EP1AGX20CF484C6 - Arria GX FPGA, 20K LEs, 484-FBGA | Intel
MPN: EP1AGX20CF484C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $219.6 | $219.60 |
| 10 | $197.64 | $1,976.40 |
| 100 | $175.68 | $17,568.00 |
| 250 | $162.5 | $40,625.00 |
| 500 | $153.72 | $76,860.00 |
Drop-in alternatives for EP1AGX20CF484C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX35CF484C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$295 / Unit
View Datasheet →EP1AGX50CF484C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$189.5 / Unit
View Datasheet →EP1AGX20CF484C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$110 / Unit
View Datasheet →EP1AGX20CF484C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP1AGX20CF484I6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$108 / Unit
View Datasheet →EP1AGX20CF484C6 Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements (LEs) | 20,000 (approx.) |
| Number of CLBs / LABs | 21,580 / 1079 |
| Total Memory Bits | 1,229,184 bits |
| Maximum User I/O | 230 |
| Package | 484-FBGA (Fine-Pitch Ball Grid Array) |
| Package Dimensions | 23 x 23 mm, 1.0 mm ball pitch |
| Internal Fabric Frequency (max) | 640 MHz |
| Speed Grade | C6 (commercial temperature range) |
| Process Technology | 90 nm |
| Supply Voltage (core, typical) | 1.2 V (refer to datasheet) |
| Transceivers | Integrated multi-gigabit SerDes blocks |
| PLLs | Yes (on-chip, refer to datasheet for count) |
| Embedded Memory Blocks | M512, M4K, M-RAM |
| DSP / Multiplier Blocks | Hardware multipliers (refer to datasheet) |
| Configuration Method | External flash / Quartus II |
| Mounting Type | Surface Mount |
| RoHS Status | Lead-Free (per datasheets.com listing) |
EP1AGX20CF484C6 23 x 23 mm, 1.0 mm ball pitch Pin Configuration Guide
Complete pinout information for EP1AGX20CF484C6 (23 x 23 mm, 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX20CF484C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX20CF484C6 is suitable for 6 applications: Telecommunications Line Cards, Video Broadcast Equipment, Medical Imaging Systems, Industrial High-Speed Serial Links, ASIC Prototyping and Verification, Aerospace Data Acquisition and Signal Processing.
Telecommunications Line Cards
The EP1AGX20CF484C6 fits telecom line-card designs that require mid-range logic density combined with multi-gigabit transceivers. The device's integrated SerDes blocks support protocols such as PCI Express Gen1, Serial RapidIO, and XAUI at up to 3.125 Gbps per lane, eliminating the need for external PHY chips and reducing BOM cost. With approximately 20,000 LEs, 1,229,184 bits of embedded memory, and on-chip PLLs, the FPGA can implement custom packet-processing pipelines, framing logic, and link-layer state machines in a single chip. The 484-FBGA package and commercial speed grade make it suitable for temperature-controlled central-office environments.
Recommended
Video Broadcast Equipment
Broadcast video routers, format converters, and signal processors benefit from the EP1AGX20CF484C6's combination of parallel logic fabric and high-speed serial links. The FPGA can implement SDI (Serial Digital Interface) embedding, de-embedding, and routing alongside multi-gigabit transceiver channels for uncompressed HD-SDI or 3G-SDI transport over fiber. The 230 user I/O pins provide ample connectivity for parallel video bus interfaces, and the 1,229,184 bits of embedded memory buffer active video lines without external SRAM. The 640 MHz fabric frequency is sufficient for real-time pixel processing at common broadcast resolutions.
Recommended
Medical Imaging Systems
Medical imaging equipment such as ultrasound front-ends and MRI receiver chains leverage the EP1AGX20CF484C6 for parallel DSP and high-speed data acquisition. The embedded multiplier blocks (DSP slices) accelerate FIR filters and FFT operations used in beamforming and image reconstruction. Transceivers digitize data from analog front-ends and stream it to host processors over PCIe or Serial RapidIO links. The 20,000-LE capacity supports multiple processing channels in parallel, while the commercial temperature range suits controlled clinical environments. Designers must validate electromagnetic compatibility and reliability per IEC 60601 for end-system certification.
Recommended
Industrial High-Speed Serial Links
Industrial automation systems requiring deterministic, low-latency communication use the EP1AGX20CF484C6 as a protocol bridge between sensor networks and backplane fabrics. The integrated transceivers enable SerDes connectivity for EtherCAT, Profinet IRT, and Serial RapidIO, while the logic fabric implements real-time control loops and safety interlocks. The 230 user I/O accommodate parallel GPIO for legacy industrial sensors and actuators. Industrial temperature variants of the same family (e.g., EP1AGX20CF484I6) extend operation to -40C to +100C for factory-floor environments.
Recommended
ASIC Prototyping and Verification
Hardware engineers prototyping and verifying ASIC designs use the EP1AGX20CF484C6 as a flexible emulation target. With approximately 20,000 LEs, the device can map small-to-medium ASIC blocks for real-time validation at near-ASIC speed. The 1,229,184 bits of embedded memory model register files and FIFOs, while transceivers emulate high-speed I/O for SoC interfaces. Quartus II supports incremental compilation, allowing multiple engineers to develop partitions in parallel. The commercial temperature grade is acceptable for lab benchtop verification.
Recommended
Aerospace Data Acquisition and Signal Processing
The EP1AGX20CF484C6 supports aerospace applications such as flight data acquisition, navigation aids, and avionics signal processing where moderate logic density and high-speed serial links are required. Its integrated transceivers accept data from inertial measurement units (IMUs), GPS receivers, and radar front-ends, while the logic fabric performs real-time filtering and packetization. Engineers building DO-254-compliant systems should pair this device with appropriate verification, traceability, and configuration management processes. The 484-FBGA package supports the form-factor constraints of line-replaceable modules.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX20CF484C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX35CF484C6 | EP1AGX50CF484C6 | EP1AGX20CF484C6N | EP1AGX20CF484C7 | EP1AGX20CF484I6 | EP1SGX40DF1020C6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 1020-FBGA - NOT pin-compatible |
| Family | Arria GX | Arria GX | Arria GX | Arria GX | Arria GX | Arria GX | Stratix GX |
| Logic Elements (approx.) | 20,000 | 35,000 (+75%) | 50,000 (+150%) | 20,000 (same) | 20,000 (same) | 20,000 (same) | 40,000 (+100%) |
| Number of LABs | 1,079 | [DATA_NEEDED] | [DATA_NEEDED] | 1,079 (same) | 1,079 (same) | 1,079 (same) | [DATA_NEEDED] |
| Total Memory Bits | 1,229,184 | Higher | Higher | 1,229,184 (same) | 1,229,184 (same) | 1,229,184 (same) | [DATA_NEEDED] |
| Max User I/O | 230 | 230 (same) | 230 (same) | 230 (same) | 230 (same) | 230 (same) | Higher (different package) |
| Speed Grade | C6 (commercial) | C6 (same) | C6 (same) | C6 (same) | C7 (faster) | I6 (industrial temp) | C6 (different family) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active (Stratix GX) |
| Approx. Unit Price (USD) | $219.60 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Only Arria GX member offered with industrial temperature in the same 484-FBGA footprint (vs EP1AGX20CF484C6 vs EP1AGX20CF484I6)
- Arria GX integrates multi-gigabit SerDes without external PHY (vs EP1AGX20CF484C6 vs Cyclone III (non-GX))
- Same die across speed grades and ordering codes (vs EP1AGX20CF484C6 vs EP1AGX20CF484C6N)
Design Notes
The 484-FBGA package relies on the PCB as the primary heat dissipation path. Estimated: with 90 nm Arria GX typical core power of 1.5-2 W and transceiver activity adding another 1-3 W, the device may dissipate 3-5 W total in a typical SerDes-active application. Designers must provide sufficient copper pour area beneath the BGA and thermal vias to the inner ground planes to keep junction temperature within the commercial range (0C to +85C ambient for C6 grade). Refer to the Altera Arria GX Thermal Management application note for case-to-ambient thermal resistance curves.
The 1.0 mm pitch FBGA-484 requires careful PCB escape routing and stackup planning. Use microvia (HDI) technology for inner-row fan-out if signal integrity demands matched-length routing to the transceivers. Power planes for VCCINT (core 1.2 V typical), VCCPD (pre-drive 3.3 V), and the separate VCCA_PLL / VCCA_TX analog supplies must be decoupled with bulk, mid-range, and high-frequency capacitors placed as close as possible to the BGA balls. The transceiver analog supplies require filtering to isolate PLL and TX/RX buffer switching noise from sensitive analog references.
Three common pitfalls when designing with the EP1AGX20CF484C6: (1) failing to configure MSEL pins for the correct configuration mode (AS, AP, PS, JTAG) per the device handbook, (2) overlooking the requirement for separate analog and digital ground return paths in the transceiver area which can corrupt high-speed eye diagrams, and (3) using non-LE-compliant I/O standards on shared banks which forces voltage conflict and prevents Quartus II compilation. Engineers should always run the Quartus II Pin Planner early in the design cycle to validate bank assignments before schematic capture.
The integrated multi-gigabit transceivers require high-quality reference clocks with low phase noise to meet protocol compliance masks (PCIe, XAUI, Serial RapidIO). Place the reference clock oscillator as close to the REFCLK pins as possible, route with controlled impedance and length-matched differential pairs, and isolate the clock supply from noisy digital rails. Eye diagram performance degrades sharply if reference clock jitter exceeds the budget documented in the Arria GX device handbook transceiver specifications section.
Recommended: Place the JTAG header and configuration flash on the same side of the board as the FPGA, near the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL, DATA[7:0]). This minimizes stub length on configuration signals and supports fast in-system reconfiguration. Reserve a JTAG chain that includes any background debug mode (BDM) or trace pins from companion processors to enable boundary-scan testing during board bring-up.
Compliance Information
RoHS lead-free status per datasheets.com listing ("LEAD FREE" descriptor). REACH, halogen-free, and conflict-minerals compliance data not found in verified web data.
