EP1S20F780I7N - Stratix FPGA 18460 LEs 780-FBGA | Intel
Teilenummer: EP1S20F780I7N ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1.650,00 |
| 100 | $142 | $14.200,00 |
| 500 | $122 | $61.000,00 |
| 1.000 | $105 | $105.000,00 |
EP1S20F780I7N Übersicht
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnects, I/O blocks, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers into a single semiconductor die. FPGAs occupy a middle ground between fixed-function ASICs and software-driven processors: they deliver ASIC-level parallelism and latency while remaining fully re-programmable in the field. The Stratix family specifically targets high-performance applications such as DSP processing, protocol bridging, and data-path acceleration.
Key features of the EP1S20F780I7N include 586 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, LVDS), dedicated DSP blocks for fixed- and floating-point math, multiple phase-locked loops (PLLs) for clock synthesis, and embedded TriMatrix memory that supports true dual-port, simple dual-port, and single-port configurations. The 130 nm process node balances transistor density with power dissipation, and the I7 speed grade denotes an intermediate performance bin within the -40 C to +100 C industrial temperature window.
The architecture leverages Altera's Logic Element (LE) building block - each LE contains a 4-input look-up table (LUT), a programmable register, a carry chain, and a register chain. Lab-and-field measurements place the device's critical-path fabric performance around 420 MHz for registered logic. The 780-ball FC-FBGA package provides a high-bandwidth I/O interface (586 user I/Os are bonded out from a 780-ball array) for high-pin-count designs requiring parallel external memory, multi-gigabit transceivers, or large parallel data buses.
Typical applications include high-speed data acquisition and DSP, ASIC prototyping, telecom protocol bridging, military/aerospace signal processing, and industrial vision systems. The wide I/O count makes the EP1S20F780I7N a common choice for designs that aggregate multiple high-speed sensor or communication interfaces. The package is also well suited to PCIe endpoint cards, software-defined radio (SDR) baseband cards, and high-channel-count test instrumentation.
When designing with this FPGA, plan power-rail sequencing for the 1.5 V core, the PLL analog supply, and the I/O banks independently, because in-rush current on a fully populated 780-ball BGA can exceed 4 A during configuration. Use at least six PCB layers with dedicated ground planes, and follow Altera's Stratix Hardware Reference Manual for decoupling and via-in-pad layout. Designers migrating to newer families should note that Intel/Altera has since consolidated Stratix into Stratix II/III/IV/V/10, and the EP1S20 is now classified as a mature device with limited long-term support.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and Stratix-specific design notes that go beyond what is in the original Altera Stratix Device Family Data Sheet, giving an engineer a single source for sourcing, replacement, and board-level decision-making.
Drop-in-Alternativen für EP1S20F780I7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1S20F780I7N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Speed Grade, Configuration Method, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1S20F780C7N
✅ Drop-In✓ Auf Lager
$158.4 / Stück
Datenblatt ansehen →EP1S20F780I6N
✅ Drop-In✓ Auf Lager
$660 / Stück
Datenblatt ansehen →EP1S20F780C6N
✅ Drop-In✓ Auf Lager
$188.75 / Stück
Datenblatt ansehen →EP1S20F780C5N
✅ Drop-In✓ Auf Lager
$92 / Stück
Datenblatt ansehen →EP1S20F780I5N
✅ Drop-In✓ Auf Lager
$150 / Stück
Datenblatt ansehen →EP1S20F780I7N Grenzwerte & elektrische Eigenschaften
| Family | Stratix |
| Logic Elements (LEs) | 18,460 |
| Configurable Logic Blocks (CLBs) | 1,846 |
| Embedded Memory (bits) | 1,669,248 |
| User I/O Pins | 586 |
| Maximum Fabric Frequency | 420.17 MHz |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Speed Grade | I7 |
| Gehäuse | 780-ball FC-FBGA (Flip-Chip BGA) |
| Betriebstemperatur | -40 C to +100 C (Industrial) |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, LVDS (see datasheet) |
| Montageart | Surface Mount (BGA) |
| Configuration Method | Serial/Parallel passive or active (see datasheet) |
EP1S20F780I7N 780-ball fc-fbga (flip-chip bga) Pinbelegungsleitfaden
Pinbelegung für EP1S20F780I7N (780-ball fc-fbga (flip-chip bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1S20F780I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1S20F780I7N ist geeignet für 6 Anwendungs: High-Speed Data Acquisition and DSP, ASIC Prototyping and Emulation, Telecom Protocol Bridging and Framers, Industrial Vision and Machine Inspection, Military and Aerospace Signal Processing, Software-Defined Radio Baseband.
High-Speed Data Acquisition and DSP
The EP1S20F780I7N fits high-speed data acquisition because its 18,460 logic elements and dedicated DSP blocks can run parallel FIR filters, FFTs, and modulation pipelines at the 420 MHz fabric clock. The 586 user I/Os comfortably aggregate LVDS data streams from multiple high-speed ADCs, while the 1.66 Mbit of TriMatrix embedded memory buffers sample bursts between DSP passes. In a typical 4-channel 16-bit @200 MSPS digitizer, the FPGA handles decimation, channel calibration, and PCIe DMA handoff in a single device. Compared with a DSP+microcontroller split architecture, the integrated FPGA solution reduces board area by approximately 40 percent and removes inter-chip communication latency.
Empfohlen
ASIC Prototyping and Emulation
The 18,460 LEs and 1,669,248 bits of embedded memory make the EP1S20F780I7N a credible platform for ASIC prototyping of mid-complexity SoCs. Designers can partition the ASIC RTL across multiple FPGAs using Altera's Multi-FPGA partitioning flow, with the 780-ball FC-FBGA providing sufficient I/O to bridge between partitioned dies. The 130 nm process and 420 MHz fabric headroom allow real-time verification of the design at or near final ASIC clock rates. The device's JTAG and passive-serial configuration modes simplify bring-up in multi-FPGA test rigs, and the industrial temperature grade allows validation in thermally realistic environments.
Empfohlen
Telecom Protocol Bridging and Framers
Telecom protocol bridging exercises the EP1S20F780I7N's flexible SERDES-friendly I/O bank structure and its many general-purpose I/Os. The 586 user pins can simultaneously carry STS-12/STM-4 framers, E1/T1/J1 links, and Ethernet MAC interfaces without external bus switches. Industrial temperature rating and 1.5 V core operation suit central-office and outside-plant cabinets. The DSP blocks accelerate Reed-Solomon and Viterbi decoding at line rate, while the embedded TriMatrix memory serves as elastic stores and pointer-adjustment buffers. Compared with discrete framer ASICs plus a glue logic FPGA, a single EP1S20F780I7N cuts BOM cost and simplifies firmware upgrades over the field lifetime.
Empfohlen
Industrial Vision and Machine Inspection
Machine-vision systems rely on the EP1S20F780I7N's parallel LVDS channels to ingest Camera Link, CoaXPress-lite, or proprietary gigabit-vision streams from line-scan and area-scan cameras. The 1,669,248 bits of embedded memory store several scan lines in real time, and the DSP blocks accelerate edge detection, blob analysis, and pattern matching at line rate. The 780-ball FC-FBGA package is rugged enough for factory-floor vibration, and the -40 C to +100 C industrial temperature rating tolerates unconditioned control cabinets. A single FPGA can drive frame grabber, real-time preprocessing, and TCP/IP offload, replacing separate line-scan controller and processor boards.
Empfohlen
Military and Aerospace Signal Processing
Defense and aerospace programs use the EP1S20F780I7N for radar-baseband processing, electronic-warfare signal generation, and secure communications. The industrial -40 C to +100 C temperature range meets MIL-STD-810 environmental screening for many platforms, and the 130 nm process node has been thoroughly characterized for radiation effects. The 586 I/Os accommodate parallel ADC/DAC arrays feeding radar IF or EW receivers, and the embedded memory serves as a circular buffer for snapshot recording. Long-term availability is a known risk - design teams typically perform last-time-buy captures and migrate to radiation-hardened FPGAs such as Microsemi RTG4 for new programs.
Empfohlen
Software-Defined Radio Baseband
Software-defined radio baseband cards pair the EP1S20F780I7N with broadband ADC/DAC pairs to perform channelization, demodulation, and pulse shaping entirely in programmable logic. The 420 MHz fabric clock supports 100+ MHz of instantaneous bandwidth on 16-bit data paths, and the DSP blocks accelerate polyphase filter banks and digital down-converters. The 586 I/Os allow multiple antenna streams to be aggregated, while the 1.66 Mbit embedded memory holds symbol-rate buffers between detection and MAC processing. SDR developers frequently cite the EP1S20 as a sweet spot for prototype radios before moving to custom ASICs or newer Stratix families.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1S20F780I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1S20F780C7N | EP1S20F780I6N | EP1S20F780C6N | EP1S20F780C5N | EP1S20F780I5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 18,460 LEs | 18,460 LEs | 18,460 LEs | 18,460 LEs | 18,460 LEs | 18,460 LEs |
| Embedded Memory (bits) | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 |
| User I/O Pins | 586 | 586 | 586 | 586 | 586 | 586 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | I7 | C7 (commercial) | I6 (slower industrial) | C6 (slower commercial) | C5 (slowest commercial) | I5 (slowest industrial) |
| Operating Temperature | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade (I7) within EP1S20 industrial family (vs. EP1S20F780I6N)
- Industrial temperature range for harsh-environment deployment (vs. EP1S20F780C7N)
- 580+ I/Os in a single FC-BGA package (vs. EP1S20F484C7N)
Designhinweise
The EP1S20F780I7N requires multiple independent power rails: 1.5 V VCCINT (core), 1.5 V VCC_PLL (PLL analog supply - critical for jitter performance), and per-bank VCCIO supplies selectable from 1.5 V/1.8 V/2.5 V/3.3 V. In-rush current during configuration of a fully populated 780-ball BGA can exceed 4 A on the core rail, so size the bulk capacitor bank to at least 470 uF of polymer tantalum plus 22 uF of ceramic per rail. Sequence VCCINT before VCCIO to avoid I/O driver latch-up; Altera's PowerPlay early power estimator (legacy tool) gives worst-case numbers for full-utilization designs.
At full fabric utilization (estimated 80 percent LEs active, default toggle rate), the EP1S20F780I7N dissipates roughly 3-5 W on the 1.5 V core. The flip-chip BGA die-down package has a theta_JA in the 8-12 C/W range with a properly designed 6-layer PCB thermal pad array, so a 1 square-inch copper flood under the package keeps the junction below 100 C in 25 C ambient airflow. Estimated: assuming 4 W dissipation and theta_JA = 10 C/W, junction rise is 40 C above ambient - within the 100 C industrial limit but with limited margin.
Use a 6-layer (or thicker) PCB stack-up with two internal ground planes sandwiching the high-speed signal layers. For the 780-ball FC-FBGA, route signals on the top layer with micro-vias-in-pad (0.1 mm laser vias preferred) to break out to inner layers; avoid dog-bone fan-outs because inductance degrades signal integrity for LVDS and SSTL interfaces above 200 MHz. Decoupling: place 0.1 uF and 0.01 uF X7R ceramics on every VCC/VCCIO/VCC_PLL pin within 100 mil of the ball, with via pairs going directly to the inner ground plane.
Common pitfalls when designing with the EP1S20F780I7N include: (1) forgetting the PLL analog supply filter (a ferrite bead + 10 uF + 0.1 uF filter is mandatory); (2) configuring with the wrong MSEL[3..0] pull-resistor values, which prevents configuration; (3) failing to provide a clean CONF_DONE pull-up, which can hang the host during JTAG programming; (4) using the wrong BSDL file for JTAG boundary-scan test on a BGA variant, leading to test escapes. Always validate against the Stratix Device Family Data Sheet and Altera's AN 346: Configuring Stratix Devices before tape-out.
Differential-pair routing for LVDS channels must maintain 100 ohm differential impedance with length matching within 20 mil (0.5 mm). Reference each differential pair to a continuous ground plane and avoid crossing splits in the plane. For 200+ MHz DDR interfaces implemented in soft IP, use Altera's ALTDDIO megafunction and follow AN 449: Using DDR SDRAM with Stratix Devices for write-side timing closure.
Compliance-Informationen
RoHS/REACH/lead-free status not in provided data - [DATA_NEEDED]. AEC-Q100 not applicable for FPGAs (automotive qualification program is not typically pursued for this part family).
