EP1SGX25DF1020C7N - 25,660 LEs Stratix GX FPGA, 1020-FBGA | Intel
MPN: EP1SGX25DF1020C7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
Drop-in alternatives for EP1SGX25DF1020C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DF1020C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O | 607 |
| Number of Transceivers | 20 (embedded multi-gigabit) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | C7 (commercial) |
| Operating Temperature | 0 °C to 85 °C |
| Package Type | 1020-ball FC-FBGA |
| Package Dimensions | 33 mm × 33 mm, 1.0 mm ball pitch |
| Mounting Type | Surface Mount |
| Lead Free | Yes |
| RoHS Status | Compliant |
EP1SGX25DF1020C7N 33 mm × 33 mm, 1.0 mm ball pitch Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C7N (33 mm × 33 mm, 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C7N is suitable for 7 applications: 10 Gbps Network Switching and Routing, Wireless Baseband Processing, Radar and SIGINT Front-End Processing, Broadcast Video Processing and Conversion, High-Performance Computing Coprocessor, Industrial Imaging and Machine Vision, Protocol Offload Engine for Storage and Networking.
10 Gbps Network Switching and Routing
The EP1SGX25DF1020C7N is well suited to 10 Gbps line-card designs where 20 embedded multi-gigabit transceivers up to 3.1875 Gbps can be aggregated into XAUI / 10 GbE links or SerialLite II backplane channels. With 25,660 logic elements, 1,944,576 embedded RAM bits, and hardened PCI Express endpoint IP, the device can implement forwarding tables, traffic managers, and protocol offload alongside the high-speed serial I/O. Engineers typically use the FC-FBGA-1020 footprint to escape four XAUI ports plus several lower-speed SGMII links on a single 12-layer board.
Recommended
Wireless Baseband Processing
The 25,660 logic elements combined with 1,944,576 bits of TriMatrix embedded memory and dedicated DSP blocks make the EP1SGX25DF1020C7N a strong fit for wireless baseband PHY implementations such as WCDMA, LTE, and WiMAX pre-aggregation. The embedded transceivers handle CPRI or OBSAI links to the RF front-end, while the fabric runs channel decoding, FFT/iFFT, and rate-matching. Commercial 0°C to 85°C operation covers indoor and outdoor cabinet environments typical of base-station deployments.
Recommended
Radar and SIGINT Front-End Processing
Defense and electronic-warfare applications leverage the EP1SGX25DF1020C7N's combination of 20 multi-gigabit transceivers, large TriMatrix memory, and DSP blocks to implement high-speed ADC capture, digital downconversion, and pulse compression. The transceivers accept LVDS or serial data directly from high-speed ADCs, and the embedded RAM buffers raw I/Q samples for FFT and matched-filter processing. The 1020-ball FC-FBGA package provides the I/O and power distribution required for heat-dissipating, high-clock-rate defense designs.
Recommended
Broadcast Video Processing and Conversion
The EP1SGX25DF1020C7N's 25,660 logic elements and 1,944,576 embedded RAM bits enable multi-stream SD/HD/3G-SDI processing, format conversion, and on-screen graphics overlay. Serial digital interface transceivers interface directly to SDI PHY chips, while the FPGA fabric handles scaling, de-interlacing, and color-space conversion. The C7 speed grade supports the clock rates required for 3G-SDI at 2.97 Gbps through external PHY plus internal data-path processing.
Recommended
High-Performance Computing Coprocessor
The EP1SGX25DF1020C7N functions as a PCI Express endpoint coprocessor in HPC servers and storage arrays, offloading search, compression, encryption, or DSP workloads from the host CPU. The hard PCI Express core provides x1/x4/x8 connectivity up to Gen1 rates, while the transceivers carry 10 GbE or SerialLite II to neighboring FPGAs or backplanes. The 607 user I/O pins expose local memory buses (DDR/DDR2) and QDR II SRAM interfaces for high-bandwidth working memory.
Recommended
Industrial Imaging and Machine Vision
Multi-camera machine-vision systems use the EP1SGX25DF1020C7N to aggregate Camera Link, CoaXPress, or LVDS image streams via the embedded transceivers, then perform real-time preprocessing, color conversion, and feature extraction in the FPGA fabric. The 1,944,576 embedded RAM bits buffer line-scan or area-scan frames, while the 25,660 logic elements host the image-processing pipeline. The commercial 0°C to 85°C range covers typical factory-floor thermal envelopes.
Recommended
Protocol Offload Engine for Storage and Networking
Storage OEMs deploy the EP1SGX25DF1020C7N as a TCP/IP offload engine, iSCSI accelerator, or RAID accelerator card, using the PCI Express hard core for host connectivity and the 20 transceivers for SAS/SATA aggregation or 10 GbE uplink. The 1,944,576 embedded RAM bits hold descriptor rings and reassembly buffers, while the 25,660 logic elements execute the offload state machines. The 1020-ball FC-FBGA package provides sufficient I/O to interface with multiple SAS/SATA PHYs and external DDR2 memory.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C6N | EP1SGX25DF1020C5N | EP1SGX25DF1020C7 | EP1SGX25DF1020C7ES |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same |
| Speed Grade | C7 | C6 (one bin faster) | C5 (two bins faster) | C7 (same) | C7 engineering sample |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Transceivers | 20 (up to 3.1875 Gbps) | 20 (up to 3.1875 Gbps) | 20 (up to 3.1875 Gbps) | 20 (up to 3.1875 Gbps) | 20 (up to 3.1875 Gbps) |
| User I/O | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- 20 embedded multi-gigabit transceivers at 3.1875 Gbps in a single device (vs EP1SGX25CF672C7N (672-ball variant))
- Hardened PCI Express endpoint IP core (vs Soft PCI Express IP on a logic-only FPGA)
- Last Time Buy status means prompt action is required (vs Active Stratix IV GX (EP1SGX40F1508C7N))
Design Notes
The Stratix GX family requires multiple independently-decoupled supply rails: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V I/O banks), VCCA (PLL analog), VCCP (PCI Express), and transceiver-specific VCCE/VCCT/RREF rails. Each rail needs its own bulk capacitors plus 0.1 µF and 0.01 µF high-frequency decoupling placed within 100 mils of the relevant balls. Sequencer ICs such as the LTC2923 or ADP1828 should enforce the required power-up and power-down ordering documented in the Stratix GX handbook to avoid latch-up.
Estimated: at typical utilization (60% logic, 50% RAM, all 20 transceivers active at 3.125 Gbps), the EP1SGX25DF1020C7N dissipates approximately 12-15 W. The 33 mm × 33 mm FC-FBGA-1020 package has a junction-to-ambient thermal resistance (θJA) of approximately 8 °C/W with a properly designed 12-layer PCB thermal via array under the package. Without thermal vias, junction temperature can exceed 100 °C; thermal simulation in the Quartus II PowerPlay tool is required before sign-off.
The 1020-ball FC-FBGA with 1.0 mm ball pitch requires high-density interconnect (HDI) PCB fabrication with laser-drilled microvias. Stack-up should be 12 layers minimum to escape all 20 transceiver channels plus 607 user I/O without excessive via stubs. Transceiver differential pairs must be 100 Ω ±10% with intra-pair length matching within 5 mil, and length-matched to the reference clock within 50 mil for 3.125 Gbps operation.
Do not confuse the EP1SGX25DF1020C7N (1020-ball FC-FBGA, 20 transceivers) with the EP1SGX25CF672C7N (672-ball FBGA, fewer transceivers) - the two are NOT drop-in compatible despite sharing the same silicon die. The Quartus II fitter must be re-run for any speed-grade or package change because I/O assignment files (.qsf) are package-specific.
Compliance Information
RoHS and lead-free per manufacturer datasheet. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Conflict-mineral compliance per Intel published statement.
