EP1S20F780C5N - Stratix 18460-Cell FPGA, 780-BGA | Intel (Altera)
MPN: EP1S20F780C5N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
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View Datasheet →EP1S20F780C5N Maximum Ratings & Electrical Characteristics
| Device Family | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 18460 |
| Logic Array Blocks (LABs) | 1846 |
| Embedded Memory | 1,669,248 bits |
| User I/Os | 586 |
| Package | 780-ball FCBGA (780-BBGA) |
| Package Dimensions | 29 x 29 mm, 1 mm pitch |
| Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Maximum Internal Frequency | 500 MHz |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Configuration Method | SRAM-based, JTAG or external configuration device |
| Mounting Type | Surface Mount |
EP1S20F780C5N 29 x 29 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S20F780C5N (29 x 29 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F780C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F780C5N is suitable for 6 applications: Telecommunications Line-Card Logic, High-Speed DSP Prototyping, Test and Measurement Instrumentation, Industrial Imaging and Machine Vision, Aerospace Avionics Data Concentrators, Legacy Networking Switch Control Plane.
Telecommunications Line-Card Logic
The EP1S20F780C5N's 18460 logic elements and 1,669,248 bits of TriMatrix memory make it well-suited for telecom line-card backplane glue logic, custom protocol bridging, and HDLC/Ethernet packet assembly. At 500 MHz internal fMAX and 586 user I/Os, it can sustain multiple SERDES-friendly LVDS interfaces and aggregate framing logic on a single chip. The 780-ball FCBGA package provides high signal-integrity density for dense backplane designs, while dedicated PLL resources permit precise clock synthesis from telecom-grade references. Compared with discrete ASIC solutions, the EP1S20F780C5N allows late-stage protocol changes during telecom equipment qualification cycles.
Recommended
High-Speed DSP Prototyping
With on-chip DSP blocks optimized for fixed- and floating-point arithmetic, the EP1S20F780C5N supports prototyping of FIR/FFT pipelines, radar signal-processing chains, and SDR baseband processing. The 1.6 Mbit embedded memory block pool allows line buffering of multi-MSample waveforms without external SRAM, and the 500 MHz fabric supports clock rates aligned with ADC/DAC sample rates. Engineers can map FFT butterflies and channelizer filters directly into hardware, achieving deterministic latency unattainable on microcontrollers. The FCBGA-780 footprint accommodates the high pin count required for parallel LVCMOS or LVDS ADC/DAC interfaces.
Recommended
Test and Measurement Instrumentation
The EP1S20F780C5N integrates timing, pattern generation, and protocol decoding logic into a single reconfigurable platform for use in logic analyzers, protocol exercisers, and ATE subsystems. Its 586 user I/Os map to high-channel-count probe interfaces, while embedded memory holds capture buffers and pattern sequences. Designers benefit from JTAG reconfiguration for field updates of measurement firmware. The commercial 0 to 85 °C operating range covers typical lab and factory-floor environments, and the high pin count supports simultaneous acquisition of multiple high-speed buses (PCI, LVDS, parallel TTL) on one device.
Recommended
Industrial Imaging and Machine Vision
The EP1S20F780C5N's high I/O count and embedded memory pool are well-matched to multi-camera image-processing pipelines, including Bayer reconstruction, lens-distortion correction, and frame buffering. Its fabric can implement real-time convolution kernels and feature-extraction operators, while the FCBGA-780 footprint provides the high pin density required for Camera Link or LVDS-based image-sensor interfaces. Embedded TriMatrix memory holds intermediate frame lines, reducing external memory bandwidth pressure. Compared with general-purpose CPUs, the FPGA delivers deterministic per-pixel latency required for synchronized multi-camera inspection rigs.
Recommended
Aerospace Avionics Data Concentrators
Although the EP1S20F780C5N is a commercial-temperature variant, it is widely deployed in lab and ground-test avionics data concentrators where 0 to 85 °C operation is sufficient. The 1846 LABs and 1.6 Mbit memory map comfortably to MIL-STD-1553 bridges, ARINC 429 receivers, and discrete I/O aggregation typically found in flight-line test racks. Reconfigurability accelerates late-binding of platform-specific signal mappings, and JTAG-based in-system programming permits field updates. Engineers integrating this part should pay attention to the I/O bank's tolerance to legacy avionics voltages via level-shifting buffers.
Recommended
Legacy Networking Switch Control Plane
The EP1S20F780C5N provides the logic density required for table management, packet classification, and forwarding-engine glue logic in legacy Layer-2/3 switching platforms. Its embedded memory supports CAM-like TCAM emulation and flow-record buffering, while the 586 I/Os allow direct connection to switch-fabric ASICs and management PHYs. The 500 MHz fabric supports line-rate classification on 1 Gbps Ethernet ports with deterministic latency. For new designs, this remains a mature, software-supported target within the Altera Quartus II flow, although the part itself is approaching end-of-life.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F780C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F780C5 | EP1S20F780C6N | EP1S20F780C7N | EP1S10F780C5N | EP1S10F780C7N | EP1M350F780C5N |
|---|---|---|---|---|---|---|---|
| Package | 780-ball FCBGA (29 x 29 mm, 1 mm pitch) | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 18460 | 18460 | 18460 | 18460 | ~10570 | ~10570 | Mercury family architecture |
| Embedded Memory (bits) | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | [DATA_NEEDED] | [DATA_NEEDED] | Mercury family architecture |
| User I/Os | 586 | 586 | 586 | 586 | 586 | 586 | [DATA_NEEDED] |
| Speed Grade | -5 | -5 | -6 | -7 | -5 | -7 | -5 |
| Operating Temperature | 0 to 85 °C (commercial) | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C |
| Configuration Method | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG | SRAM + JTAG |
Key Differentiators
- Highest density EP1S20 part in the Stratix family with 18460 logic elements (vs EP1S10F780C5N)
- Faster -5 speed grade versus -6 and -7 family members (vs EP1S20F780C7N)
- TriMatrix embedded memory pool of 1.6 Mbits eliminates external SRAM in many designs (vs EP1K50FC484)
Design Notes
The EP1S20F780C5N's 780-ball FCBGA requires a 29 x 29 mm, 1 mm pitch land pattern with via-in-pad or dogbone fan-out per Altera packaging guidelines. Use a minimum 4-layer stack-up with continuous ground and power planes directly beneath the device; keep all signal via stubs under 0.5 mm to preserve signal integrity on LVDS and SSTL interfaces at 500 MHz.
Stratix devices require multiple supply rails (VCCINT core, VCCIO banks, VCC_PLL, VCC_GXB if applicable). Decouple each rail with 0.1 µF and 10 µF capacitors placed as close as possible to the BGA balls, and use a power-sequencing controller to satisfy Altera's required rail rise times. Estimated: at 1.5 V VCCINT and 70% logic utilization, expect 2 to 4 W of core dissipation; budget the regulator accordingly.
Common pitfalls with EP1S20F780C5N designs include (1) leaving JTAG pins floating - they must be pulled per Altera's guidelines, (2) omitting the external configuration device or pull-ups on nCONFIG/nSTATUS/CONF_DONE, and (3) using incorrect I/O standard assignments for banks sharing VCCIO levels. Refer to the Stratix Device Handbook pin tables before finalizing pin assignments.
Although the commercial-grade EP1S20F780C5N is rated to 85 °C, high logic utilization in the 780-ball FCBGA can produce significant junction temperature rise. Estimated: at full 18460 LE utilization the part may dissipate 3 to 5 W; design the PCB with thermal vias under the die and consider forced-air cooling for chassis-level integration.
Compliance Information
Specific RoHS, REACH, and lead-free compliance information was not present in the verified web data and is marked as [DATA_NEEDED]. Commercial temperature grade only; AEC-Q100 qualification not applicable to this commercial-grade FPGA.
