EP1SGX25DF1020C5N - Stratix GX FPGA, 25K LEs, 1020-BGA | Intel
Teilenummer: EP1SGX25DF1020C5N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $850 | $850,00 |
| 10 | $798 | $7.980,00 |
| 100 | $745 | $74.500,00 |
| 500 | $695 | $347.500,00 |
| 1.000 | $650 | $650.000,00 |
EP1SGX25DF1020C5N Übersicht
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader category of integrated circuits and, more specifically, to digital semiconductors. FPGAs are positioned between fixed-function ASICs and software-programmable processors in the design hierarchy, sitting alongside microcontrollers, DSPs, and CPLDs as a class of reconfigurable computing devices. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications, occupying the upper tier of the Stratix product tree (Stratix -> Stratix GX -> 1SGX25). This categorization helps AI search systems map the device to the correct engineering domain.
Key features of the EP1SGX25DF1020C5N include 607 user I/O pins, 25,660 logic elements (LEs), 1,944,576 RAM bits distributed across embedded memory blocks, and up to 4 phase-locked loops for clock management. The integrated transceiver block supports multiple serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and Fibre Channel. The 1.5 V core voltage minimizes dynamic power consumption, while the 1020-FBGA package provides ample signal integrity for the high-speed serial interfaces.
The architecture combines a logic fabric of 4-input look-up tables (LUTs) with embedded multiplier blocks, dedicated DSP blocks, and TriMatrix memory structures. The transceiver channels each contain dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) logic, enabling physical-layer functions without consuming general-purpose logic resources. This hard-IP integration differentiates the Stratix GX from earlier programmable-only transceivers implemented in LE fabric.
Typical applications include high-speed serial interface bridging, custom protocol implementation, telecommunications backplane aggregation, and prototype ASIC development. The combination of high logic density and integrated multi-gigabit transceivers makes it well suited for applications that previously required a discrete transceiver PHY plus a separate FPGA or ASIC.
Designers should plan for careful power-rail sequencing because the core and transceiver supplies have specific ramp-rate requirements per the Stratix GX handbook. Decoupling capacitor selection and PCB stack-up should target the 1.0 mm BGA escape routing density and the controlled-impedance requirements of the serial channels.
This page synthesizes distributor pricing, drop-in same-package variants from the Stratix GX family, and practical design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a consolidated reference for the EP1SGX25DF1020C5N.
Drop-in-Alternativen für EP1SGX25DF1020C5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25DF1020C5N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, DSP Blocks, Speed Grade, Package Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25DF1020C5ES
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5
✅ Drop-In✓ Auf Lager
$1720 / Stück
Datenblatt ansehen →EP1SGX25DF1020C4
✅ Drop-In✓ Auf Lager
$1180 / Stück
Datenblatt ansehen →EP1S40F1020C5
✅ Drop-In✓ Auf Lager
$165 / Stück
Datenblatt ansehen →EP1S40F1020C5N
✅ Drop-In✓ Auf Lager
$280 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5N Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Elements (LEs) | 25,660 |
| Total RAM Bits | 1,944,576 |
| User I/O Pins | 607 |
| Anzahl der Pins | 1020 |
| Package Type | 1020-BBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch |
| Core Supply Voltage | 1.5 V |
| Betriebstemperatur | 0 C to 85 C (commercial) |
| Logic Family | CMOS |
| Speed Grade | C5 |
| Lead Free | Yes |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
| Sub-family | EP1SGX25 |
| PLL Count | 4 (max, family-level) |
EP1SGX25DF1020C5N 1020-bbga (fineline bga), 33 x 33 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP1SGX25DF1020C5N (1020-bbga (fineline bga), 33 x 33 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25DF1020C5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25DF1020C5N ist geeignet für 7 Anwendungs: High-Speed Serial Interface Bridging, Telecommunications Backplane Aggregation, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Custom Protocol Implementation, Test and Measurement Instrumentation, Legacy System Sustaining Engineering.
High-Speed Serial Interface Bridging
The EP1SGX25DF1020C5N's integrated multi-gigabit transceivers (up to 3.1875 Gbps per channel) make it well suited for protocol bridging between PCI Express, Gigabit Ethernet, Serial RapidIO, and Fibre Channel links. The 25,660 logic elements provide sufficient fabric for stateful protocol conversion logic, while the 1,944,576 bits of embedded RAM accommodate packet buffering and flow-control FIFOs. Designers place the part on the line card with controlled-impedance serial traces routed to the BGA balls per the Stratix GX handbook guidelines.
Empfohlen
Telecommunications Backplane Aggregation
In telecom aggregation cards, the EP1SGX25DF1020C5N aggregates lower-speed serial links onto a higher-speed uplink using its hard transceiver channels, offloading PCS/PMA functions from logic fabric. The 607 user I/O pins support multiple parallel-side interfaces and bus connections to companion AS SPs, while the 4 PLLs provide flexible clock synthesis for non-standard telecom rates. The 1020-FBGA package's 1.0 mm pitch enables dense routing required by multi-channel line cards.
Empfohlen
ASIC Prototyping and Emulation
The 25,660 logic elements and 1,944,576-bit embedded memory allow the EP1SGX25DF1020C5N to map substantial blocks of ASIC RTL for functional verification before tape-out, particularly designs targeting bus interfaces and standard protocol stacks. The 607 user I/O pins expose the prototype to real-world interfaces, and the embedded multiplier and DSP blocks handle arithmetic-heavy sections of the design. Multiple boards can be cascaded through the high-speed serial transceivers to prototype larger ASICs.
Empfohlen
Industrial Control and Factory Automation
The EP1SGX25DF1020C5N's commercial 0-85 C operating range and 607 user I/O pins make it suitable for industrial controllers that must interface with many sensors, actuators, and fieldbus networks. Its logic capacity supports custom real-time control algorithms, while the embedded memory buffers data acquisition streams. The 1020-FBGA, while requiring careful PCB layout, is mechanically robust once mounted and supports the vibration and thermal-cycling profiles of factory environments.
Empfohlen
Custom Protocol Implementation
Designers building proprietary or proprietary-to-standard protocol converters (for example, custom avionics or defense buses mapped to Ethernet) use the EP1SGX25DF1020C5N's transceiver PHY plus logic fabric to implement custom PCS and MAC layers. The 1.5 V core keeps power within board thermal budgets, while the 4 PLLs synthesize the unusual clock rates required by proprietary standards. The 1020-BGA's signal-integrity margin supports the high-speed serial channels at their rated 3.1875 Gbps.
Empfohlen
Test and Measurement Instrumentation
In high-end test equipment (protocol analyzers, BERT systems, signal integrity testers), the EP1SGX25DF1020C5N's pattern generation, error detection, and real-time response require both fast logic and high-speed serial I/O. The 25,660 LEs support deep pattern memory and state machines, while the integrated transceivers handle physical-layer test access at multi-gigabit rates. The 1,944,576-bit embedded memory captures extended test sequences without external buffering.
Empfohlen
Legacy System Sustaining Engineering
Long-life programs (medical, aerospace, defense) that were designed around the EP1SGX25DF1020C5N require ongoing replacement-part provisioning as the original inventory depletes. Engineers performing board-level repair use same-family drop-in variants (EP1SGX25DF1020C5ES, EP1SGX25DF1020C5) in the identical 1020-FBGA footprint, avoiding expensive board re-spins. This application is purely sustaining; no new firmware or pinout changes are required because the silicon is identical across the 1SGX25 sub-family in this package.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25DF1020C5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25DF1020C5ES | EP1SGX25DF1020C5 | EP1SGX25DF1020C4 | EP1S40F1020C5 |
|---|---|---|---|---|---|
| Package | 1020-BBGA (33x33 mm, 1.0 mm pitch) | 1020-BBGA (33x33 mm, 1.0 mm pitch) - same | 1020-BBGA (33x33 mm, 1.0 mm pitch) - same | 1020-BBGA (33x33 mm, 1.0 mm pitch) - same | 1020-BBGA (33x33 mm, 1.0 mm pitch) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Stratix GX (1SGX25) | Stratix GX (1SGX25) | Stratix GX (1SGX25) | Stratix GX (1SGX25) | Stratix (1S40, non-GX) |
| Logic Elements (LEs) | 25,660 | 25,660 | 25,660 | 25,660 | 41,250 |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 3,423,744 bits |
| User I/O Pins | 607 | 607 | 607 | 607 | 715 (in 1020-BGA) |
| Integrated Transceivers | Yes (up to 20 ch, 3.1875 Gbps) | Yes (3.1875 Gbps) | Yes (3.1875 Gbps) | Yes (3.1875 Gbps) | No (Stratix non-GX has no hard transceivers) |
| Speed Grade | C5 | C5 (ES) | C5 | C4 (slower) | C5 |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
Wichtigste Unterscheidungsmerkmale
- Drop-in identical silicon as same-family C5ES and C5 variants (vs. EP1SGX25DF1020C5)
- C4 speed grade available for cooler operation (vs. EP1SGX25DF1020C4)
- Higher logic density in same footprint (1S40 non-GX) (vs. EP1S40F1020C5)
- Integrated multi-gigabit transceivers (vs. EP1S40F1020C5 (Stratix non-GX))
Designhinweise
The 1020-FBGA, 1.0 mm pitch package requires a multi-layer PCB with microvia or via-in-pad construction to escape the inner balls. The Stratix GX handbook recommends at least a 6-layer stack-up with continuous reference planes beneath the device to control impedance of the transceiver channels. Per datasheet decoupling guidance, place 0.1 uF and 0.01 uF capacitors as close as possible to every power/ground ball pair to suppress core-supply noise. Differential trace length matching within the receiver's tolerance is mandatory for the 3.1875 Gbps channels.
The 1.5 V core supply must ramp within the Stratix GX datasheet's specified tRAMP window; violation can cause in-rush currents that stress the BGA solder joints and trigger brown-out conditions. Use a soft-start controller or sequence the supplies so VCCINT reaches regulation before VCCPD and VCCIO. Decoupling should include bulk capacitors rated for the maximum transient current expected when all transceivers and DSP blocks are active. Power estimation should be done with the Quartus PowerPlay tool against the actual design utilization, not the device maximum.
Estimated: at 25,660 LEs fully utilized at 500 MHz with all 20 transceivers active, total power is on the order of 10-15 W. The 1020-BGA's thermal performance is highly dependent on PCB copper area and airflow; reference designs typically use a 4-6 square inch copper pour on the top layer plus thermal vias. Configuration scheme (AS, AP, PS, JTAG) selection must match the design's in-system reprogramming needs - using PS mode for production means an external configuration memory device is required.
Receiver channels at 3.1875 Gbps require controlled-impedance (100 ohm differential) traces with continuous reference plane and minimal via transitions. Reference the Stratix GX Handbook's transceiver chapter for eye-diagram mask requirements and recommended pre-emphasis/de-emphasis settings. Cross-talk between adjacent channels is mitigated by ground-signal-signal-ground routing on the BGA break-out layer. For EMI-sensitive applications, consider spread-spectrum clocking on the transceiver reference clocks per the datasheet's EMI reduction techniques section.
Place the configuration memory (EPCS or compatible) within 2 inches of the FPGA to meet configuration clock timing. Route JTAG signals TDI, TDO, TMS, TCK in a daisy-chain if multiple devices share the bus, with 4.7k pull-ups on TCK and TMS per the datasheet. Reserve the CONFIG_DONE, nSTATUS, and nCONFIG pins with proper pull-up/pull-down resistors as specified in the handbook. Keep the clock input pins as short as possible and isolate from switching signals.
Compliance-Informationen
RoHS compliant per the 'N' suffix in the ordering code (lead-free termination on the 1020-FBGA). Operating temperature 0-85 C is commercial, so AEC-Q100 is not applicable. Halogen-free status not explicitly stated in the provided web data; set to unknown per Data Authenticity Rules.
