EP1SGX25DF672C5 - Stratix GX FPGA 25K LE 672-FBGA | Intel
MPN: EP1SGX25DF672C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 100 | $235 | $23,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $198 | $198,000.00 |
Drop-in alternatives for EP1SGX25DF672C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25CF672C5
✅ Drop-In✓ In Stock
$1304.99 / Unit
View Datasheet →EP1SGX25DF672C7
✅ Drop-In✓ In Stock
$125.4 / Unit
View Datasheet →EP1SGX25DF67216
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP1SGX25DE672C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1SGX10CF672C5
✅ Drop-In📋 Reference alternative (not in catalog)
EP1SGX25DF672C5 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix GX |
| Logic Family | CMOS |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 25,660 |
| Embedded Memory Bits | 1,944,576 |
| User I/Os | 455 |
| Number of Pins / Terminals | 672 |
| Package Type | FBGA-672 (672-BGA, 33 × 33 mm, 1 mm pitch) |
| Package Code | BGA, Square |
| Mounting Type | Surface Mount |
| Supply Voltage | 1.5 V (core) |
| Speed Grade | C5 |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Lead Free / RoHS | Lead Free, RoHS compliant |
| Embedded Transceivers | Up to 20 channels (3.125 Gbps) |
EP1SGX25DF672C5 bga, square Pin Configuration Guide
Complete pinout information for EP1SGX25DF672C5 (bga, square package) with 672 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF672C5.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF672C5 is suitable for 6 applications: Gigabit Ethernet Aggregation Switch, Serial RapidIO Backplane Bridge, PCI Express Endpoint / Root Complex, Wireless Baseband Processing Card, Broadcast Video Glue Logic, High-Speed Datapath / ASIC Prototyping.
Gigabit Ethernet Aggregation Switch
The EP1SGX25DF672C5 is well-suited for multi-port Gigabit Ethernet aggregation in access and edge switches. Its 20 embedded transceiver channels at 1.25 Gbps directly support 20 SGMII/SerDes links to PHY devices, while the 25,660 LEs implement MAC, VLAN tagging, QoS classification, and forwarding logic. The 1,944,576 bits of tri-matrix memory absorbs packet bursts and lookup-table caching for L2/L3 forwarding. Compared with a discrete MAC-plus-CPU design, the integrated transceivers eliminate external PHY glue and reduce BOM cost, while Quartus II megafunctions (alt2gxb, altgxb) simplify XAUI/SGMII instantiation. Designers should budget margin for transceiver reference-clock jitter per the Stratix GX handbook.
Recommended
Serial RapidIO Backplane Bridge
Stratix GX was architected for Serial RapidIO (SRIO) backplane bridging in DSP and telecom backplane designs. The EP1SGX25DF672C5's 3.125 Gbps transceivers provide ample headroom for 1x and 4x SRIO links at 1.25 / 2.5 / 3.125 Gbps per lane, while the embedded DSP/multiplier blocks accelerate the message-passing logic and CRC computation. The 25,660 LEs and 455 user I/Os let designers implement multi-port bridges with parallel local-bus interfaces to TI DSPs (TMS320C6000 series) or PowerPC processors. Pin-compatible migration to EP1SGX25CF672C7 is straightforward when designs cannot close timing at C5.
Recommended
PCI Express Endpoint / Root Complex
The EP1SGX25DF672C5 implements PCI Express Gen 1 (2.5 Gbps) endpoints and root complexes using its embedded transceivers and the altpciexmegafunction in Quartus II. The device's 25,660 LEs handle the PIPE and transaction layer, while 455 user I/Os drive the local application side (e.g., packet classification, DMA engines). At Gen 1 speeds of 2.5 Gbps, each transceiver has ~20% margin; designers targeting Gen 2 (5 Gbps) should migrate to Stratix II GX. The 672-FBGA package provides ample board-routing escape for the x4/x8 PCIe lane widths.
Recommended
Wireless Baseband Processing Card
Wireless baseband line cards use the EP1SGX25DF672C5 for forward-error-correction (Turbo, Viterbi), crest-factor reduction (CFR), and digital predistortion (DPD) — all of which exploit the device's dedicated multiplier/DSP blocks. The 20 embedded transceivers connect to the backplane via SRIO or CPRI (with appropriate PHY), while the 25,660 LEs implement multi-antenna MIMO datapaths for 3G/4G base stations. The commercial 0–85 °C grade suits indoor base-station shelves; for outdoor remote-radio-head (RRH) deployments, designers should select the industrial EP1SGX25DF672I6N variant in the same 672-FBGA package.
Recommended
Broadcast Video Glue Logic
The EP1SGX25DF672C5 excels in broadcast video routers, format converters, and timing-stripping applications that demand high I/O count and serial connectivity. Its 455 user I/Os support HD/SD-SDI input and output channels (via external SDI PHY), while the embedded transceivers carry SDTI or DVB-ASI streams at 270 Mbps / 1.485 Gbps. The 1,944,576 bits of tri-matrix memory provide line buffers and audio-embedding FIFOs. Designers should leverage Quartus II's SDI megafunction and audio-embedding cores to accelerate development.
Recommended
High-Speed Datapath / ASIC Prototyping
The EP1SGX25DF672C5 serves as a flexible ASIC prototyping vehicle for high-speed serial interfaces and parallel datapaths. Its 25,660 LEs, embedded transceivers, and 455 user I/Os allow engineers to validate designs that would otherwise require a multi-million-gate ASIC. Quartus II's design partitioning and incremental compilation features map cleanly onto the Stratix GX fabric. For multi-FPGA prototyping of larger ASICs, multiple EP1SGX25DF672C5 or EP1SGX40F1020C7 devices can be tiled, with transceivers handling inter-board interconnect at 3.125 Gbps.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF672C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25CF672C5 | EP1SGX25DF672C7 | EP1SGX25DF67216 | EP1SGX25DE672C7 | EP1SGX10CF672C5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-FBGA (33x33 mm) | 672-FBGA (33x33 mm) - same | 672-FBGA (33x33 mm) - same | 672-FBGA (33x33 mm) - same | 672-FBGA (33x33 mm) - same | 672-FBGA (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 10,570 (-59%) |
| Memory Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 920,448 (-53%) |
| User I/Os | 455 | 455 | 455 | 455 | 455 | 338 (-26%) |
| Speed Grade | C5 | C5 | C7 (slower) | C5-equivalent | C7 | C5 |
| Operating Temperature | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C |
| Transceiver Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest transceiver count in the Stratix GX '25' density tier (vs EP1SGX10CF672C5)
- Fastest speed grade available in EP1SGX25 family (vs EP1SGX25DF672C7)
- Same-package compatibility with industrial temperature variants (vs EP1SGX25DF672I6N)
Design Notes
The EP1SGX25DF672C5 requires multiple supply rails per the Stratix GX data sheet: 1.5 V core (VCCINT), 1.5 V/2.5 V/3.3 V I/O banks (VCCIO), 2.5 V PLL analog (VCCA_PLL), and 1.2 V/3.3 V transceiver supplies (VCCHIP/LVDS). Decouple each rail with bulk (220 µF) plus distributed 0.1 µF + 10 µF ceramic capacitors placed within 5 mm of the relevant balls. Use a Ferrite bead on the analog PLL supply to isolate switching noise. Estimated: a fully utilized EP1SGX25 with 20 active transceivers at 3.125 Gbps can dissipate 8–12 W — verify with PowerPlay Early Power Estimator in Quartus II before final BOM release.
The 672-FBGA's 1.0 mm ball pitch and 33 × 33 mm body require 6–8 layer PCB stack-ups with controlled-impedance (50 Ω SE, 100 Ω diff) routing for transceiver lanes. Use 4 mil laser-drilled microvias with stacked-via structures, and route high-speed transceiver pairs on the top layer adjacent to the BGA. Breakout via pattern should follow the manufacturer's land-pattern recommendation. Estimate: total transceiver loss budget at 3.125 Gbps is ~10 dB channel loss — run pre-layout SI simulations with the IBIS-AMI model provided by Intel/Altera.
Common pitfalls with the EP1SGX25DF672C5 include (1) failing to provide the auxiliary reference-clock pins (REFCLK_*) with proper 100 ppm clocks — jitter above this budget causes link-training failure; (2) leaving the nCONFIG pin floating in multi-FPGA systems, causing unintended reconfiguration; (3) using 3.3 V LVCMOS on a bank set to 2.5 V VCCIO — always match VCCIO to the I/O standard; (4) ignoring MSL (Moisture Sensitivity Level) pre-bake requirements for the FBGA — bake at 125 °C for 24 hours before assembly if floor-life has expired. Also verify the Quartus II version supports your device variant — versions before 4.0 do not support EP1SGX25 family.
Compliance Information
Lead-free and RoHS compliant per Altera FBGA-672 package marking. C5 suffix indicates commercial temperature grade (0–85 °C); for AEC-Q100 automotive qualification this part is not applicable — designers should not use EP1SGX25 in automotive safety-critical applications. Halogen-free status and conflict-minerals compliance are not stated in the verified data; set to unknown per data-authenticity rules.
