EP1SGX25DF672I5 - Stratix GX FPGA, 25K LE, 672-FBGA | Altera
Teilenummer: EP1SGX25DF672I5 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $485 | $485,00 |
| 10 | $460 | $4.600,00 |
| 100 | $420 | $42.000,00 |
| 500 | $385 | $192.500,00 |
| 1.000 | $355 | $355.000,00 |
EP1SGX25DF672I5 Übersicht
What is a Stratix GX FPGA? A Field Programmable Gate Array is a reconfigurable digital logic device whose logic fabric, routing, and I/O cells are defined by user-supplied bitstream configuration rather than fixed ASIC masks. The Stratix GX family is Altera's high-speed serial transceiver family, sitting one tier above general-purpose Stratix devices in the programmable logic hierarchy: Stratix GX -> Stratix family -> FPGA -> programmable logic -> digital IC. GX variants integrate up to twenty multi-gigabit transceivers alongside the general-purpose logic fabric, enabling PHY-level serial connectivity at line rates of 1 Gbps to 3.125 Gbps without external serializer/deserializer devices.
Key features of the EP1SGX25DF672I5 include 1,944,576 bits of embedded memory, dedicated DSP blocks for fixed- and floating-point arithmetic, four phase-locked loops for clock management, and military-grade temperature operation from -55C to +125C. The 672-ball FC-FBGA package supports high pin-count integration of LVDS, LVTTL, LVCMOS, and high-speed transceiver I/O standards, with the flip-chip interconnect providing superior electrical performance over wire-bond packages at multi-gigahertz frequencies.
Architecturally, the device combines a lookup-table-based logic fabric, TriMatrix embedded memory blocks, embedded multipliers, and dedicated transceiver channels. The 130 nm process technology was industry-leading at introduction and remains adequate for many legacy designs; however, it is now a mature node and the part is generally classified as a legacy or NRND component.
Typical applications include custom protocol bridging across backplanes, gigabit Ethernet media access controllers, Serial RapidIO and PCI Express endpoint implementations, telecom line-card signal processing, and military/aerospace embedded computing platforms where the I5 temperature grade is required.
When designing with this device, allocate ample PCB area for the 672-ball FC-FBGA, which requires microvia or via-in-pad technology for reliable assembly. Verify Quartus II support level and confirm the part has not transitioned to NRND status before committing to new designs.
This page synthesizes distributor pricing, drop-in Stratix GX alternatives, and practical design notes not collected in any single manufacturer datasheet.
Drop-in-Alternativen für EP1SGX25DF672I5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25DF672I5 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Process Technology, Speed Grade, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25DF672C5
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →EP1SGX25DF672C6
✅ Drop-In✓ Auf Lager
$96.5 / Stück
Datenblatt ansehen →EP1SGX25DF672C7
✅ Drop-In✓ Auf Lager
$125.4 / Stück
Datenblatt ansehen →EP1SGX25DF672C7N
✅ Drop-In✓ Auf Lager
$245 / Stück
Datenblatt ansehen →EP1SGX25CF672C7
✅ Drop-In✓ Auf Lager
$340 / Stück
Datenblatt ansehen →EP1SGX25DF672I5 Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Embedded Memory Bits | 1,944,576 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Gehäuse | 672-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Operating Temperature Grade | Military (-55C to +125C) |
| Form of Terminal | Ball |
| Package Code | BGA |
| Package Shape | Square |
| Number of Terminals | 672 |
| Montageart | Surface Mount |
EP1SGX25DF672I5 square Pinbelegungsleitfaden
Pinbelegung für EP1SGX25DF672I5 (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25DF672I5.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25DF672I5 ist geeignet für 6 Anwendungs: Gigabit Ethernet Backplane Interface, Serial RapidIO Endpoint, Custom Chip-to-Chip Bridge, Telecom Line-Card Signal Processing, Military Embedded Computing, Industrial High-Speed Data Acquisition.
Gigabit Ethernet Backplane Interface
The EP1SGX25DF672I5's integrated multi-gigabit transceivers deliver 1.25 Gbaud and 3.125 Gbaud line rates ideal for tri-speed Gigabit Ethernet PHY interfaces across backplane channels. With 25,660 logic elements and dedicated DSP blocks, the device can implement a soft MAC plus PCS layer alongside user logic, eliminating an external PHY or framer ASIC. The military temperature grade allows deployment in ruggedized telecom line cards. PCB layout must enforce controlled-impedance differential traces and AC-coupling capacitors on each serial lane.
Empfohlen
Serial RapidIO Endpoint
Serial RapidIO links between DSP clusters and host processors require low-latency, packet-switched interconnects at 1.25 to 3.125 Gbaud. The EP1SGX25DF672I5 provides enough transceiver channels to implement a 1x or 4x Serial RapidIO endpoint in firmware, and the 25,660 logic elements accommodate the link-layer controller plus customer application logic. The military-grade temperature window supports avionics and shipboard embedded computing applications. Designers should reference the RapidIO Interconnect Specification for transport-layer compliance.
Empfohlen
Custom Chip-to-Chip Bridge
Custom serial interfaces between ASICs, ASSPs, and FPGAs benefit from the EP1SGX25DF672I5's programmable transceiver pre-emphasis, equalization, and encoding. The 130 nm process and 1.5 V core supply yield robust signal integrity over FR-4 backplanes with two to four inches of trace length. Up to twenty transceiver channels can be partitioned across multiple proprietary or standard serial protocols. The flip-chip BGA package reduces inductance on critical high-speed lanes compared to wire-bond equivalents.
Empfohlen
Telecom Line-Card Signal Processing
Telecommunications line cards combine high-speed serial framer interfaces with channel-processing DSP. The EP1SGX25DF672I5 integrates both functions: the transceiver channels terminate OC-48 or 1G/2G fiber links while the embedded multipliers and DSP blocks perform forward error correction, echo cancellation, or cross-connect switching. Military temperature operation enables deployment in outdoor and ruggedized cabinets. Designers should reference the Altera AN 467 application note for transceiver board-design guidelines.
Empfohlen
Military Embedded Computing
Defense and aerospace platforms demand components rated for the full -55C to +125C operating window, and the EP1SGX25DF672I5 with its I5 military temperature grade meets that requirement. The device integrates logic fabric, memory, multipliers, and multi-gigabit transceivers into a single IC, simplifying SWaP-C-optimized embedded computing designs. System integrators should verify the Altera/Intel product change notification history and long-term continuity of supply before committing to multi-year defense programs.
Empfohlen
Industrial High-Speed Data Acquisition
High-speed data acquisition systems for test and measurement benefit from the EP1SGX25DF672I5's combination of high-speed transceivers and DSP capability. Serializer/deserializer functions, channel aggregation, and real-time preprocessing can all be implemented within the 25,660 logic elements and 1,944,576 embedded memory bits. The military temperature grade allows deployment in extreme industrial environments such as oil exploration downhole tools or rail transportation. Quartus II DSP Builder accelerates fixed- and floating-point filter implementation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25DF672I5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25DF672C5 | EP1SGX25DF672C6 | EP1SGX25DF672C7 | EP1SGX25DF672C7N | EP1SGX25CF672C7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Temperature Grade | Military (I5, -55C to +125C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I5 | C5 (fastest commercial) | C6 | C7 (slowest commercial) | C7 (Pb-free finish) | C7 (CF core variant) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Embedded Memory Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Military temperature grade (-55C to +125C) (vs. EP1SGX25DF672C5)
- Integrated multi-gigabit transceivers (vs. EP1S25F672I7 (non-GX Stratix))
- Flip-chip FC-FBGA package (vs. Wire-bond BGA variants in same family)
Designhinweise
The 672-ball FC-FBGA package has a fine ball pitch (typically 1.0 mm) that requires microvia or via-in-pad PCB technology for reliable breakout routing. Standard through-hole vias cannot be placed within the BGA land pattern, so plan stack-up with sequential lamination and high-density interconnect (HDI) from the start. Allow at least four PCB layers dedicated to high-speed transceiver routing beneath the device to maintain 100 ohm differential impedance for serial lanes.
Estimated: in still air without heatsinking, the FC-FBGA package dissipates thermal energy primarily through the PCB. At a typical 130 nm Stratix GX core power of 4 to 6 W during full transceiver utilization, expect junction temperature rise of 18 to 28 C/W depending on copper area and airflow. Use thermal vias under the package and at least four PCB inner planes stitched with thermal vias to keep Tj below the 125 C military limit. Reference Altera AN 465 for thermal management guidance.
Differential transceiver lanes must use 100 ohm controlled-impedance routing with continuous reference plane and AC-coupling capacitors placed close to the receiver pins. Match trace lengths within each lane to within 5 mils to avoid inter-symbol interference, and use series capacitors between 0.01 uF and 0.1 uF with broadband RF response. Configure pre-emphasis and equalization settings through the Quartus II ALT2GXB megafunction to compensate for channel loss.
Do not substitute a commercial-grade (C5/C6/C7) part into a design whose thermal profile extends outside 0C to +85C - electrical parameters are only guaranteed within that window. The military I5 grade is required for any deployment that may see temperatures above 85C or below 0C. Also confirm Quartus II version compatibility; older Quartus releases may not support newer configuration bitstreams and the I5 speed grade.
Compliance-Informationen
Compliance status not explicitly stated in the Verified Web Data for this MPN. The 'N' suffix on related variants (e.g. EP1SGX25DF672C7N) indicates lead-free terminal finish per Altera naming convention, but specific RoHS/REACH compliance certificates should be requested from Altera/Intel for the I5 grade.
