EP1S20F780I6N - Stratix 18460-LE FPGA 780-FBGA Industrial | Intel
MPN: EP1S20F780I6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $881.32 | $881.32 |
| 10 | $820 | $8,200.00 |
| 100 | $760 | $76,000.00 |
| 250 | $705 | $176,250.00 |
| 500 | $660 | $330,000.00 |
Drop-in alternatives for EP1S20F780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S20F780I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$150 / Unit
View Datasheet →EP1S20F780I6
✅ Drop-In✓ In Stock
$720.38 / Unit
View Datasheet →EP1S20F780C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$188.75 / Unit
View Datasheet →EP1S20F780C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$158.4 / Unit
View Datasheet →EP1S20F780C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$92 / Unit
View Datasheet →EP1S20F780I6N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Logic Elements (LE) | 18460 |
| Logic Array Blocks (LABs) | 1846 |
| Total Memory Bits | 1669248 |
| User I/O Count | 586 |
| Number of LABs/CLBs | 1846 |
| Core Voltage | 1.5 V |
| Package | 780-BBGA, FCBGA |
| Package Pin/Ball Count | 780 |
| Ball Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Speed Grade | -6 |
EP1S20F780I6N 780 Pin Configuration Guide
Complete pinout information for EP1S20F780I6N (780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F780I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F780I6N is suitable for 6 applications: High-Speed Data Acquisition Front-End, Telecommunication Line Card / Backplane, Video Broadcast Infrastructure, Industrial Machine Vision and Control, Legacy Defense / Aerospace DSP Backplane, ASIC Prototyping and Emulation.
High-Speed Data Acquisition Front-End
The EP1S20F780I6N fits high-speed data-acquisition front-ends thanks to its 586 user I/O and up to 80 LVDS channels that aggregate parallel ADC outputs at hundreds of MSPS. The 1,669,248 bits of TriMatrix embedded memory absorb pre-trigger sample buffering, while 12 PLLs and 4 DLLs derive multiple independent sample clocks for time-interleaved ADC arrays. With 18,460 logic elements the device can run digital down-conversion, FIR filtering, and packet framing inline, offloading the host processor. Industrial temperature grade and abundant I/O simplify routing on multi-board digitizers.
Recommended
Telecommunication Line Card / Backplane
Stratix devices are widely deployed in telecom line cards and backplane bridging, where the EP1S20F780I6N's combination of 586 I/O, 80 LVDS pairs, and 1.5 V core makes it suitable for Switch-Fabric bridging, UTOPIA / POS-PHY interfaces, and SERDES-side framing glue. The 1,669,248-bit embedded memory holds packet descriptors and small lookup tables without external SSRAM. Industrial temperature support (-40 to +85 C) and the mature Quartus II toolchain keep legacy line-card platforms supportable. The 780-FBGA footprint allows dense routing on standard telecom backplane PCBs.
Recommended
Video Broadcast Infrastructure
Broadcast video routers and format converters rely on FPGA parallelism to handle uncompressed SDI, DVB-ASI, and HD-SDI streams. The EP1S20F780I6N delivers 586 I/O at LVDS/LVTTL rates suitable for multiple parallel video buses, while 6 embedded DSP blocks support real-time scaling and de-interlacing. Its industrial temperature grade supports equipment-room and outdoor head-end installations. Designers pair it with serializer/deserializer companion parts to extend reach over coax or fiber, leveraging Quartus II IP cores for SDI framer/deframer logic.
Recommended
Industrial Machine Vision and Control
Machine-vision controllers use FPGA parallelism to aggregate data from Camera-Link, GigE Vision, or LVDS-based image sensors and run pipelined image-processing algorithms. The EP1S20F780I6N provides 586 I/O for multi-camera head interfaces plus 18,460 logic elements for Sobel filtering, FFT, and histogram pipelines. Industrial temperature grade and the 780-FBGA footprint let designers place the FPGA close to high-speed image sensors on the same PCB. Quartus II SOPC Builder allows integration of a Nios-II soft-core for higher-level camera management.
Recommended
Legacy Defense / Aerospace DSP Backplane
Defense radar and electronic-warfare subsystems built in the 2000s deployed Stratix FPGAs as DSP co-processors, and the EP1S20F780I6N remains an active retrofit part on those platforms. Its 6 DSP blocks provide hundreds of 18x18 multipliers for FFT, FIR, and pulse-compression kernels; the 1.5 V core and 586 I/O support legacy VME/VXS backplane interfaces. Industrial temperature grade accommodates ground-mobile and sheltered-aerospace installations. The 780-BBGA FCBGA footprint matches existing card designs, allowing drop-in replacement during sustainment overhauls.
Recommended
ASIC Prototyping and Emulation
The EP1S20F780I6N is also used as a building block in multi-FPGA ASIC prototyping platforms. Its 18,460 logic elements can map a portion of an ASIC RTL, while 586 user I/O create the high-fanout channels that stitch adjacent FPGAs in the prototyping array. The 1,669,248-bit embedded memory emulates SRAM blocks of the target ASIC. Quartus II provides timing-driven place-and-route, and developers can partition an ASIC across several EP1S20F780 boards connected through 780-FBGA high-speed headers for early software bring-up.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F780I5N | EP1S20F780I6 | EP1S20F780C6N | EP1S20F780C7N | EP1S20F780C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) |
| Logic Elements | 18460 | 18460 | 18460 | 18460 | 18460 | 18460 |
| Speed Grade | -6 | -5 (faster) | -6 (same) | -6 (same) | -7 (slower) | -5 (faster) |
| Operating Temperature | -40 to +85 C (Industrial) | -40 to +85 C (Industrial) | -40 to +85 C (Industrial) | 0 to +70 C (Commercial) | 0 to +70 C (Commercial) | 0 to +70 C (Commercial) |
| Lead-Free / Pb-Free | Yes (N suffix) | Yes (N suffix) | No (leaded balls) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| User I/O Count | 586 | 586 | 586 | 586 | 586 | 586 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy |
Key Differentiators
- Faster speed grade -5 upgrade path within the same die (vs EP1S20F780I6)
- Lead-free Pb-free finish compliance (vs EP1S20F780I6)
- Industrial temperature range vs commercial siblings (vs EP1S20F780C6N)
- High I/O count 586 plus 80 LVDS pairs (vs EP1S20F484I6N (484-ball sibling))
Design Notes
The 780-BBGA FCBGA package uses a 1.0 mm ball pitch and requires a multi-layer PCB with via-in-pad or microvia technology to escape the inner balls. Designers should follow the Altera Stratix Hardware Reference Manual land-pattern dimensions, including a 0.6 mm pad diameter and 1.0 mm pitch. Power decoupling requires at least eight 0.1 uF ceramic capacitors placed immediately under or beside the BGA, plus bulk 47-100 uF tantalum or polymer capacitors on each VCCINT and VCCIO plane.
Although the EP1S20F780I6N is a 1.5 V device and dissipates less than its 3.3 V predecessors, sustained workloads on the 6 DSP blocks plus 80 LVDS channels can drive junction temperature into the high 70s C without airflow. The 780-FBGA thermal pad must be soldered to a continuous copper pour on the top layer connected to an internal ground plane through a thermal via array (0.3 mm vias on 1.0 mm grid). For sealed enclosures, derate by 25% above ambient or use 1-2 m/s forced airflow.
Configuration mode pins MSEL[2:0] must be tied to the correct logic levels for the chosen configuration scheme (AS, AP, PS, JTAG). A common pitfall is leaving MSEL floating, which prevents the device from reliably entering user mode. Also, when migrating from the EP1S20F780I6 to the EP1S20F780I6N (lead-free balls), ensure the PCB is rated for the higher reflow peak temperature (245 C vs 220 C for leaded) - otherwise the BGA will not fully collapse and joint reliability will be compromised.
LVDS channels on the Stratix EP1S20F780I6N require matched 100 ohm differential traces and external 100 ohm termination across the receiver pair. The Stratix Device Handbook specifies a maximum LVDS data rate of 840 Mbps per channel; running faster causes signal-integrity failures. Keep LVDS pairs within the same routing layer and avoid layer transitions on a single differential pair. Series AC-coupling capacitors on LVDS inputs must be 100 nF and placed near the receiver.
Compliance Information
The EP1S20F780I6N carries the 'N' suffix indicating lead-free ball finish per legacy Altera naming. RoHS, REACH, halogen-free, and conflict-mineral status were not explicitly stated in the verified web data; these are marked 'unknown' rather than assumed.
