EP1C20F400C8N - Cyclone FPGA, 20K LE, 301 I/O | Intel
Teilenummer: EP1C20F400C8N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $81.73 | $81,73 |
| 10 | $77.64 | $776,40 |
| 100 | $73.55 | $7.355,00 |
| 500 | $67.88 | $33.940,00 |
| 1.000 | $62.5 | $62.500,00 |
EP1C20F400C8N Übersicht
What is an FPGA? A field-programmable gate array is an integrated circuit whose logic fabric, routing, and I/O behavior can be configured after manufacturing by loading a bitstream. FPGAs sit between fixed-function ASICs and generic processors: they provide parallel, deterministic custom hardware while allowing design changes without mask re-spin. In the silicon hierarchy, FPGAs are complex digital ICs supported by power supplies, clock oscillators, configuration memories, and level translators. The Cyclone family was Altera's low-cost FPGA line, and EP1C20 is one of its mid-capacity devices, intended for cost-sensitive applications that still need parallel I/O processing.
The main design assets are its logic and I/O count. The 20,060 logic elements implement combinational and sequential logic with embedded registers, while the 294,912 RAM bits can be used as FIFOs, small buffers, or register files. The 301 user I/O pins across the 400-ball FBGA allow board designers to attach many peripherals directly to the FPGA, reducing glue logic. As a commercial-speed-grade-8 product, it balances price and timing for designs that do not require the fastest speed sorting.
From an architectural standpoint, this Cyclone FPGA is SRAM-based, so an external configuration source must reload the bitstream at every power-up. The BGA package permits dense connectivity but requires a multi-layer PCB and proper decoupling. The C8N variant with N finish is intended for lead-free solder processes, aligning with modern assembly houses. Designers should use the manufacturer's pin planning and power estimator tools before layout.
Typical uses include industrial control logic, video and image capture front ends, communication protocol bridging, ASIC prototyping, and distributed I/O controllers. For designs that fit inside 20,060 logic elements, this device can replace many fixed-function PLDs or CPLDs while offering a reprogrammable pin assignment and parallel datapath.
During board design, budget for an external configuration source and use the FPGA vendor's power and pin planning tools to align I/O bank voltage assignments before layout. Because this is a mature component, use existing reference designs for the configuration interface and verify the exact OPN before purchasing.
This page synthesizes verified distributor specifications, drop-in Cyclone-family alternatives, package and grade trade-offs, and practical design guidance not repeated in every supplier listing. It is intended to help engineers make a sourcing decision quickly and accurately for the EP1C20F400C8N.
Drop-in-Alternativen für EP1C20F400C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1C20F400C8N (gleiche Bauform und Footprint) – abweichend in Process Technology, Speed Grade, Package, PLLs, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1C20F400C7N
✅ Drop-In✓ Auf Lager
$65.8 / Stück
Datenblatt ansehen →EP1C20F400C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$53.1 / Stück
Datenblatt ansehen →EP1C20F400I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$76.9 / Stück
Datenblatt ansehen →EP1C20F400C8
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$17.2 / Stück
Datenblatt ansehen →EP1C20F400C6
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$18.95 / Stück
Datenblatt ansehen →EP1C20F400C8N Grenzwerte & elektrische Eigenschaften
| Product Type | FPGA - Field Programmable Gate Array |
| Family | Cyclone |
| Series | Cyclone I |
| Number of Logic Elements | 20060 |
| Total RAM Bits | 294912 |
| Number of User I/O | 301 |
| Gehäuse / Bauform | FBGA-400 (400-BGA) |
| Anzahl der Pins | 400 |
| Montageart | Surface Mount |
| Temperature Grade | Commercial (C) |
| Betriebstemperaturbereich | 0 °C to +85 °C (grade C) |
| Speed Grade | -8 (C8) |
| RoHS / Lead-Free Finish | Lead-free (N suffix) - RoHS status not independently confirmed in fetched data |
EP1C20F400C8N fbga-400 (400-bga) Pinbelegungsleitfaden
Pinbelegung für EP1C20F400C8N (fbga-400 (400-bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1C20F400C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1C20F400C8N ist geeignet für 6 Anwendungs: ASIC and SoC Prototyping, Industrial Motor Control, Video and Image Capture Front End, Communication Protocol Bridge, Test and Measurement Custom Logic, Distributed PLC and I/O Controller.
ASIC and SoC Prototyping
The EP1C20F400C8N provides enough logic capacity to prototype a small microcontroller, state-machine-heavy peripheral, or packet-processing block before ASIC conversion. Its 20,060 logic elements implement combinational and sequential logic, and its 294,912 RAM bits supply small FIFOs, register files, and test buffers. The 301 user I/O lines connect to external SRAM, ADCs, DACs, host processor buses, and test headers. In a prototyping setup, place the FPGA on a reusable carrier board with a serial configuration flash such as EPCS4SI8N or EPCS16SI8N, because the SRAM-based device must reload its configuration at every power-up. Although speed grade 8 is not the fastest option, it is sufficient for many prototype clock rates while keeping device cost lower. Using the same FBGA-400 footprint also makes it easy to exchange speed-grade variants during timing exploration.
Empfohlen
Industrial Motor Control
FPGAs are suitable for industrial motor-control boards because logic functions such as PWM generation, quadrature encoder counting, current-loop state machines, and safety interlocks can run in parallel rather than in software. The EP1C20F400C8N's 20,060 logic elements can implement several axis channels simultaneously, while the 301 user I/O pins allow connection to encoder inputs, phase-current ADC interfaces, and power-stage gate-driver signals. The 294,912 RAM bits can store trajectory profiles and commutation lookup tables. In 0 °C to +85 °C commercial cabinets this C8N variant is usable; for -40 °C installations, choose an industrial I-grade version. Designers should isolate the FPGA side from high-voltage power circuitry with optocouplers or gate-driver ICs and avoid routing noisy high-voltage signals back under the BGA keepout area.
Empfohlen
Video and Image Capture Front End
The EP1C20F400C8N can act as a video and image capture front end by connecting a parallel CMOS or CCD sensor to downstream processing logic. The 301 user I/O pins provide enough lanes for parallel pixel data, synchronization signals, and camera-control interfaces. The 20,060 logic elements implement line start and frame start detection, pixel reformatting, exposure counters, and small interpolation or correction blocks. The 294,912 RAM bits can implement line buffers or small FIFOs between the image sensor clock domain and the processing clock domain. For typical VGA-class pixel rates, speed grade 8 is generally workable; higher-resolution or high-throughput pipelines should be verified in the vendor's timing tool. This FPGA is not the best fit for modern high-speed MIPI camera interfaces unless an external PHY and deserializer are placed ahead of it.
Empfohlen
Communication Protocol Bridge
When a system must translate between parallel busses, UARTs, SPI, I2C, or simple packet interfaces, an FPGA gives deterministic and simultaneous bridging. The EP1C20F400C8N's 301 user I/O pins support many serial ports and parallel buses on one device, reducing the need for external protocol-converter chips. The 20,060 logic elements implement baud-rate generators, packet state machines, CRC checks, and bus arbitration logic. The 294,912 RAM bits are ideal for dual-clock FIFOs between asynchronous communication domains, preventing data loss during rate mismatch. A typical use is a data concentrator that gathers several low-speed asynchronous streams and forwards them over a single higher-speed parallel or LVDS interface. Because the device is commercial-temperature rated, indoor communication equipment is the natural environment; extended temperature industrial networking should use an I-grade variant.
Empfohlen
Test and Measurement Custom Logic
In custom test equipment, an FPGA can perform parallel monitoring, triggering, and acquisition without loading a host processor. The EP1C20F400C8N's 301 user I/O lines connect directly to logic probes, digital buses, comparator outputs, or custom interface headers. On-chip, the 20,060 logic elements can implement trigger patterns, event counters, sequencers, and data-packing logic. The 294,912 RAM bits serve as acquisition FIFO or temporary trace memory, allowing bursts of captured data to be staged before transfer to a controller. This device is practical for logic analyzers, sensor emulators, board test fixtures, and low-cost instrument front ends. Designers should provide clear clock distribution and termination for external high-speed signals, and they should account for the latency and fan-out of internal routing when designing trigger paths.
Empfohlen
Distributed PLC and I/O Controller
PLCs and remote I/O controllers often need many parallel input/output channels to read sensors, drive relays, and communicate with a field bus. The EP1C20F400C8N supports this because its 301 user I/O pins can provide a high channel count with custom readback logic. The 20,060 logic elements implement debounce filters, latching logic, watchdog timers, heartbeat monitors, and protocol state machines for interfaces such as Modbus-like serial links. The 294,912 RAM bits store small mapping tables and diagnostic logs. Because this part is commercial-temperature range and speed grade 8, it suits indoor control panels rather than extreme outdoor installations. For plant-floor reliability, add isolation between the FPGA pins and field wiring, include ESD protection on connector-facing lines, and select an industrial-grade Cyclone part when ambient temperature exceeds the commercial limit.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1C20F400C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1C20F400C7N | EP1C20F400C6N | EP1C20F400I7N | EP1C20F400C8 | EP1C20F400C6 |
|---|---|---|---|---|---|---|
| Package | FBGA-400 | FBGA-400 | FBGA-400 | FBGA-400 | FBGA-400 | FBGA-400 |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 20060 | 20060 | 20060 | 20060 | 20060 | 20060 |
| Total RAM Bits | 294912 | 294912 | 294912 | 294912 | 294912 | 294912 |
| User I/O Count | 301 | 301 | 301 | 301 | 301 | 301 |
| Speed Grade | -8 (C8N) | -7 | -6 | -7 | -8 | -6 |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) | Commercial (C) |
| Lead-Free Finish (N suffix) | Yes | Yes | Yes | Yes | No | No |
Wichtigste Unterscheidungsmerkmale
- Lead-free N finish for modern assembly lines (vs. EP1C20F400C8)
- Commercial temperature grade with known FBGA-400 availability (vs. EP1C20F400I7N)
- Entry-level speed grade for cost and timing margin trade-off (vs. EP1C20F400C6N)
Designhinweise
Estimated: power dissipation for the EP1C20F400C8N depends heavily on logic utilization, clock frequency, I/O loading, and the exact core and I/O voltages, which were not provided in the verified web data. Use Intel/Altera's power estimator with the actual RTL and pin assignments to size a DC-DC converter. Place a low-ESR 0.1 uF ceramic capacitor near each VC C/GND ball pair on the BGA, and bulk capacitors on the board power plane. Avoid routing all high-current vias through one narrow plane area; distribute them under the FBGA-400 thermal and power land area.
The 400-ball FBGA requires multilayer PCB fanout: use a pin/ball map from the Intel/Altera package file rather than assuming an array orientation. Follow the manufacturer's recommended solder-mask-defined pad size and ball pitch in the PCB footprint. Unused or no-connect balls must remain unconnected or be handled according to the datasheet. Place high-speed I/O series resistors close to the FPGA output pins. Use an unbroken ground plane beneath the BGA and provide at least one dedicated via per GND ball in the fanout design.
Cyclone FPGAs are SRAM-based, so a design that omits the configuration flash or JTAG programming header will appear blank at every power-up. Include EPCS4SI8N or EPCS16SI8N and verify the MSEL configuration pins are set for the expected configuration scheme. Also verify whether the final assembly process is lead-free or leaded: C8N has an N lead-free finish, while C8 is a non-N/SnPb option. Mixing the wrong solder finish on a board can cause reliability problems, so select the OPN after confirming the assembly profile.
Compliance-Informationen
The N suffix in EP1C20F400C8N is the Intel/Altera lead-free finish indicator. RoHS, REACH, halogen-free, and conflict-minerals status were not explicitly contained in the fetched web data and therefore remain unknown.
