EP1S20F780C6N - 18460 LEs Stratix FPGA, 780-FBGA | Intel
MPN: EP1S20F780C6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $265.5 | $2,655.00 |
| 100 | $235.8 | $23,580.00 |
| 500 | $210.2 | $105,100.00 |
| 1,000 | $188.75 | $188,750.00 |
Drop-in alternatives for EP1S20F780C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S20F780C6
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View Datasheet →EP1S20F780C7N
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View Datasheet →EP1S20F780C5N
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View Datasheet →EP1S20F780I6N
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$660 / Unit
View Datasheet →EP1S20F780C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 130 nm CMOS |
| Logic Elements (LEs) | 18,460 |
| Configurable Logic Blocks (CLBs) | 2,132 |
| Embedded Memory Bits | 1,669,248 |
| Memory Type | TriMatrix (M512 / M4K / M-RAM blocks) |
| DSP Blocks | Embedded 9x9 multiplier blocks |
| Maximum User I/O Pins | 586 |
| Package | 780-ball FC-FBGA (Fine-pitch BGA) |
| Package Dimensions | 29 x 29 mm, 1.0 mm pitch |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to +85 C (commercial) |
| Speed Grade | C6 (6 ns pin-to-pin delay class) |
| Maximum Internal Frequency | 450.05 MHz |
| Lead-Free / RoHS | Yes (lead-free) |
| Configuration Methods | PS, PPS, PPA, JTAG via EPC configuration device |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, PCI-X |
EP1S20F780C6N 29 x 29 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1S20F780C6N (29 x 29 mm, 1.0 mm pitch package) with 586 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F780C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 586 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F780C6N is suitable for 6 applications: Telecommunications Backplane Bridging, High-Speed Digital Signal Processing, Digital Video Broadcasting Equipment, RAID Storage Controllers, Software Defined Radio Prototyping, Network Test & Measurement Equipment.
Telecommunications Backplane Bridging
The EP1S20F780C6N suits telecom backplane bridging because its 586 user I/O pins provide direct parallel connection to multiple SFP/SFP+ cages, and its 18,460 LEs can implement 8b/10b encoding, CRC insertion, and rate-matching FIFOs. The TriMatrix M-RAM blocks (up to 4 Mbits per device) buffer packet bursts between ingress and egress channels without external SRAM, reducing BOM and latency. At C6 speed grade the device comfortably meets the 156.25 MHz reference clock required for GbE and 2.5G CPRI links when synthesized in Quartus II. Stratix DSP blocks implement Lane PCS encoding, allowing 32 channels of GbE SerDes adaptation without a companion ASSP.
Recommended
High-Speed Digital Signal Processing
For DSP applications such as radar pulse compression, software-defined radio, and medical imaging front-end, the EP1S20F780C6N delivers up to 224 DSP blocks each containing a 9-bit x 9-bit signed multiplier and 18-bit accumulator. At 450 MHz internal clock this provides approximately 56 GMACs of multiply-accumulate throughput, sufficient for a 1024-point FFT in under 25 microseconds. The TriMatrix memory architecture (M512 for coefficient storage, M4K for data working memory, M-RAM for sample buffer) eliminates external memory fetches in streaming pipelines, and 586 I/O pins support LVDS at 840 Mbps per pair for direct ADC/DAC interface.
Recommended
Digital Video Broadcasting Equipment
DVB-S2 modulators and H.264 encoders use the EP1S20F780C6N for LDPC and turbo decoding thanks to its high-density logic and embedded multiplier resources. The 18,460 LEs support the H.264 high-profile CABAC engine in a single device, while the 1.6 Mbit of TriMatrix memory holds multiple reference frames. The 780-ball FBGA package is layout-compatible with the Stratix II EP2S20F484C5N in board designs that provide a footprint migration path, and the C6 speed grade delivers the 148.5 MHz clock required for HDTV 1080p60 processing at 4:2:2 chroma sampling.
Recommended
RAID Storage Controllers
RAID 5/6 controllers benefit from the EP1S20F780C6N's parallel XOR and Galois-field computation logic. The embedded DSP blocks accelerate Reed-Solomon and parity computation across SATA-attached disks, while the 586 I/O pins support up to eight SATA host ports simultaneously (one pin per SATA data pair plus GPIO). The 1.5 V core supply and 0-85 C commercial temperature range make this FPGA a fit for use in standard server room environments, and the FBGA-780 package exposes enough balls for hot-swap SAS expander interfaces.
Recommended
Software Defined Radio Prototyping
Software-defined radio prototypes use the EP1S20F780C6N because its 586 I/O pins provide LVDS interfaces to multiple 14-16 bit ADC/DAC pairs at sampling rates up to 200 MSPS, and its DSP blocks implement digital down-conversion (DDC), digital up-conversion (DUC), and channelization filters. The TriMatrix memory holds sample buffers for RF snapshots, and the 1.5 V core draws only 1.2-1.5 W typical at 450 MHz. Designers can prototype GSM, WCDMA, and LTE physical layers in a single device before migrating to ASIC, with the Quartus II software providing C-to-HDL tools for fast algorithm iteration.
Recommended
Network Test & Measurement Equipment
High-end network protocol analyzers (10 GbE, OTU-2, FC-8G) leverage the EP1S20F780C6N's logic density to implement pattern generation, bit-error-rate testers, and protocol decode engines in a single chip. The 586 user I/O pins can interface to multiple XAUI lanes, and the embedded M-RAM blocks store deep capture buffers (up to 4 Mbits per device). At C6 speed grade, the FPGA comfortably drives 3.125 GHz XAUI serdes rates on the dedicated PLL outputs when paired with an external XAUI phy, and the FBGA-780 package supports BGA escape for 12+ layer PCBs required for high-speed signal integrity.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F780C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F780C6 | EP1S20F780C7N | EP1S20F780C5N | EP1S10F780C6N | EP1S20F780I6N |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 10,570 | 18,460 |
| User I/O | 586 | 586 | 586 | 586 | 426 | 586 |
| Embedded Memory | 1,669,248 bits | 1,669,248 bits | 1,669,248 bits | 1,669,248 bits | 920,448 bits | 1,669,248 bits |
| Speed Grade | C6 (6 ns) | C6 (6 ns) | C7 (7 ns) | C5 (5 ns) | C6 (6 ns) | I6 (industrial, 6 ns) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 to +85 C (commercial) | 0 to +85 C | 0 to +85 C | 0 to +85 C | 0 to +85 C | -40 to +100 C (industrial) |
| Lead-Free | Yes | No (SnPb) | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Lead-free solder balls with full RoHS compliance (vs EP1S20F780C6 (without N suffix))
- Balance of timing margin and cost at C6 speed grade (vs EP1S20F780C7N (faster speed grade))
- Higher density than the EP1S10 family at same package cost (vs EP1S10F780C6N (lower density same package))
Design Notes
The EP1S20F780C6N requires a 1.5 V core supply with a tolerance of plus/minus 50 mV; use a low-dropout regulator such as the TI TPS75501 followed by a ferrite bead and 4 x 100 uF ceramic decoupling per the Stratix PowerPlay Power Analyzer guidelines. Estimated: at 450 MHz internal clock and 75% logic utilization, the core draws approximately 1.2-1.5 W (label as estimate - consult Intel PowerPlay tool for your specific design). The auxiliary 3.3 V rail is shared with configuration logic and should not be ramped before VCCINT; allow a 100 ms delay after VCCINT stable before the VCCIO ramp.
Design the 12-layer PCB with continuous GND plane beneath the FBGA-780 footprint and one VCCINT plane adjacent to it for decoupling inductance minimization. The 1.0 mm BGA pitch requires 8 mil laser-drilled microvias with 12 mil pads for the breakout, per Intel AN 484: Stratix Device Package Information. Trace length matching of plus/minus 50 mil must be enforced for LVDS pairs across all 8 I/O banks, and signal integrity simulation in HyperLynx or ADS is recommended for any pair operating above 600 Mbps.
At 1.5 W typical dissipation in a 780-ball FC-FBGA with theta-JA of approximately 14 C/W (still air, JEDEC EIA/JESD51 test board), the junction temperature rise above ambient is approximately 21 C - well within the 0 to 85 C commercial range. Industrial variants (EP1S20F780I6N) extending to 100 C ambient will need forced-air cooling at 200 LFM or more to maintain 110 C junction limit. Estimated thermal calculation assumes 14 C/W theta-JA and 1.5 W typical; verify with your board layout using the Stratix thermal model (.fcs) file in Quartus II.
Do not power the device without a valid configuration bitstream loaded into the EPC16UC88 configuration ROM - leaving the FPGA in user-mode-without-bitstream state can cause all I/O to drive to unknown values and potentially back-power through I/O pins. Ensure JTAG chain order in your BSDL file matches the physical board layout (TDI -> device 1 -> TDO -> device 2 -> ... -> TDO), and tie nCONFIG high through a 4.7 kohm resistor if not actively driven. Unused I/O banks should be configured as input with weak pull-up via the Quartus Device & Pin Options dialog.
Compliance Information
RoHS compliant per JEDEC J-STD-033 marking (N suffix). REACH compliance verified through Intel material declaration. AEC-Q100 not applicable - this is a commercial-grade FPGA. Industrial variant EP1S20F780I6N available for -40 to +100 C operation but is not AEC-Q100 qualified.
