EP1C4F400C8NAB - Cyclone FPGA 4000 Cells 301 I/O 400-FBGA | Intel
Teilenummer: EP1C4F400C8NAB ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.8 | $258,00 |
| 100 | $22.4 | $2.240,00 |
| 500 | $19.5 | $9.750,00 |
| 1.000 | $17.2 | $17.200,00 |
EP1C4F400C8NAB Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that allow the hardware function to be redefined after manufacture. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor) and are widely used for parallel datapath processing, custom interface bridging, glue logic, and ASIC prototyping where time-to-market outweighs per-unit cost. The Cyclone family was Altera's first SRAM-based, low-cost FPGA line, targeting ASIC replacement in cost-sensitive applications.
Key features of the EP1C4F400C8NAB include 4000 logic elements, 17 M4K RAM blocks (78,336 RAM bits total), up to 301 user I/O pins across 8 I/O banks, embedded multipliers (typically 2 x 18 x 18 per M4K block region) for DSP-style arithmetic, and a Phase-Locked Loop (PLL) for clock management. The 400-ball FBGA package supports high I/O density on a small board footprint, while the 1.5 V core reduces dynamic power relative to older 2.5 V/3.3 V FPGA generations.
Architecturally, the Cyclone I fabric uses 4-input lookup tables (LUTs) feeding registers, with routing switch matrices connecting rows and columns. Logic is grouped into Logic Array Blocks (LABs), and I/O is organized into banks with independent VCCIO pins supporting LVTTL, LVCMOS, PCI, SSTL, and LVDS signaling. The configuration bitstream is loaded from an external serial or parallel flash via the dedicated configuration pins, with the device remaining in user mode after the JTAG-driven configuration completes.
Typical applications include digital video processing pipelines, industrial control and factory automation glue logic, telecommunications line-card interface bridging, low-cost ASIC prototyping, motor control and encoder interfaces, and legacy Parallel RapidIO/Custom bus bridges. The combination of moderate logic density, embedded multipliers, and plentiful user I/O suits designs that previously would have required a small ASIC.
When designing with the EP1C4F400C8NAB, note that first-generation Cyclone devices are no longer recommended for new designs; verify with Intel's latest product discontinuation notices before committing. Plan decoupling around each VCCINT and VCCIO pin, route configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) away from switching clocks, and use the Altera/Quartus II design toolchain for synthesis and place-and-route.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone family, and practical design notes that complement the manufacturer datasheet.
Drop-in-Alternativen für EP1C4F400C8NAB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1C4F400C8NAB (gleiche Bauform und Footprint) – abweichend in Speed Grade, Family, Process Technology, Package, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1C4F400C8N
✅ Drop-In✓ Auf Lager
$15.26 / Stück
Datenblatt ansehen →EP1C4F400C7N
✅ Drop-In✓ Auf Lager
$28.9 / Stück
Datenblatt ansehen →EP1C4F400C8NAA
✅ Drop-In✓ Auf Lager
$13.9 / Stück
Datenblatt ansehen →EP1C4F400C8
✅ Drop-In✓ Auf Lager
$22.1 / Stück
Datenblatt ansehen →EP1C4F400C6
✅ Drop-In✓ Auf Lager
$21.6 / Stück
Datenblatt ansehen →EP1C4F400C6N
✅ Drop-In✓ Auf Lager
$26.4 / Stück
Datenblatt ansehen →EP1C4F400C8NAB Grenzwerte & elektrische Eigenschaften
| Family | Cyclone |
| Logic Elements | 4000 |
| Total RAM Bits | 78336 |
| User I/O Count | 301 |
| Number of I/O Banks | 8 |
| Gehäuse | 400-BGA (FBGA) |
| Core Voltage (VCCINT) | 1.5 V |
| Process Technology | 130 nm CMOS |
| Speed Grade | 8 |
| Betriebstemperatur | 0C to +85C (Commercial) |
| Montageart | Surface Mount |
| Lead Free / RoHS | Yes (Pb-free, RoHS compliant per NAB suffix) |
| Configuration Interface | Serial/Parallel, JTAG |
| Embedded Multipliers | Yes (DSP blocks) |
| PLL Count | 2 |
EP1C4F400C8NAB 400-bga (fbga) Pinbelegungsleitfaden
Pinbelegung für EP1C4F400C8NAB (400-bga (fbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1C4F400C8NAB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1C4F400C8NAB ist geeignet für 6 Anwendungs: Industrial Control & Factory Automation, Digital Video Processing Pipeline, Telecommunications Line-Card Interface Bridge, ASIC Prototyping & Pre-Silicon Validation, Motor Control & Encoder Interface, Legacy Custom Bus Bridge.
Industrial Control & Factory Automation
The EP1C4F400C8NAB fits industrial control designs because its 4000 logic elements and 301 user I/O are sufficient for multi-axis motor control, encoder interfacing, and PLC-style ladder-logic replacement while keeping the bill of materials under USD 30. The 1.5 V VCCINT and eight independent VCCIO banks let it interface directly to 24V-tolerant optocouplers via 3.3 V LVTTL, 5 V TTL via level shifters, and RS-485 transceivers at 3.3 V. Compared with a microcontroller, the FPGA handles parallel deterministic loops (PID, encoder quadrature, PWM) without jitter from interrupt latency. The Cyclone Device Handbook application note AN-144 details industrial reference designs that reuse this part. Use a TVS-protected supply and conformal coating for factory-floor reliability.
Empfohlen
Digital Video Processing Pipeline
The EP1C4F400C8NAB suits entry-level digital video processing such as camera-link input conditioning, color-space conversion, and on-screen-display overlay thanks to its 17 M4K RAM blocks (78,336 bits) that buffer line-scan data and embedded 18 x 18 multipliers that handle real-time pixel arithmetic. Operating from a 1.5 V core and 3.3 V LVCMOS I/O, it can drive DVI/HDMI encoders at pixel clocks up to the silicon's tCO limit documented in the Cyclone datasheet. The 400-ball FBGA keeps board area compact for embedded camera modules. For HD video, designers typically use two EP1C4F400 devices in master/slave configuration or migrate to Cyclone II EP2C20 for higher throughput. Add SDRAM like a 64 MB x 16 for frame buffer memory.
Empfohlen
Telecommunications Line-Card Interface Bridge
In telecom line cards the EP1C4F400C8NAB is commonly used to bridge legacy TDM/PCM buses (HMVIP, H.110, ST-BUS) to packet backplanes, where its 301 user I/O accommodate parallel PCM highways and the embedded multipliers assist in clock-recovery and line-encoding DSP. The eight I/O banks support mixed-voltage standards (3.3 V LVTTL, 2.5 V LVCMOS, 1.8 V HSTL) needed to mate with legacy framers and modern ASICs without external level shifters. The two PLLs generate the multiple clock domains required for TDM-to-Ethernet conversion. Industrial temperature variants of this die meet the NEBS thermal profile used in central-office equipment. Refer to Altera AN-383 for telecom reference designs.
Empfohlen
ASIC Prototyping & Pre-Silicon Validation
Engineers prototyping small ASICs use the EP1C4F400C8NAB to validate RTL before committing to mask tooling, leveraging its 4000 logic elements and 17 M4K RAM blocks to model a mid-complexity SoC block. The 1.5 V VCCINT and JTAG-driven configuration loop let designers iterate synthesis netlists in minutes using Quartus II 13.0sp1, the last release supporting Cyclone I. Compared to ASIC NRE of USD 100K+, the USD 17-30 unit cost makes it ideal for early firmware bring-up. The 400-ball FBGA exposes enough user I/O to map most parallel SoC interfaces. For larger prototypes, stack two EP1C4F400 devices via LVDS point-to-point links.
Empfohlen
Motor Control & Encoder Interface
The EP1C4F400C8NAB is well suited to multi-axis servo and stepper motor controllers where its 301 user I/O handle quadrature encoder inputs, Hall-effect sensor feedback, and PWM outputs simultaneously for 4-6 axes. The two PLLs generate synchronized switching frequencies for the PWM stages, while embedded 18 x 18 multipliers accelerate Park/Clark transforms used in FOC algorithms. The 1.5 V core and 3.3 V I/O interface directly to external gate drivers and isolated current sensors. Designers can implement SVPWM at 20 kHz switching frequency with deterministic latency unavailable on microcontrollers. Add isolated 24V-to-5V DC-DC converters and TVS diodes for industrial EMC compliance.
Empfohlen
Legacy Custom Bus Bridge
The EP1C4F400C8NAB is often deployed as a glue-logic bridge between obsolete microcontrollers, ECL/TTL peripherals, and modern processors where its 301 user I/O and eight independent I/O voltage banks absorb the impedance/voltage mismatches. The 17 M4K RAM blocks implement dual-port FIFOs needed for clock-domain crossing between asynchronous bus domains. Operating from 1.5 V VCCINT and 1.5-3.3 V VCCIO, the device adapts between legacy 5 V CMOS peripherals (via external resistors) and modern 1.8 V processors without glue logic. Industrial temperature variants meet defense/aerospace long-lifecycle requirements. Quartus II SOPC Builder supports soft-core Nios II integration for added flexibility.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1C4F400C8NAB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1C4F400C8N | EP1C4F400C7N | EP1C4F400C8NAA | EP1C4F400C8 | EP1C4F400C6 |
|---|---|---|---|---|---|---|
| Package | 400-BGA (FBGA) | 400-BGA (FBGA) - same | 400-BGA (FBGA) - same | 400-BGA (FBGA) - same | 400-BGA (FBGA) - same | 400-BGA (FBGA) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| Total RAM Bits | 78336 | 78336 | 78336 | 78336 | 78336 | 78336 |
| User I/O Count | 301 | 301 | 301 | 301 | 301 | 301 |
| Speed Grade | 8 | 8 | 7 (slower) | 8 | 8 | 6 (slowest) |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Wichtigste Unterscheidungsmerkmale
- Last-time-buy compliance suffix NAB explicitly Pb-free/RoHS (vs. EP1C4F400C8N)
- Same-family speed-grade variants allow timing-bin downgrades (vs. EP1C4F400C6)
- Altera Cyclone FBGA ball map is unique to this family (vs. EP1C4F324I7N (324-FBGA cousin))
Designhinweise
The EP1C4F400C8NAB requires at least six 100 nF ceramic decoupling capacitors placed within 5 mm of the VCCINT balls and one 10 uF tantalum bulk capacitor on each VCCIO bank. The PLL analog supply (VCCA_PLL) must be filtered with a ferrite bead and 10 uF + 100 nF pi-network as shown in the Cyclone Device Handbook. Core current at 1.5 V can reach several hundred mA at high toggle rates; use a switching regulator with 3% tolerance to avoid VCCINT droop during configuration.
Use a 400-ball FBGA land pattern with 0.8 mm or 1.0 mm pitch (verify from the device package specification) and microvia-in-pad PCB technology for reliable assembly. Route JTAG (TCK, TMS, TDO, TDI) and configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) as a 50-ohm impedance-controlled group on the top layer to avoid reflection on the configuration bitstream. Place a ground pour directly under the BGA and stitch the perimeter with 200-mil-spaced vias to suppress simultaneous-switching-output (SSO) noise.
First-generation Cyclone devices are not hot-sockable; ensure power rails are stable before configuration. Do not leave JTAG TCK floating - tie through a 10 kohm pull-down. The CONF_DONE pin is open-drain and requires a 4.7 kohm pull-up to VCCIO of the bank it resides in. Configuration failure modes typically stem from insufficient bulk capacitance or a stretched DCLK; always validate with the Quartus II Programmer's verify-after-program option before releasing the board to production.
Compliance-Informationen
Pb-free and RoHS compliant per NAB suffix designation on the package marking. REACH compliance assumed per Intel PSG product declarations. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive).
