EP1C4F400C8 - Cyclone FPGA 4K LE 400-BGA | Intel | Industrial
Teilenummer: EP1C4F400C8 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 250 | $25.4 | $6.350,00 |
| 500 | $22.1 | $11.050,00 |
EP1C4F400C8 Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs sit in the digital-logic hierarchy between standard microcontrollers (fixed architecture, sequential execution) and application-specific integrated circuits (ASICs, fixed at fabrication). Cyclone-family FPGAs target cost-sensitive, high-volume applications where the parallel hardware acceleration of an FPGA is needed but ASIC non-recurring engineering (NRE) costs cannot be justified. The configurable logic array, embedded RAM, DSP blocks, and PLL clocking together form a programmable system-on-chip fabric.
Key features of the EP1C4F400C8 include 4,000 logic elements distributed across 400 logic array blocks, 78336 bits of embedded RAM in M4K memory blocks, up to 301 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, LVDS), and 17 dedicated 18x18 hardware multipliers. The device also integrates two PLLs with four output taps each, supporting multi-clock-domain designs. Configuration is supported through active serial (AS), passive serial (PS), and JTAG modes, with built-in decompression for reduced configuration bitstream storage.
The Cyclone architecture uses an SRAM-based configuration cell, which allows unlimited reconfiguration but requires a configuration flash or download cable at every power-up. The 130 nm process provides a balance of static power consumption and logic density. The 400-ball FineLine BGA (1.0 mm pitch) enables high I/O count in a compact 17 mm x 17 mm footprint with comprehensive ground and power integrity for moderate-speed parallel interfaces.
Typical applications include industrial motor control and factory automation, telecommunications line cards and baseband processing, video and image processing pipelines, consumer electronics requiring hardware-accelerated DSP, and prototype ASIC development. Quartus II design software (version 13.0 or earlier for legacy Cyclone support) is used for synthesis, place-and-route, and timing closure.
When designing with this device, ensure clean 1.5 V core and 3.3 V I/O supply decoupling, place configuration mode pins through proper pull-ups, and respect I/O bank VCCIO constraints for mixed-voltage interfaces. The device is no longer recommended for new designs; engineers should consider Cyclone IV or Cyclone 10 LP families for new projects.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone family, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für EP1C4F400C8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1C4F400C8 (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Process Technology, Family, Total RAM Bits.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1C4F400C8N
✅ Drop-In✓ Auf Lager
$15.26 / Stück
Datenblatt ansehen →EP1C4F400C7N
✅ Drop-In✓ Auf Lager
$28.9 / Stück
Datenblatt ansehen →EP1C4F400C7
✅ Drop-In✓ Auf Lager
$18.75 / Stück
Datenblatt ansehen →EP1C4F400C6N
✅ Drop-In✓ Auf Lager
$26.4 / Stück
Datenblatt ansehen →EP1C4F400C6
✅ Drop-In✓ Auf Lager
$21.6 / Stück
Datenblatt ansehen →EP1C4F400C8 Grenzwerte & elektrische Eigenschaften
| Series | Cyclone |
| Family | Cyclone I (EP1C4) |
| Logic Elements | 4,000 |
| Logic Array Blocks (LABs) | 400 |
| Embedded Memory (RAM bits) | 78,336 |
| Total RAM Blocks | M4K (4 Kbit + parity) |
| Embedded Multipliers (18x18) | 17 (per FindIC / Alldatasheet) |
| PLLs | 2 |
| User I/Os | 301 |
| Gehäuse | 400-BGA FineLine BGA (FBGA-400), 1.0 mm pitch |
| Core Voltage (VCCINT) | 1.5 V |
| Process Technology | 130 nm CMOS |
| Maximum Internal Frequency | 275.03 MHz (per Datasheets.com listing) |
| Betriebstemperatur | 0C to +85C (commercial, suffix C8) |
| Configuration Mode | AS / PS / JTAG |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes (per RoHS) |
EP1C4F400C8 400-bga fineline bga (fbga-400), 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP1C4F400C8 (400-bga fineline bga (fbga-400), 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1C4F400C8.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1C4F400C8 ist geeignet für 6 Anwendungs: Industrial Motor Control, Telecommunications Line Cards, Video and Image Processing Pipelines, Consumer Electronics with Hardware DSP, ASIC Prototyping and Emulation, Legacy Industrial Automation Systems.
Industrial Motor Control
The EP1C4F400C8 fits industrial motor control and drive applications because it provides 301 user I/Os for parallel PWM generation, encoder feedback, and fieldbus interfaces. The 4,000 logic elements and 17 dedicated 18x18 multipliers support field-oriented control (FOC) algorithms and Park/Clarke transforms at the 10-20 kHz control loop rates typical of AC induction and permanent-magnet servo drives. The 275 MHz internal frequency and 2 PLLs enable deterministic multi-axis timing without external DSP. Compared to a microcontroller-only solution, the FPGA offloads parallel current-loop computation, freeing the MCU for supervisory functions. The 400-ball BGA provides robust power and ground integrity needed for noisy industrial environments.
Empfohlen
Telecommunications Line Cards
The EP1C4F400C8 suits legacy telecommunications line-card and baseband processing designs where the parallel DSP fabric of the Cyclone I architecture accelerates channel coding, scrambling, and framing tasks. Its 78,336 bits of embedded RAM in M4K blocks provides distributed FIFO and lookup-table storage for framer/def ramer pipelines without external memory. The 301 user I/Os accommodate LVDS and HSTL interfaces to network processors and SERDES devices. Configuration via JTAG supports in-system firmware updates in the field. For new telecom designs, the Cyclone IV GX family with integrated transceivers is preferred, but the EP1C4F400C8 remains in maintenance designs globally.
Empfohlen
Video and Image Processing Pipelines
The EP1C4F400C8 enables cost-effective video processing pipelines including scaling, color-space conversion, deinterlacing, and overlay generation. The 17 dedicated 18x18 multipliers handle real-time FIR filtering and DCT/IDCT blocks for MPEG-2 or MJPEG compression at SD resolutions. The 4,000 logic elements support line buffers and timing generators, while the 301 user I/Os provide direct connection to video ADCs, DACs, and ITU-R BT.656 / BT.1120 interfaces. The 2 PLLs generate pixel clocks at 27/74.25/148.5 MHz from a single reference. Power consumption is moderate at the 130 nm node; heatsinking may be needed for full-rate HD processing.
Empfohlen
Consumer Electronics with Hardware DSP
The EP1C4F400C8 serves consumer electronics products requiring hardware DSP acceleration at low cost - such as audio effects processors, karaoke systems, and digital mixers. The 17 hardware multipliers accelerate biquad filters, reverb, and pitch-shift algorithms at 48 kHz sample rates. The 78,336 bits of embedded RAM store delay lines and coefficient tables without external memory. The 400-ball BGA footprint supports compact PCB layouts for consumer chassis constraints. Compared to a dedicated DSP chip, the FPGA allows post-production feature upgrades via bitstream reload. Active lifecycle limitations make this best suited for established consumer products with long production runs.
Empfohlen
ASIC Prototyping and Emulation
The EP1C4F400C8 is well-suited as an ASIC prototyping vehicle for designs of up to 4,000 logic elements - small to medium ASICs can be partitioned across multiple devices. Designers map RTL directly to Cyclone primitives using Quartus II synthesis, validating logic functionality and basic timing before committing to mask NRE. The 301 user I/Os support high-pin-count ASIC emulation including processor cores, peripheral bridges, and glue logic. Reconfiguration time is fast enough for regression testing. For larger ASICs, multiple EP1C4F400C8 devices can be cascaded, though for very large designs, the Cyclone IV SE or Cyclone V families with higher density are preferred.
Empfohlen
Legacy Industrial Automation Systems
The EP1C4F400C8 supports long-life industrial automation equipment where 10-15 year production runs require proven, stable components. Its 301 user I/Os directly interface to legacy parallel fieldbuses (Profibus, DeviceNet), opto-isolated GPIO, and stepper-motor driver stages. The 4,000 logic elements implement deterministic PLC-style logic, custom communication protocols, and safety interlocks without an external CPU. The 400-ball BGA is mechanically robust for industrial vibration environments. Industrial users typically specify the commercial temperature grade (0C to +85C, suffix C8) for control cabinet installations, which matches the EP1C4F400C8 operating range exactly. For new industrial designs, Cyclone 10 LP is the modern equivalent.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1C4F400C8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1C4F400C8N | EP1C4F400C7N | EP1C4F400C7 | EP1C4F400C6N | EP1C4F400C6 |
|---|---|---|---|---|---|---|
| Package | 400-ball FineLine BGA (FBGA-400) | 400-ball FineLine BGA (FBGA-400) - same | 400-ball FineLine BGA (FBGA-400) - same | 400-ball FineLine BGA (FBGA-400) - same | 400-ball FineLine BGA (FBGA-400) - same | 400-ball FineLine BGA (FBGA-400) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Speed Grade | -8 (275 MHz internal) | -8 (275 MHz internal) | -7 (~225 MHz internal) | -7 (~225 MHz internal) | -6 (~200 MHz internal) | -6 (~200 MHz internal) |
| Lead-Free / RoHS | No (leaded, suffix C8) | Yes (suffix C8N) | Yes (suffix C7N) | No (suffix C7) | Yes (suffix C6N) | No (suffix C6) |
| User I/Os | 301 | 301 | 301 | 301 | 301 | 301 |
| Embedded RAM | 78,336 bits | 78,336 bits | 78,336 bits | 78,336 bits | 78,336 bits | 78,336 bits |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Unit Price (qty 1, USD) | 38.50 | 39.20 | 32.40 | 31.80 | 28.90 | 27.50 |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible lead-free RoHS replacement in same FBGA-400 footprint (vs. EP1C4F400C8N)
- Fastest speed grade in EP1C4F400 family (vs. EP1C4F400C7N)
- Highest logic density in legacy Cyclone I cost-optimized family at this I/O count (vs. EP1C3T144C8N)
Designhinweise
The EP1C4F400C8 requires a clean 1.5 V core supply (VCCINT) plus a 3.3 V I/O supply (VCCIO) with per-bank VCCIO support for mixed-voltage interfaces (1.5V/1.8V/2.5V/3.3V). Place 100 nF decoupling capacitors within 5 mm of every VCC pin and bulk 10-47 uF tantalum or ceramic capacitors at each supply entry point. The 130 nm Cyclone I device draws 200-800 mA from VCCINT depending on logic utilization and clock frequency. Inrush current at configuration can spike to 1 A momentarily; size the 1.5 V regulator for at least 1.5 A continuous capability. Source: Altera Cyclone Device Handbook, Volume 1, Chapter 7 (Power Management).
The 400-ball FineLine BGA at 1.0 mm pitch requires 4-6 layer PCB stack-up with 0.36 mm (14 mil) laser-drilled microvias or 0.51 mm (20 mil) mechanical vias for escape routing. Fan-out pattern should route signal escapes on the top layer and use internal layers for power/ground planes. Maintain continuous ground plane under the BGA for thermal dissipation and signal return paths. Per Altera AN 114: BGA breakout guidelines, allocate at least 4 ground balls and 4 power balls within the BGA field for direct decoupling. Reflow profile must comply with JEDEC J-STD-020 with peak temperature 245 C for lead-free or 225 C for leaded variants.
Three common pitfalls with EP1C4F400C8 designs: (1) Forgetting that Cyclone I uses SRAM configuration - the bitstream is lost on power-down and must be reloaded from a configuration flash (EPCS1/EPCS4/EPCQ4) on every power-up; designs without a flash or download cable will fail at first power-up. (2) Mixing 3.3V and 1.5V I/O standards in the same bank - VCCIO is shared per bank, so all I/Os in a bank must use compatible standards. (3) Using Quartus II newer than 13.0 - Intel/Altera dropped Cyclone I support after QII 13.0; use QII 13.0 Web Edition (free legacy download) or earlier. Misalignment of the configuration mode pin (MSEL) with the actual configuration method also causes silent boot failures - verify MSEL[2:0] against Table 8-1 in the Cyclone Handbook.
Estimated: at maximum toggle rate of 275 MHz with 80% logic utilization, the EP1C4F400C8 dissipates approximately 0.5-1.2 W depending on switching activity. The 400-ball FBGA thermal resistance is approximately 18 C/W with proper PCB thermal via array (8-16 thermal vias under the package center). For enclosed industrial cabinets, verify junction temperature stays below 85 C (commercial grade, suffix C8). Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet with target utilization and toggle rates to refine thermal budgets before PCB layout finalization. Industrial grade (suffix I8, -40C to +100C) is not offered for this part - choose C8N with system-level thermal management for industrial deployments.
For LVDS signaling on EP1C4F400C8, maintain 100 ohm differential impedance and length-match within 20 mils across each LVDS pair. The device supports LVDS on top and bottom I/O banks only - left and right side banks do not support LVDS transmitters. Use the Altera Cyclone I Device Handbook Chapter 6 (High-Speed I/O) for SSO (Simultaneous Switching Output) analysis; exceeding 20 simultaneously-switching outputs in a bank without proper decoupling causes ground bounce. Source-synchronous interfaces (DDR, LVDS) require manual delay chain tuning through the ALTDQ and ALTDQS megafunctions in Quartus II.
Compliance-Informationen
The EP1C4F400C8 (suffix C8, no N) is the leaded variant - not RoHS compliant. For RoHS compliance, choose the EP1C4F400C8N (suffix C8N) which is the lead-free equivalent with identical pinout and electrical characteristics. REACH compliance per Intel product declaration. Not AEC-Q100 qualified (industrial / commercial grade only).
