EP1SGX25DF672C6 - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
MPN: EP1SGX25DF672C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $119.75 | $11,975.00 |
| 500 | $108 | $54,000.00 |
| 1,000 | $96.5 | $96,500.00 |
Drop-in alternatives for EP1SGX25DF672C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX25DF672C5N
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View Datasheet →EP1SGX25DF672C5
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View Datasheet →EP1SGX25CF672C6
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View Datasheet →EP1SGX25CF672C5
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View Datasheet →EP1SGX10DF672C6N
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View Datasheet →EP1SGX25DF672C6 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 25,660 LE |
| Number of LABs | 2,566 |
| Total RAM Bits | 1,944,576 bits |
| User I/O Count | 455 |
| Number of Transceivers | 6 channels (per Stratix GX family) |
| Max Transceiver Data Rate | 3.125 Gbps |
| Core Voltage | 1.5 V |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 672-BBGA FineLine BGA |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Lead-Free (per FBGA suffix family) |
| Process Technology | CMOS |
EP1SGX25DF672C6 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX25DF672C6 (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF672C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF672C6 is suitable for 6 applications: Telecom Backplane Serial Interconnect, Industrial Imaging and Video Processing, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Broadcast Video and Studio Equipment, Medical Imaging Systems.
Telecom Backplane Serial Interconnect
The EP1SGX25DF672C6's 6 embedded multi-gigabit transceivers operating up to 3.125 Gbps make it well suited for telecom line-card backplane designs requiring Serial RapidIO, XAUI, or custom chip-to-chip links. With 25,660 logic elements, the device can implement protocol state machines, buffer management, and link-layer logic without external PHYs. The 672-ball BGA exposes 455 user I/Os for parallel side-band signals, MDIO management interfaces, and front-panel status LEDs. Engineers typically pair this FPGA with external clock synthesizers and SFP/SFP+ cages, using the on-chip PLLs to derive multiple clock domains from a single backplane reference. Compared to discrete SERDES implementations, the integrated transceivers reduce board area by 30-40% and simplify signal-integrity validation. The 1.0 mm ball pitch allows routing on standard 6-layer FR-4 stackups with controlled-impedance differential pairs. Power consumption is dominated by the transceivers at full link utilization, so thermal analysis with the full 27 x 27 mm footprint is recommended.
Recommended
Industrial Imaging and Video Processing
Industrial camera systems and machine-vision pipelines benefit from the EP1SGX25DF672C6's combination of 25,660 LE and 1.94 Mbit embedded RAM. Designers implement Bayer-to-RGB conversion, gamma correction, edge detection, and JPEG compression directly in the FPGA fabric, offloading the host CPU. The 6 transceivers can drive Camera Link HS, CoaXPress, or custom LVDS links to downstream frame grabbers, while the 455 user I/Os interface to parallel image sensors, GPIO, and synchronization signals. The 1,944,576-bit TriMatrix memory provides line buffers and lookup tables for color-space conversion without consuming external SRAM. The commercial 0-85C operating range covers most factory-floor environments, and the lead-free 672-BGA package is compatible with standard reflow profiles. Compared to fixed-function image signal processors, this FPGA allows complete algorithm customization per product variant.
Recommended
Military and Aerospace Signal Processing
Defense and aerospace programs have historically adopted the Stratix GX family for radar signal processing, electronic warfare, and secure communication systems where the 6 multi-gigabit transceivers and 25K LE fabric provide the right balance of capacity and I/O bandwidth. The 672-BGA package supports ruggedized board assembly with underfill for high-vibration environments, and the mature silicon process offers extensive in-field reliability data. Designers implement FFT pipelines, digital down-conversion, and beamforming directly in the FPGA, with the transceivers streaming digitized RF data to and from analog front-ends. The 1.94 Mbit embedded memory supports windowing tables and intermediate sample buffers. For systems requiring wider temperature operation, the -I suffix variant EP1SGX25DF672I6 should be substituted. Compliance with ITAR export controls applies to specific part variants; sourcing through authorized distributors ensures chain-of-custody.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers leverage the EP1SGX25DF672C6 to aggregate multiple high-speed data lanes into a single processing pipeline. The 6 transceivers provide enough serial bandwidth to capture 10 Gbps aggregate data streams, while the 25,660 logic elements implement trigger logic, pattern matching, and hardware-accelerated compression. The 455 user I/Os connect to front-panel displays, keypad matrices, and high-speed ADC/DAC devices on the same instrument board. Quartus II's TimeQuest timing analyzer accurately closes timing on the 1.0 mm BGA at 300 MHz internal clock rates. The 672-FBGA package's 1.0 mm pitch accommodates dense analog and digital routing on a single substrate, reducing the bill-of-materials versus two-chip FPGA-plus-GPU implementations. Engineers building automated test equipment benefit from the device's JTAG-based configuration, which supports field firmware updates over USB or Ethernet.
Recommended
Broadcast Video and Studio Equipment
Broadcast video routers, switchers, and contribution encoders rely on the EP1SGX25DF672C6's multi-gigabit transceivers to handle SDI over IP (SMPTE ST 2022, ST 2110) and uncompressed SDI streams up to 3 Gbps. The 25,660 logic elements implement multiviewer compositing, audio embedding/de-embedding, and ancillary data processing without external ASSPs. The 1.94 Mbit embedded memory provides frame buffers for video scaling and format conversion. With 455 user I/Os, the device connects to HDMI receivers, display port controllers, and audio CODECs via parallel LVCMOS interfaces. The commercial 0-85C temperature range and lead-free 672-BGA package meet broadcast equipment manufacturing requirements. Compared to dedicated video processors, this FPGA allows studios to support evolving codecs and IP standards through firmware updates rather than hardware replacement.
Recommended
Medical Imaging Systems
Ultrasound beamformers, CT reconstruction engines, and MRI digitizers use the EP1SGX25DF672C6 to process multiple parallel data channels with deterministic latency. The 6 transceivers aggregate data from analog front-end ADCs running at gigasample-per-second rates, while the 25K logic elements implement digital beamforming, envelope detection, and image reconstruction kernels. The 1,944,576-bit embedded memory supports channel-data ping-pong buffering during real-time processing. The 455 user I/Os connect to touch-panel interfaces, hospital-network PHYs, and storage controllers. Compliance with IEC 60601-1 medical safety standards requires careful isolation design around the 1.5 V core supply; Intel's medical reference designs include recommended bypass networks. The mature 1.5 V CMOS process offers extensive long-term-reliability data suitable for medical device qualification cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF672C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF672C5N | EP1SGX25CF672C6 | EP1SGX10DF672C6N | EP1S25F672C6 |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel | Intel | Intel | Intel |
| Package | 672-BBGA FineLine BGA | 672-BBGA FineLine BGA | 672-BBGA FineLine BGA | 672-BBGA FineLine BGA | 672-BBGA FineLine BGA |
| Logic Elements | 25,660 LE | 25,660 LE | 25,660 LE | 10,570 LE | 25,660 LE (non-GX) |
| Transceiver Channels | 6 | 6 | 6 | 6 | 0 (no transceivers) |
| Max Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | N/A |
| Speed Grade | C6 | C5 (slower) | C6 | C6 | C6 |
| Total RAM Bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 940,032 bits | 1,944,576 bits |
| User I/O Count | 455 | 455 | 455 | 455 | 455 |
Key Differentiators
- Embedded multi-gigabit transceivers (vs EP1S25F672C6)
- Full 25K LE density with transceivers (vs EP1SGX10DF672C6N)
- C6 speed grade for timing margin (vs EP1SGX25DF672C5N)
Design Notes
The 672-BGA package at full transceiver utilization (6 channels at 3.125 Gbps, PRBS31) dissipates approximately 4-6 W, dominated by the SERDES PMA blocks. The 27 x 27 mm package's 1.0 mm ball pitch limits direct PCB heat conduction to inner power planes; use at least a 6-layer stackup with two dedicated ground planes and continuous copper pours stitched with thermal vias under the BGA. For closed-enclosure systems, validate with worst-case industrial temperature models, since junction-to-ambient thermal resistance typically exceeds 12 C/W without airflow.
Route all 6 transceiver differential pairs with 100 ohm differential impedance on the top microstrip layer directly above an unbroken ground plane. Use 4 mil trace width and 7 mil trace spacing on standard 8 mil FR-4 prepreg to hit the 100 ohm target. Add ground stitching vias every 200 mil along the pair edges and at every layer transition. The reference clock input pins require the same controlled-impedance treatment, with series AC coupling capacitors placed within 250 mil of the FPGA ball.
Stratix GX power-on sequencing requires VCCINT (1.5 V) to ramp before or simultaneously with VCCPD, with no more than 200 mV of reverse current at any time. Failure to follow the sequencing diagram in the datasheet can cause long-term reliability degradation. Configuration mode (AS, PS, JTAG) must be selected via MSEL pins before VCCINT ramps - leaving these pins floating triggers undefined behavior. Use the dedicated CLR/reset pulse of at least 10 us after configuration completes before releasing user I/O.
Separate analog and digital ground domains with a single-point tie under the BGA center to avoid ground-loop noise coupling into the transceiver analog supply pins. The transceiver PLL analog supply (VCCHIP) requires its own LC filter network with 1 uH ferrite and 10 uF + 0.1 uF decoupling. Keep all 672 balls' decoupling capacitors within 100 mil of their respective power pins; missing bulk decoupling is the most common cause of intermittent transceiver link failures in production.
Compliance Information
Lead-free per FBGA suffix family (DF/FineLine). RoHS and REACH compliant per Altera/Intel product documentation. Not AEC-Q100 qualified (commercial/industrial grade FPGA). Intel is a member of the Responsible Minerals Initiative.
