EP1SGX25FF1020C5ES - Stratix GX FPGA 25.66K LE FC-FBGA1020 | Intel
MPN: EP1SGX25FF1020C5ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $248 | $2,480.00 |
| 100 | $198 | $19,800.00 |
| 500 | $168 | $84,000.00 |
| 1,000 | $142 | $142,000.00 |
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View Datasheet →EP1SGX25FF1020C5ES Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V nominal (1.425 V to 1.575 V) |
| Transceiver Channels | Up to 20 |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel |
| Aggregate Serial Bandwidth | 127.5 Gbps full-duplex |
| Package | FC-FBGA-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) |
| Pin Count | 1020 |
| Logic Family | CMOS |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Speed Grade | C5 (Enhanced) |
| Temperature Grade Suffix | ES (Enhanced) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free) |
| Lead-Free | Yes |
EP1SGX25FF1020C5ES fc-fbga-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020C5ES (fc-fbga-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020C5ES.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020C5ES is suitable for 6 applications: Telecom Line Card / Serial Backplane, Wireless Base Station DSP Co-Processing, PCI Express Endpoint / Root Complex, High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO), Industrial Test & Measurement Instrumentation, Legacy Defence Avionics / Mission Computing.
Telecom Line Card / Serial Backplane
The EP1SGX25FF1020C5ES is well suited for telecom line cards and serial backplanes because it integrates up to 20 multi-gigabit transceivers (500 Mbps to 3.1875 Gbps each) alongside 25,660 logic elements for framing, queueing and protocol processing. Placed on a 1020-ball FC-FBGA, the device supports standard telecom SERDES protocols (XAUI, Gigabit Ethernet, Serial RapidIO) directly from Altera IP cores, eliminating external PHY chips. The 1.5 V core supply and 0-85 °C commercial range meet ATCA/cPCI line-card thermal envelopes, while the 1020-ball package provides ample user I/O for parallel sideband and control signals.
Recommended
Wireless Base Station DSP Co-Processing
In wireless base-station designs the EP1SGX25FF1020C5ES serves as a DSP co-processor offloading baseband channel cards, Crest Factor Reduction (CFR) and Digital Pre-Distortion (DPD) from the host DSP. Its 25,660 logic elements, embedded multiplier blocks and TriMatrix memory deliver the throughput required for multi-carrier 3G/4G signal chains, while the 1.5 V core keeps power within the typical 8-12 W per-channel envelope. The 1020-ball FC-FBGA also allows the Stratix GX transceiver IP to receive digitized IF from analog front-ends over CPRI or OBSAI links.
Recommended
PCI Express Endpoint / Root Complex
The EP1SGX25FF1020C5ES is commonly used as a PCI Express endpoint or root-complex bridge card in legacy compute and storage systems. Altera's Stratix GX PCI Express hard IP leverages the embedded transceivers at 2.5 Gbps, while the 25,660 LE fabric implements the application layer, DMA engines and any legacy bus bridges. The 1020-ball FC-FBGA footprint suits ATX/PCIe add-in card form factors, and the 1.5 V core supply is straightforward to derive from standard ATX rails.
Recommended
High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO)
Designers deploy the EP1SGX25FF1020C5ES as a protocol-conversion bridge between XAUI, Serial RapidIO, and Gigabit Ethernet domains in storage and defence platforms. The transceiver channels provide the SERDES physical layer at data rates from 500 Mbps up to 3.1875 Gbps, and the 25,660 logic elements implement the link-layer state machines and traffic managers. The 1020-ball FC-BGA supplies enough user I/O to expose parallel GMII/SGMII control or sideband GPIO to a host ASIC.
Recommended
Industrial Test & Measurement Instrumentation
The EP1SGX25FF1020C5ES fits bench-top and rack-mount test instruments that combine high-speed digitiser interfaces with on-board DSP analysis. The transceiver channels accept serial ADC data at multi-gigabit rates, while the 25,660 logic elements plus embedded multipliers perform FFTs, digital down-conversion and trigger logic in real time. The 1.5 V core and 0-85 °C commercial range suit lab-environment thermal envelopes, and the 1020-ball FC-FBGA exposes abundant GPIO for front-panel display and front-end control.
Recommended
Legacy Defence Avionics / Mission Computing
The EP1SGX25FF1020C5ES is used in long-life defence and avionics platforms where design reuse, software stability and field-ruggedized boards outweigh the appeal of newer FPGAs. Its MIL-PRF-grade power-on behaviour, mature Altera Quartus tool flow, and the ample 25,660 LE/20-channel SERDES combination make it ideal for mission computers, sensor pre-processors and MIL-STD-1553-to-Ethernet bridges. The 1020-ball FC-FBGA is well understood for thermal management in conduction-cooled VPX chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020C5ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C5 | EP1SGX25FF1020C4 | EP1SGX25F1020C6 | EP1SGX25DF1020C5ES |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-1020 (33x33, 1.0 mm) | FC-FBGA-1020 (33x33, 1.0 mm) - same | FC-FBGA-1020 (33x33, 1.0 mm) - same | FC-FBGA-1020 (33x33, 1.0 mm) - same | FC-FBGA-1020 (33x33, 1.0 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Speed Grade | C5 (Enhanced) | C5 (standard) | C4 (slower) | C6 (faster) | C5 (Enhanced) |
| Operating Temperature | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C |
Key Differentiators
- Enhanced speed/temperature grade suffix 'ES' vs standard 'C5' (vs EP1SGX25FF1020C5)
- 20 high-speed transceivers integrated on-die (vs EP1S25F1020C5)
- 1020-ball FC-FBGA maximum I/O count vs smaller FF672 package (vs EP1SGX25F672C7)
Design Notes
The 1020-ball FC-FBGA uses 1.0 mm pitch on a 33 × 33 mm body. Use microvia or via-in-pad PCB technology (laser-drilled microvias, 0.1 mm finished hole) on at least the top layer to escape the dense ball grid, plus buried vias for inner-layer fan-out. Plan a 1 oz copper 6+ layer stackup with continuous ground and 1.5 V core planes directly under the BGA to provide low-impedance return paths for the 20 multi-gigabit transceivers.
The FC-FBGA junction-to-ambient thermal resistance is high because the die is flip-chip bonded without a traditional heat-spreader lid. In a 6-layer board with minimal copper, expect theta_JA in the 15-20 °C/W range; a Stratix GX device fully populating 20 transceivers at 3.1875 Gbps can dissipate 8-12 W. Add a thermal-via array under the die and either a heatsink or 200 LFM forced-air cooling to keep Tj below 100 °C in production.
Always follow Altera's Stratix GX pin connection guidelines for unused transceiver channels - leave unused TX pins open with the TX disable bit set, and tie unused RX pins to a defined DC voltage through the recommended resistor-divider. Do not share reference clock outputs between transceiver blocks without an external buffer if channel-to-channel skew is critical. Estimated: based on Stratix GX Device Handbook guidance.
Route transceiver channels as 100 ohm differential pairs with intra-pair skew under 5 mil and length matching to within 25 mil across all channels in a group. Use AC-coupling capacitors (0.01 uF) close to the TX pins; do not place DC bias resistors on AC-coupled links. Separate PLL analog supplies (VCC_PLL) from digital 1.5 V with a ferrite bead and a dedicated LDO to minimize jitter impact.
Compliance Information
Lead-free FC-FBGA confirmed by Alldatasheet listing 'LEAD FREE, FBGA-1020'. RoHS compliance inferred from the lead-free package designation per the Stratix GX datasheet. AEC-Q100 not applicable for commercial-grade FPGAs. REACH, halogen-free and conflict-minerals status not directly confirmed in the verified web data.
