Perform pre-layout and post-layout simulations to validate signal integrity at the target data rate.
Do not exceed the maximum I/O count of 230 user pins when assigning signals; the remaining pins are dedicated power, ground, JTAG, configuration, or transceiver. Ensure proper configuration mode is selected (Active Serial vs JTAG) via MSEL pins before power-up. Do not omit the decoupling capacitors specified in the datasheet, even if your design appears to function without them in the lab. The N suffix indicates Pb-free/RoHS-compliant lead finish; non-N variants may be non-compliant for some regions. Always check temperature grade (I vs C suffix) matches your application's environment.
Compliance-Informationen
RoHS compliant per N suffix designation. Not AEC-Q100 qualified (not an automotive-grade part). Industrial temperature grade (-40C to +100C junction) suitable for harsh environments but not automotive.
