EP1K10FC256-3N - 10K Gates ACEX-1K FPGA, 256-FBGA | Intel / Altera
Teilenummer: EP1K10FC256-3N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.2 | $382,00 |
| 100 | $33.75 | $3.375,00 |
| 500 | $28.9 | $14.450,00 |
| 1.000 | $24.5 | $24.500,00 |
EP1K10FC256-3N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs) interconnected by a programmable routing fabric. FPGAs sit in the programmable logic hierarchy below ASICs (Application-Specific ICs) but above discrete glue logic, offering hardware-level parallelism, in-field reprogrammability, and time-to-market advantages. The ACEX-1K family, introduced by Altera in the late 1990s, was an early "system-on-a-programmable-chip" (SOPC) family that embedded array blocks (EABs) alongside logic to deliver efficient memory and DSP megafunctions in a single device.
Key features of the EP1K10FC256-3N include 72 LABs (Logic Array Blocks), 12288 bits of embedded RAM (12 Kbits), 136 user I/O pins, a maximum internal operating frequency around 200 MHz, and SRAM-based configuration cells requiring an external configuration device or JTAG. The "-3" speed grade and "N" suffix denote a commercial-temperature, lead-free, lead-free reflow-compatible process. The 256-FBGA (17 mm × 17 mm) package is a surface-mount fine-pitch BGA designed for high-density board layouts.
Architecturally, the EP1K10FC256-3N combines 72 LABs (each with 8 logic elements) and embedded array blocks (EABs) used as dual-port or single-port RAM, ROM, or multiplier megafunctions. Configuration is SRAM-based, meaning the device loses its bitstream at power-down and must be reconfigured at boot from an external PROM, JTAG, or controller - a critical design consideration that distinguishes ACEX-1K from later Cyclone/MAX-based flash- or antifuse-based families.
Typical applications include glue-logic integration, custom interface bridging (PCI, I2C, UART), low-to-moderate complexity DSP pre/post-processing, industrial control and instrumentation, and legacy telecommunications line cards. ACEX-1K parts were also widely used in development boards, prototyping platforms, and educational FPGA labs.
When designing with the EP1K10FC256-3N, ensure an external configuration source (EPC1/EPC2 serial PROM, ByteBlaster, or JTAG) is in the BOM - the part is volatile and will not retain its design on power-cycle. Verify the 2.5 V core supply decoupling network: at least four 0.1 µF ceramic capacitors plus a bulk 47-100 µF tantalum placed within 25 mm of the FBGA supply balls is recommended.
This page synthesizes distributor pricing, same-package drop-in alternatives from the same ACEX-1K family, configuration-device recommendations, and practical design notes not consolidated on any single distributor page.
Drop-in-Alternativen für EP1K10FC256-3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1K10FC256-3N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Process Technology, Speed Grade, Total RAM Bits.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1K10FC256-3
✅ Drop-In✓ Auf Lager
$15.95 / Stück
Datenblatt ansehen →EP1K10FC256-2N
✅ Drop-In✓ Auf Lager
$5.62 / Stück
Datenblatt ansehen →EP1K10FC256-2
✅ Drop-In✓ Auf Lager
$9.95 / Stück
Datenblatt ansehen →EP1K10FC256-1
✅ Drop-In✓ Auf Lager
$22.62 / Stück
Datenblatt ansehen →EP1K100FC256-3N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP1K10FC256-3N Grenzwerte & elektrische Eigenschaften
| Family | ACEX-1K |
| Typical Gates | 10,000 |
| Logic Elements | 576 |
| LABs / CLBs | 72 |
| Embedded RAM Bits | 12,288 (12 Kbit) |
| User I/O Pins | 136 |
| Gehäuse | 256-ball FBGA (17 mm × 17 mm) |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -3 |
| Configuration Method | SRAM (volatile), external PROM or JTAG |
| Betriebstemperatur | Commercial (0 °C to +70 °C) |
| Montageart | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) |
EP1K10FC256-3N 256-ball fbga (17 mm × 17 mm) Pinbelegungsleitfaden
Pinbelegung für EP1K10FC256-3N (256-ball fbga (17 mm × 17 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1K10FC256-3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1K10FC256-3N ist geeignet für 6 Anwendungs: Legacy Industrial Glue-Logic Integration, Custom Interface Bridging (PCI / I2C / UART / SPI), Telecommunications Line-Card Pre-Processing, Test & Measurement Instrumentation Front-End, Aerospace & Defense Avionics Databus Interface, FPGA Education & Prototyping Platforms.
Legacy Industrial Glue-Logic Integration
The EP1K10FC256-3N replaces multiple 74-series TTL / CMOS glue-logic ICs by consolidating address decoding, bus arbitration, and interrupt steering into a single programmable device. With 576 logic elements and 12 Kbit embedded RAM, the part absorbs medium-complexity state machines while freeing board area. Its 136 user I/O pins connect directly to parallel industrial buses. Engineers keep ACEX-1K designs in production because the 2.5 V core and BGA footprint have been qualified for years in factory automation lines. Design tip: allocate roughly 30% logic utilization headroom for future ECOs.
Empfohlen
Custom Interface Bridging (PCI / I2C / UART / SPI)
The EP1K10FC256-3N is widely deployed as a protocol bridge between legacy microcontrollers and modern peripherals. Its 12 Kbit embedded RAM doubles as a small FIFO buffer for UART-to-SPI converters or I2C-to-parallel LCD controllers. The 200 MHz internal frequency supports 33 MHz PCI target interfaces, and the 136 I/O pins handle multiple bus segments simultaneously. Engineers favor ACEX-1K over CPLDs for this role because the embedded array blocks (EABs) implement true dual-port RAM without wasting logic cells.
Empfohlen
Telecommunications Line-Card Pre-Processing
ACEX-1K parts were a workhorse of late-1990s and early-2000s telecom line cards, and the EP1K10FC256-3N continues in service in legacy T1/E1 framers, HDLC controllers, and time-slot interchangers. The 256-FBGA package suits the high-density backplanes of central-office equipment, while the SRAM-based configuration lets carriers push field upgrades via JTAG. With 136 I/Os, the part aggregates low-speed serial channels before forwarding them to the main ASIC. Sustained production spares keep these cards running well beyond their nominal EOL.
Empfohlen
Test & Measurement Instrumentation Front-End
The EP1K10FC256-3N digitizes trigger logic, multiplexer control, and timing generators in mid-range oscilloscopes, logic analyzers, and protocol testers. Its 12 Kbit block RAM stores calibration coefficients, while 576 logic elements implement custom serial-decoding state machines for I2C, SPI, and CAN. Designers select ACEX-1K over newer Cyclone parts because the older 2.5 V core rail is already present in legacy instrument power trees. The 256-FBGA package requires only a 17 × 17 mm PCB footprint - small enough for handheld instruments.
Empfohlen
Aerospace & Defense Avionics Databus Interface
Long-life aerospace platforms maintain MIL-STD-1553, ARINC 429, and discrete I/O interfaces through EP1K10FC256-3N FPGAs. The commercial temperature grade is qualified into many non-flight-severe subassemblies, and the part's 15+ year production pedigree satisfies DO-254 design-assurance goals for legacy avionics refresh programs. The 12 Kbit block RAM implements message buffers for 1553 BC/RT/MT modes; 576 LEs handle Manchester encoding/decoding. Spares pooling is essential - aerospace buyers typically commit to 5-10 year inventory.
Empfohlen
FPGA Education & Prototyping Platforms
University digital-logic labs and maker communities still rely on ACEX-1K-based development boards because the MAX+PLUS II toolchain is freely available, runs on legacy Windows and Linux VMs, and exposes the full Quartus-style design flow. The EP1K10FC256-3N's 576 LEs are enough to teach VHDL/Verilog state-machine design, simple CPU cores, and bus-protocol exercises. The 256-FBGA package mirrors the high-density packages used in modern FPGAs, giving students realistic soldering and signal-integrity experience. Pre-owned Altera dev boards (e.g., UP1, Nios dev kit) populate the used-equipment market.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1K10FC256-3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1K10FC256-3 | EP1K10FC256-2N | EP1K10FC256-2 | EP1K10FC256-1 | EP1K100FC256-3N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-FBGA (17×17 mm) | 256-FBGA (17×17 mm) - same | 256-FBGA (17×17 mm) - same | 256-FBGA (17×17 mm) - same | 256-FBGA (17×17 mm) - same | 256-FBGA (17×17 mm) - same |
| Speed Grade | -3 (fastest) | -3 | -2 | -2 | -1 | -3 |
| Lead-Free / N Suffix | Yes | No (SnPb) | Yes | No (SnPb) | No (SnPb) | Yes |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 4,992 |
| User I/O Pins | 136 | 136 | 136 | 136 | 136 | 136 (same I/O bank structure) |
| Embedded RAM Bits | 12,288 (12 Kbit) | 12,288 | 12,288 | 12,288 | 12,288 | 49,152 (4×) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Lead-free RoHS-compliant finish with the fastest ACEX-1K speed grade (vs. EP1K10FC256-3)
- Fastest -3 speed grade available in the ACEX-1K-10K family (vs. EP1K10FC256-2N)
- Lowest-density ACEX-1K option, ideal for cost-sensitive glue-logic replacement (vs. EP1K100FC256-3N)
Designhinweise
The EP1K10FC256-3N requires a clean 2.5 V VCCINT rail and a separate VCCIO supply (typically 3.3 V or 2.5 V depending on I/O bank configuration). Place at least four 0.1 µF ceramic decoupling capacitors within 5 mm of the FBGA supply balls, plus one bulk 47-100 µF tantalum or polymer capacitor per supply rail within 25 mm. ACEX-1K VCCINT current scales with toggle rate and utilization - typical values are 150-400 mA at 100 MHz - so verify regulator current limit headroom above 1 A for thermal margin.
ACEX-1K is SRAM-based and volatile: the design bitstream is lost on every power-down. The most common first-time designer mistake is forgetting to include an external configuration PROM (EPC1, EPC2, or compatible third-party SPI flash) or JTAG download path. Without configuration, the FPGA powers up with all I/O pins in tri-state and no logic function. Verify the MSEL0/MSEL1 mode-select pins are correctly strapped for your chosen configuration scheme before board bring-up.
The 256-FBGA package uses a fine-pitch BGA with 1.0 mm ball pitch - PCB assembly requires precise solder-paste stencil aperture control (typically 0.45 mm diameter apertures on a 0.1-0.125 mm thick stainless-steel stencil). For prototype builds, use lead-free SAC305 solder paste and a reflow profile with 245 °C peak (for the "N" suffix) or 215-220 °C peak (SnPb EP1K10FC256-3 without "N"). X-ray inspection of all 256 balls after reflow is mandatory for high-reliability builds. Escape routing from the inner balls requires microvia or via-in-pad technology on a 4+ layer stack-up.
At 200 MHz internal operation, I/O switching rates on the EP1K10FC256-3N can reach 100-150 MHz on parallel buses. Match bus traces to within 10% of the target impedance (typically 50 Ω single-ended or 100 Ω differential for LVDS pairs), keep stubs short, and use 4-8 mil trace widths on the top microvia layer. Series-damping resistors (22-33 Ω) on each output pin reduce ground-bounce and SSN on heavily loaded buses. Maintain a continuous ground plane beneath the BGA footprint; avoid signal traces under the device body.
ACEX-1K FPGAs dissipate 0.5-2 W typical at moderate utilization, so thermal management is usually passive. However, in sealed enclosures at elevated ambient (e.g., industrial control cabinets at 60 °C+), the FBGA package benefits from a small thermal pad or copper flood under the exposed center balls connected to the inner ground ring. Estimated: at 1.5 W dissipation and a typical 0 JBGA theta-JA of 35-45 °C/W, junction temperature rises roughly 50-70 °C above ambient - keep ambient below 50 °C for reliable commercial-grade operation.
Compliance-Informationen
RoHS compliant per N suffix; ACEX-1K family predates AEC-Q100 automotive qualification requirements and is not recommended for new automotive designs. REACH compliance inferred from RoHS statement. Halogen-free status not explicitly stated in available data.
