EP1SGX25FF1020C5ES - Stratix GX FPGA 25.66K LE FC-FBGA1020 | Intel
Teilenummer: EP1SGX25FF1020C5ES ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $248 | $2.480,00 |
| 100 | $198 | $19.800,00 |
| 500 | $168 | $84.000,00 |
| 1.000 | $142 | $142.000,00 |
EP1SGX25FF1020C5ES Übersicht
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets designers implement arbitrary digital logic via a hardware description language. FPGAs sit within the programmable logic family, which belongs to the broader category of application-specific integrated circuits and ultimately to digital semiconductors. Unlike fixed-function ASICs, FPGAs can be re-programmed in the field, accelerating prototyping and reducing NRE costs for low-to-medium volume designs.
Key features of the EP1SGX25FF1020C5ES include up to 20 embedded transceivers with clock data recovery (CDR), embedded multiplier blocks and TriMatrix memory blocks for DSP-style data paths, support for transceiver-based protocols including PCI Express, Serial RapidIO, Gigabit Ethernet and XAUI, and a 33 × 33 mm FC-FBGA package with 1.0 mm ball pitch. The architecture combines dedicated silicon for high-speed serial I/O with general-purpose programmable fabric, a hybrid that has defined Stratix GX since its 2003 introduction as a flagship Altera/Intel communications FPGA.
Typical applications include high-speed serial backplanes, line cards for telecommunications switches, DSP co-processing for wireless base stations, and protocol bridging ASIC/ASSP replacements. The 1020-pin package and 25.66K logic element density target mid-range to high-end designs where both logic capacity and multi-gigabit serial connectivity are required on a single die.
When designing with this part, allocate sufficient PCB area for the 33 × 33 mm FC-FBGA footprint, use a multi-layer stackup with dedicated ground/power planes for the transceiver supply rails, and follow Altera's Stratix GX pin connection guidelines for unused transceiver channels. Thermal management is essential because the FC-FBGA junction-to-ambient thermal resistance is high; heatsinks or airflow are typically required in production.
This page synthesizes distributor pricing, drop-in Stratix GX family alternatives, and practical design notes not found in the manufacturer datasheet alone. Engineers searching for a pin-compatible second source for a legacy Stratix GX design will find the EP1SGX25FF1020C5ES family alternatives listed below, all sharing the same 1020-ball FC-FBGA footprint.
Drop-in-Alternativen für EP1SGX25FF1020C5ES – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25FF1020C5ES (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Speed Grade, Package Type, Package, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25FF1020C5
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP1SGX25FF1020C4
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP1SGX25F1020C6
✅ Drop-In✓ Auf Lager
$645 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5ES
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP1SGX25DF1020C6ES
✅ Drop-In✓ Auf Lager
$285 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5
✅ Drop-In✓ Auf Lager
$1720 / Stück
Datenblatt ansehen →EP1SGX25FF1020C5ES Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V nominal (1.425 V to 1.575 V) |
| Transceiver Channels | Up to 20 |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel |
| Aggregate Serial Bandwidth | 127.5 Gbps full-duplex |
| Gehäuse | FC-FBGA-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) |
| Pin-Anzahl | 1020 |
| Logic Family | CMOS |
| Betriebstemperatur | 0 °C to +85 °C (commercial) |
| Speed Grade | C5 (Enhanced) |
| Temperature Grade Suffix | ES (Enhanced) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant (lead-free) |
| Lead-Free | Yes |
EP1SGX25FF1020C5ES fc-fbga-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) Pinbelegungsleitfaden
Pinbelegung für EP1SGX25FF1020C5ES (fc-fbga-1020 (33 × 33 mm, 1.0 mm pitch, lead-free)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25FF1020C5ES.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25FF1020C5ES ist geeignet für 6 Anwendungs: Telecom Line Card / Serial Backplane, Wireless Base Station DSP Co-Processing, PCI Express Endpoint / Root Complex, High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO), Industrial Test & Measurement Instrumentation, Legacy Defence Avionics / Mission Computing.
Telecom Line Card / Serial Backplane
The EP1SGX25FF1020C5ES is well suited for telecom line cards and serial backplanes because it integrates up to 20 multi-gigabit transceivers (500 Mbps to 3.1875 Gbps each) alongside 25,660 logic elements for framing, queueing and protocol processing. Placed on a 1020-ball FC-FBGA, the device supports standard telecom SERDES protocols (XAUI, Gigabit Ethernet, Serial RapidIO) directly from Altera IP cores, eliminating external PHY chips. The 1.5 V core supply and 0-85 °C commercial range meet ATCA/cPCI line-card thermal envelopes, while the 1020-ball package provides ample user I/O for parallel sideband and control signals.
Empfohlen
Wireless Base Station DSP Co-Processing
In wireless base-station designs the EP1SGX25FF1020C5ES serves as a DSP co-processor offloading baseband channel cards, Crest Factor Reduction (CFR) and Digital Pre-Distortion (DPD) from the host DSP. Its 25,660 logic elements, embedded multiplier blocks and TriMatrix memory deliver the throughput required for multi-carrier 3G/4G signal chains, while the 1.5 V core keeps power within the typical 8-12 W per-channel envelope. The 1020-ball FC-FBGA also allows the Stratix GX transceiver IP to receive digitized IF from analog front-ends over CPRI or OBSAI links.
Empfohlen
PCI Express Endpoint / Root Complex
The EP1SGX25FF1020C5ES is commonly used as a PCI Express endpoint or root-complex bridge card in legacy compute and storage systems. Altera's Stratix GX PCI Express hard IP leverages the embedded transceivers at 2.5 Gbps, while the 25,660 LE fabric implements the application layer, DMA engines and any legacy bus bridges. The 1020-ball FC-FBGA footprint suits ATX/PCIe add-in card form factors, and the 1.5 V core supply is straightforward to derive from standard ATX rails.
Empfohlen
High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO)
Designers deploy the EP1SGX25FF1020C5ES as a protocol-conversion bridge between XAUI, Serial RapidIO, and Gigabit Ethernet domains in storage and defence platforms. The transceiver channels provide the SERDES physical layer at data rates from 500 Mbps up to 3.1875 Gbps, and the 25,660 logic elements implement the link-layer state machines and traffic managers. The 1020-ball FC-BGA supplies enough user I/O to expose parallel GMII/SGMII control or sideband GPIO to a host ASIC.
Empfohlen
Industrial Test & Measurement Instrumentation
The EP1SGX25FF1020C5ES fits bench-top and rack-mount test instruments that combine high-speed digitiser interfaces with on-board DSP analysis. The transceiver channels accept serial ADC data at multi-gigabit rates, while the 25,660 logic elements plus embedded multipliers perform FFTs, digital down-conversion and trigger logic in real time. The 1.5 V core and 0-85 °C commercial range suit lab-environment thermal envelopes, and the 1020-ball FC-FBGA exposes abundant GPIO for front-panel display and front-end control.
Empfohlen
Legacy Defence Avionics / Mission Computing
The EP1SGX25FF1020C5ES is used in long-life defence and avionics platforms where design reuse, software stability and field-ruggedized boards outweigh the appeal of newer FPGAs. Its MIL-PRF-grade power-on behaviour, mature Altera Quartus tool flow, and the ample 25,660 LE/20-channel SERDES combination make it ideal for mission computers, sensor pre-processors and MIL-STD-1553-to-Ethernet bridges. The 1020-ball FC-FBGA is well understood for thermal management in conduction-cooled VPX chassis.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25FF1020C5ES – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25FF1020C5 | EP1SGX25FF1020C4 | EP1SGX25F1020C6 | EP1SGX25DF1020C5ES |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-1020 (33x33, 1.0 mm) | FC-FBGA-1020 (33x33, 1.0 mm) - same | FC-FBGA-1020 (33x33, 1.0 mm) - same | FC-FBGA-1020 (33x33, 1.0 mm) - same | FC-FBGA-1020 (33x33, 1.0 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Speed Grade | C5 (Enhanced) | C5 (standard) | C4 (slower) | C6 (faster) | C5 (Enhanced) |
| Operating Temperature | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C |
Wichtigste Unterscheidungsmerkmale
- Enhanced speed/temperature grade suffix 'ES' vs standard 'C5' (vs. EP1SGX25FF1020C5)
- 20 high-speed transceivers integrated on-die (vs. EP1S25F1020C5)
- 1020-ball FC-FBGA maximum I/O count vs smaller FF672 package (vs. EP1SGX25F672C7)
Designhinweise
The 1020-ball FC-FBGA uses 1.0 mm pitch on a 33 × 33 mm body. Use microvia or via-in-pad PCB technology (laser-drilled microvias, 0.1 mm finished hole) on at least the top layer to escape the dense ball grid, plus buried vias for inner-layer fan-out. Plan a 1 oz copper 6+ layer stackup with continuous ground and 1.5 V core planes directly under the BGA to provide low-impedance return paths for the 20 multi-gigabit transceivers.
The FC-FBGA junction-to-ambient thermal resistance is high because the die is flip-chip bonded without a traditional heat-spreader lid. In a 6-layer board with minimal copper, expect theta_JA in the 15-20 °C/W range; a Stratix GX device fully populating 20 transceivers at 3.1875 Gbps can dissipate 8-12 W. Add a thermal-via array under the die and either a heatsink or 200 LFM forced-air cooling to keep Tj below 100 °C in production.
Always follow Altera's Stratix GX pin connection guidelines for unused transceiver channels - leave unused TX pins open with the TX disable bit set, and tie unused RX pins to a defined DC voltage through the recommended resistor-divider. Do not share reference clock outputs between transceiver blocks without an external buffer if channel-to-channel skew is critical. Estimated: based on Stratix GX Device Handbook guidance.
Route transceiver channels as 100 ohm differential pairs with intra-pair skew under 5 mil and length matching to within 25 mil across all channels in a group. Use AC-coupling capacitors (0.01 uF) close to the TX pins; do not place DC bias resistors on AC-coupled links. Separate PLL analog supplies (VCC_PLL) from digital 1.5 V with a ferrite bead and a dedicated LDO to minimize jitter impact.
Compliance-Informationen
Lead-free FC-FBGA confirmed by Alldatasheet listing 'LEAD FREE, FBGA-1020'. RoHS compliance inferred from the lead-free package designation per the Stratix GX datasheet. AEC-Q100 not applicable for commercial-grade FPGAs. REACH, halogen-free and conflict-minerals status not directly confirmed in the verified web data.
