EP1C4F400C6N - Cyclone FPGA 4K LEs 400-BGA | Intel
Teilenummer: EP1C4F400C6N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $40.8 | $40,80 |
| 10 | $38.5 | $385,00 |
| 100 | $34.2 | $3.420,00 |
| 500 | $29.9 | $14.950,00 |
| 1.000 | $26.4 | $26.400,00 |
EP1C4F400C6N Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, routing, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the factory. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) and PALs (Programmable Array Logic). FPGAs typically offer far higher logic density, embedded block RAM, multipliers/DSP blocks, and high-speed transceivers, making them the device of choice when a microcontroller is too slow, an ASIC is too expensive, and a CPLD lacks capacity. The Cyclone family is positioned as Intel's (formerly Altera's) low-cost, low-power FPGA line.
The EP1C4F400C6N integrates 4,000 LEs, 78,336 bits of embedded RAM (M4K blocks of 4 Kbits each), a PLL block for clock management, 301 user I/Os, and supports single-ended I/O standards such as LVTTL, LVCMOS, SSTL, and differential standards such as LVDS. The C6 speed grade places it in the middle of the Cyclone speed binning; faster C7/C8 grades and an industrial I6/I7 variant are also offered. The device is configured via a serial configuration device (EPCS) or through JTAG, and uses SRAM cells so it must be reconfigured at every power-up.
Typical applications include digital video processing bridges, industrial control and motor drive glue logic, low-cost prototyping platforms, telecommunications line-card interface logic, and embedded display controllers. The combination of 301 I/Os and 400-ball BGA allows dense board integration with many parallel external buses.
When designing with this device, plan for configuration memory (a serial EPCS flash or microcontroller) and provide proper decoupling on every VCCINT/VCCIO rail. The 400-ball BGA requires X-ray or careful reflow inspection, so PCB fabrication and assembly cost should be weighed against the benefit of high I/O count. Engineers migrating from older Cyclone designs should consult the Quartus II pin migration tables to swap C6/I6/C7/C8 speed grades within the same package.
This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical design notes that are not collected in any single manufacturer datasheet.
Drop-in-Alternativen für EP1C4F400C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1C4F400C6N (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Process Technology, Family, Total RAM Bits.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1C4F400C6
✅ Drop-In✓ Auf Lager
$21.6 / Stück
Datenblatt ansehen →EP1C4F400C8N
✅ Drop-In✓ Auf Lager
$15.26 / Stück
Datenblatt ansehen →EP1C4F400C7N
✅ Drop-In✓ Auf Lager
$28.9 / Stück
Datenblatt ansehen →EP1C4F400I7N
✅ Drop-In✓ Auf Lager
$26.75 / Stück
Datenblatt ansehen →EP1C4F400I6
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1C4F400C6N Grenzwerte & elektrische Eigenschaften
| Manufacturer | Intel (formerly Altera) |
| Series | Cyclone (Cyclone I) |
| Logic Elements (LEs) | 4,000 |
| Total RAM Bits | 78,336 |
| Embedded RAM Blocks | M4K (4 Kbits each) |
| User I/Os | 301 |
| PLL | 2 PLLs |
| Package Type | 400-ball FineLine BGA |
| Package Code (JEDEC) | F400 / FBGA-400 |
| Process Technology | 0.13 µm SRAM CMOS |
| Configuration Method | SRAM (serial EPCS or JTAG) |
| Speed Grade | C6 (commercial) |
| Operating Temperature (commercial C grade) | 0 °C to +85 °C |
| Supply Voltage VCCINT | 1.5 V |
| Supply Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Montageart | Surface Mount (BGA) |
| MSL (Moisture Sensitivity) | MSL3 |
| RoHS-Status | Compliant (per Altera/Intel product page) |
| Lead-Free | Yes |
EP1C4F400C6N f400 / fbga-400 Pinbelegungsleitfaden
Pinbelegung für EP1C4F400C6N (f400 / fbga-400-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1C4F400C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1C4F400C6N ist geeignet für 6 Anwendungs: Digital Video Processing Bridge, Industrial Motor Control Glue Logic, Telecommunications Line-Card Interface, Low-Cost Prototyping Platform, Embedded Display Controller, Test and Measurement Front-End.
Digital Video Processing Bridge
The EP1C4F400C6N is well suited as a video-format bridge in mid-volume video products. Its 301 user I/Os comfortably accommodate 24- or 30-bit RGB buses plus HSYNC/VSYNC/DE and a 16-bit control bus, while the 4,000 LEs run line buffers, color-space converters, and deinterlacers in real time. The 78,336 bits of embedded M4K RAM hold 4-8 scan lines of buffering, and the C6 speed grade is sufficient for 1080p60 pixel rates (148.5 MHz). Place the device between a video decoder and an LCD controller; its LVDS-capable I/O bank pairs drive flat-panel TMDS/serializer channels without external buffers.
Empfohlen
Industrial Motor Control Glue Logic
In a motor-control system the EP1C4F400C6N absorbs the role of multiple discrete 74HC logic chips by generating PWM timing, decoding Hall/encoder feedback, and handling interlock logic between the MCU, gate driver, and safety relays. The 301 I/Os interface to 3-phase gate drivers, opto-isolated fault inputs, and a parallel status display, while the 2 PLLs derive high-resolution PWM frequencies and resolver-excitation clocks from a single crystal. The C6 commercial speed grade suits equipment sealed inside 0 to 70 °C enclosures; for -40 °C to +100 °C industrial cabinets, swap to EP1C4F400I7N, which is pin-compatible and reuses the same Quartus project.
Empfohlen
Telecommunications Line-Card Interface
Used as the interface logic on a T1/E1 or low-density Ethernet line card, the EP1C4F400C6N handles 8-bit TDM bus aggregation, framing, and protocol mapping between the framer IC and the backplane connector. The 78,336 bits of M4K RAM implement small elastic stores, while 301 I/Os route a parallel backplane plus a 16-bit local bus. The 1.5 V core plus 3.3 V-tolerant I/O is compatible with both legacy 5 V transceivers (via level shifters) and modern 3.3 V framers. The Cyclone I LVDS support enables direct connection to 100-Mbit Ethernet PHYs without external resistors.
Empfohlen
Low-Cost Prototyping Platform
Designers and universities use the EP1C4F400C6N as the heart of a low-cost development board that exercises a real FPGA, JTAG, and 200+ breadboard-accessible I/Os without the cost of a Cyclone IV. Its 4,000 LEs are large enough to host a 32-bit Nios II soft processor, an SDRAM controller, and 50+ GPIO while leaving 30-50% utilization for user logic. The C6 speed grade runs Nios II at 50 MHz, sufficient for instruction set exploration and embedded Linux (uClinux) bring-up. Boards designed around the 400-ball BGA can swap EP1C4F400C6N for EP1C4F400C7N or C8N for timing-margin experiments.
Empfohlen
Embedded Display Controller
The EP1C4F400C6N is widely used as a low-cost display controller that converts a parallel RGB888 input from a host SoC into an LVDS output for a flat panel, while also generating on-screen-display (OSD) overlays and gamma-correction LUTs. The 78,336 bits of M4K RAM store up to 4 scan lines of frame-buffer data plus a 256x24 gamma LUT, and 301 I/Os accommodate the input bus plus 4 LVDS pairs and a 16-bit GPIO control port. The C6 speed grade supports up to 85 MHz pixel rate; EP1C4F400C7N or C8N is recommended for 1080p60 at 148.5 MHz with full OSD overlay.
Empfohlen
Test and Measurement Front-End
In a benchtop T&M instrument the EP1C4F400C6N functions as a parallel data formatter, triggering engine, and pattern generator. The 301 I/Os drive a parallel DAC/ADC data bus plus trigger in/out BNCs, and the 4,000 LEs host a state-machine-based sequencer that runs at the C6 device's internal 200 MHz PLL. The 78,336 bits of M4K RAM implement deep FIFO buffers that absorb bursts between the FPGA and the host CPU. EP1C4F400C8N is a pin-compatible upgrade when an instrument needs tighter timing margin for high-speed pattern generation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1C4F400C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1C4F400C6 | EP1C4F400C8N | EP1C4F400C7N | EP1C4F400I7N | EP1C4F400I6 |
|---|---|---|---|---|---|---|
| Package | 400-ball FineLine BGA (F400) | 400-ball FineLine BGA - same | 400-ball FineLine BGA - same | 400-ball FineLine BGA - same | 400-ball FineLine BGA - same | 400-ball FineLine BGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Total RAM Bits | 78,336 | 78,336 | 78,336 | 78,336 | 78,336 | 78,336 |
| User I/Os | 301 | 301 | 301 | 301 | 301 | 301 |
| Speed Grade | C6 (commercial) | C6 | C8 (faster) | C7 (faster) | I7 (industrial) | I6 (industrial) |
| Temperature Range | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C | -40 °C to +100 °C |
| VCCINT | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Highest 400-BGA speed grade flexibility within EP1C4F400 family (vs. EP1C4F400C8N)
- Same 400-ball BGA footprint as industrial-temperature EP1C4F400I7N (vs. EP1C4F400I7N)
- Lead-free C6 commercial option vs. lead-finish EP1C4F400C6 (vs. EP1C4F400C6)
Designhinweise
The EP1C4F400C6N requires a clean 1.5 V VCCINT supply capable of 0.5-1.5 A depending on toggle rate. Decouple every VCCINT ball with a 0.1 µF X7R ceramic placed within 50 mil of the BGA, plus four to eight bulk 47 µF tantalum or polymer capacitors around the package. VCCIO is set per bank; the JTAG VCCIO (bank 1) must match the I/O bank supplying the JTAG connector (typically 2.5 V or 3.3 V). Per the Cyclone Device Handbook, all VCC pins must be connected, including unused PLL analog supply pins.
The 400-ball FineLine BGA dissipates heat primarily through the balls and internal die. At 100 % toggle rate the EP1C4F400C6N typically draws 0.7-1.0 A from VCCINT, yielding 1.0-1.5 W. A four-layer FR-4 board with 1 oz copper and a continuous GND plane is sufficient; for high-utilization designs add thermal vias under the die to spread heat. Forced airflow is not required below 1.5 W but is recommended above 2.0 W. The commercial C6 grade is rated to 0 °C to +85 °C case temperature.
The 400-ball FineLine BGA uses a 1.00 mm ball pitch. Use 0.4-0.5 mm diameter solder paste apertures with NSMD (non-solder mask defined) pads to ensure reliable joints. Provide 0.5 mm escape routing through the inner row of balls; deeper rows require via-in-pad or microvia HDI stack-up. Per the Altera packaging guidelines, the breakout needs at least a 6-layer stack-up with continuous GND and VCCINT planes on layers 2 and 5. PCB fab with HDI capability and a reflow profile of 245 °C peak is required.
Do NOT leave the Cyclone I CONF_DONE pin floating - it needs a 10 kΩ pull-up to VCCIO. A common mistake is to forget the CRC error pin handling: if the CRC_ERROR pin asserts, the user application must reach the configuration error state cleanly. Also note that the Cyclone I JTAG ID is different from Cyclone II/III/IV, so JTAG chain order matters. After power-up, run the Quartus programmer and verify the device ID before assuming the part is healthy. Configuration devices must be a Cyclone I-compatible EPCS (e.g. EPCS4) - the wrong EPCS will fail to configure silently.
Compliance-Informationen
RoHS compliance per Altera/Intel product page. Trailing 'N' in MPN indicates lead-free plating. AEC-Q100 not applicable - this is a commercial-grade FPGA; industrial temperature is provided as a separate variant (I6/I7N). REACH, halogen-free, and conflict-minerals status are not stated in the verified data and are marked 'unknown'.
