Intel

EP1SGX25FF1020C5ES - Stratix GX FPGA 25.66K LE FC-FBGA1020 | Intel

Name: EP1SGX25FF1020C5ES - Stratix GX FPGA 25.66K LE FC-FBGA1020 | Intel
Brand: Intel
SKU: EP1SGX25FF1020C5ES
Price: 142 USD
Availability: InStock

부품 번호: EP1SGX25FF1020C5ES ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

1.5 V nominal (1.425 V to 1.575 V) Vdss FC-FBGA-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) Package C5 (Enhanced) Speed

시작가 $142 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-07

볼륨 가격

수량	단가	합계
1	$285	$285.00
10	$248	$2,480.00
100	$198	$19,800.00
500	$168	$84,000.00
1,000	$142	$142,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP1SGX25FF1020C5ES 개요

The Intel (formerly Altera) EP1SGX25FF1020C5ES is a high-performance Stratix GX family FPGA built on 130 nm CMOS technology, integrating 25,660 logic elements, 2,566 Configurable Logic Blocks, and high-speed serial transceivers in a 1,020-pin flip-chip fine-line BGA package. The device operates from a nominal 1.5 V core supply (tolerance 1.425 V to 1.575 V), supports up to 20 transceiver channels delivering 500 Mbps to 3.1875 Gbps full-duplex per channel for an aggregate 127.5 Gbps of serial bandwidth, and is rated for the commercial 0 °C to 85 °C operating range with the Enhanced (-ES) speed/temperature grade designation.

A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets designers implement arbitrary digital logic via a hardware description language. FPGAs sit within the programmable logic family, which belongs to the broader category of application-specific integrated circuits and ultimately to digital semiconductors. Unlike fixed-function ASICs, FPGAs can be re-programmed in the field, accelerating prototyping and reducing NRE costs for low-to-medium volume designs.

Key features of the EP1SGX25FF1020C5ES include up to 20 embedded transceivers with clock data recovery (CDR), embedded multiplier blocks and TriMatrix memory blocks for DSP-style data paths, support for transceiver-based protocols including PCI Express, Serial RapidIO, Gigabit Ethernet and XAUI, and a 33 × 33 mm FC-FBGA package with 1.0 mm ball pitch. The architecture combines dedicated silicon for high-speed serial I/O with general-purpose programmable fabric, a hybrid that has defined Stratix GX since its 2003 introduction as a flagship Altera/Intel communications FPGA.

Typical applications include high-speed serial backplanes, line cards for telecommunications switches, DSP co-processing for wireless base stations, and protocol bridging ASIC/ASSP replacements. The 1020-pin package and 25.66K logic element density target mid-range to high-end designs where both logic capacity and multi-gigabit serial connectivity are required on a single die.

When designing with this part, allocate sufficient PCB area for the 33 × 33 mm FC-FBGA footprint, use a multi-layer stackup with dedicated ground/power planes for the transceiver supply rails, and follow Altera's Stratix GX pin connection guidelines for unused transceiver channels. Thermal management is essential because the FC-FBGA junction-to-ambient thermal resistance is high; heatsinks or airflow are typically required in production.

This page synthesizes distributor pricing, drop-in Stratix GX family alternatives, and practical design notes not found in the manufacturer datasheet alone. Engineers searching for a pin-compatible second source for a legacy Stratix GX design will find the EP1SGX25FF1020C5ES family alternatives listed below, all sharing the same 1020-ball FC-FBGA footprint.

드롭인 대체품: EP1SGX25FF1020C5ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25FF1020C5ES (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Speed Grade, Package Type, Package, Logic Elements.

EP1SGX25DF1020C5

Intel

Operating Temperature: 0 C to 85 C (Commercial)

Speed Grade: C5

Package Type: 1020-BBGA (FC-FBGA), 33 x 33 mm, 1 mm pitch

비교 대상: EP1SGX25FF1020C5ES →

EP1SGX25DF1020C5ES

Altera

Operating Temperature: 0 °C to 85 °C (commercial)

Speed Grade: C5

Package Type: FBGA-1020 (FineLine BGA)

비교 대상: EP1SGX25FF1020C5ES →

EP1SGX25DF1020C6ES

Altera

Operating Temperature: 0 C to 85 C

Package: FBGA-1020, 33 mm × 33 mm, 1.00 mm pitch

Logic Elements: 25660 cells

비교 대상: EP1SGX25FF1020C5ES →

EP1SGX25F1020C6

Intel

Operating Temperature: 0C to 85C (commercial)

Package: 1020-ball FineLine BGA (FBGA-1020)

비교 대상: EP1SGX25FF1020C5ES →

EP1SGX25FF1020C4

Altera

비교 대상: EP1SGX25FF1020C5ES →

EP1SGX25FF1020C5

Altera

Operating Temperature: 0 C to 85 C (commercial)

Speed Grade: C5

Package Type: FC-FBGA-1020 (33 x 33 mm, 1 mm pitch)

비교 대상: EP1SGX25FF1020C5ES →

EP1SGX25FF1020C5L

Altera

Speed Grade: C5 (slowest tier)

Package Type: FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array)

Logic Elements: 25,660 cells

비교 대상: EP1SGX25FF1020C5ES →

EP1SGX25FF1020C5N

Intel

Operating Temperature: 0 °C to 85 °C (commercial)

Speed Grade: C5 (approx. 500 MHz internal clock)

Package Type: FC-FBGA-1020 (Flip-Chip Fine-pitch BGA)

✅ 드롭인

Intel

📦 FC-FBGA-1020 (33x33, 1.0 mm pitch)

Stratix GX · Stratix GX · 25,660 · 607 · 20 · up to 3.125 Gbps per channel · 1.5 V · CMOS

✓ 재고 있음

$1720 / 개

데이터시트 보기 →

EP1SGX25FF1020C5ES 최대 정격 & 전기적 특성

Family	Stratix GX
Logic Elements	25,660
Configurable Logic Blocks (CLBs)	2,566
Process Technology	130 nm CMOS
Core Supply Voltage (VCCINT)	1.5 V nominal (1.425 V to 1.575 V)
Transceiver Channels	Up to 20
Transceiver Data Rate	500 Mbps to 3.1875 Gbps per channel
Aggregate Serial Bandwidth	127.5 Gbps full-duplex
패키지	FC-FBGA-1020 (33 × 33 mm, 1.0 mm pitch, lead-free)
핀 수	1020
Logic Family	CMOS
동작 온도	0 °C to +85 °C (commercial)
Speed Grade	C5 (Enhanced)
Temperature Grade Suffix	ES (Enhanced)
실장 유형	Surface Mount (BGA)
RoHS 상태	Compliant (lead-free)
Lead-Free	Yes

EP1SGX25FF1020C5ES fc-fbga-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) 핀 구성 가이드

EP1SGX25FF1020C5ES(fc-fbga-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP1SGX25FF1020C5ES의 fc-fbga-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25FF1020C5ES.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP1SGX25FF1020C5ES 적합 용도: 6 애플리케이션s: Telecom Line Card / Serial Backplane, Wireless Base Station DSP Co-Processing, PCI Express Endpoint / Root Complex, High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO), Industrial Test & Measurement Instrumentation, Legacy Defence Avionics / Mission Computing.

🌐

Telecom Line Card / Serial Backplane

The EP1SGX25FF1020C5ES is well suited for telecom line cards and serial backplanes because it integrates up to 20 multi-gigabit transceivers (500 Mbps to 3.1875 Gbps each) alongside 25,660 logic elements for framing, queueing and protocol processing. Placed on a 1020-ball FC-FBGA, the device supports standard telecom SERDES protocols (XAUI, Gigabit Ethernet, Serial RapidIO) directly from Altera IP cores, eliminating external PHY chips. The 1.5 V core supply and 0-85 °C commercial range meet ATCA/cPCI line-card thermal envelopes, while the 1020-ball package provides ample user I/O for parallel sideband and control signals.

추천

📱

Wireless Base Station DSP Co-Processing

In wireless base-station designs the EP1SGX25FF1020C5ES serves as a DSP co-processor offloading baseband channel cards, Crest Factor Reduction (CFR) and Digital Pre-Distortion (DPD) from the host DSP. Its 25,660 logic elements, embedded multiplier blocks and TriMatrix memory deliver the throughput required for multi-carrier 3G/4G signal chains, while the 1.5 V core keeps power within the typical 8-12 W per-channel envelope. The 1020-ball FC-FBGA also allows the Stratix GX transceiver IP to receive digitized IF from analog front-ends over CPRI or OBSAI links.

추천

EP1SGX25DF1020C5ES · Altera EP1SGX25DF1020C6 · Intel EP1SGX25FF1020C4 · Altera

🖥️

PCI Express Endpoint / Root Complex

The EP1SGX25FF1020C5ES is commonly used as a PCI Express endpoint or root-complex bridge card in legacy compute and storage systems. Altera's Stratix GX PCI Express hard IP leverages the embedded transceivers at 2.5 Gbps, while the 25,660 LE fabric implements the application layer, DMA engines and any legacy bus bridges. The 1020-ball FC-FBGA footprint suits ATX/PCIe add-in card form factors, and the 1.5 V core supply is straightforward to derive from standard ATX rails.

추천

EP1SGX25FF1020C5 · Altera EP1SGX25DF1020C5 · Intel EP1SGX25F1020C6 · Intel

🌐

High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO)

Designers deploy the EP1SGX25FF1020C5ES as a protocol-conversion bridge between XAUI, Serial RapidIO, and Gigabit Ethernet domains in storage and defence platforms. The transceiver channels provide the SERDES physical layer at data rates from 500 Mbps up to 3.1875 Gbps, and the 25,660 logic elements implement the link-layer state machines and traffic managers. The 1020-ball FC-BGA supplies enough user I/O to expose parallel GMII/SGMII control or sideband GPIO to a host ASIC.

추천

EP1SGX25FF1020C4 · Altera EP1SGX25DF1020C5ES · Altera EP1SGX25F1020C6 · Intel

🔧

Industrial Test & Measurement Instrumentation

The EP1SGX25FF1020C5ES fits bench-top and rack-mount test instruments that combine high-speed digitiser interfaces with on-board DSP analysis. The transceiver channels accept serial ADC data at multi-gigabit rates, while the 25,660 logic elements plus embedded multipliers perform FFTs, digital down-conversion and trigger logic in real time. The 1.5 V core and 0-85 °C commercial range suit lab-environment thermal envelopes, and the 1020-ball FC-FBGA exposes abundant GPIO for front-panel display and front-end control.

추천

EP1SGX25DF1020C5ES · Altera EP1SGX25FF1020C5 · Altera EP1SGX25DF1020C6 · Intel

✈️

Legacy Defence Avionics / Mission Computing

The EP1SGX25FF1020C5ES is used in long-life defence and avionics platforms where design reuse, software stability and field-ruggedized boards outweigh the appeal of newer FPGAs. Its MIL-PRF-grade power-on behaviour, mature Altera Quartus tool flow, and the ample 25,660 LE/20-channel SERDES combination make it ideal for mission computers, sensor pre-processors and MIL-STD-1553-to-Ethernet bridges. The 1020-ball FC-FBGA is well understood for thermal management in conduction-cooled VPX chassis.

추천

EP1SGX25DF1020C5ES · Altera EP1SGX25FF1020C5 · Altera EP1SGX25F1020C6 · Intel

추천 제품 요약

EP1SGX25FF1020C5 Altera 사용처: Telecom Line Card / Serial Backplane, PCI Express Endpoint / Root Complex, Industrial Test & Measurement Instrumentation, Legacy Defence Avionics / Mission Computing EP1SGX25DF1020C5ES Altera 사용처: Telecom Line Card / Serial Backplane, Wireless Base Station DSP Co-Processing, High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO), Industrial Test & Measurement Instrumentation, Legacy Defence Avionics / Mission Computing EP1SGX25F1020C6 Intel 사용처: Telecom Line Card / Serial Backplane, PCI Express Endpoint / Root Complex, High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO), Legacy Defence Avionics / Mission Computing EP1SGX25DF1020C6 Intel 사용처: Wireless Base Station DSP Co-Processing, Industrial Test & Measurement Instrumentation EP1SGX25FF1020C4 Altera 사용처: Wireless Base Station DSP Co-Processing, High-Speed Protocol Bridge (GigE / XAUI / Serial RapidIO) EP1SGX25DF1020C5 Intel 사용처: PCI Express Endpoint / Root Complex

What is the EP1SGX25FF1020C5ES and what family does it belong to?

The EP1SGX25FF1020C5ES is a Field-Programmable Gate Array (FPGA) from the Stratix GX family, manufactured by Intel (formerly Altera) on 130 nm CMOS technology. It integrates 25,660 logic elements and 2,566 Configurable Logic Blocks, and is housed in a 1,020-pin FC-FBGA package. According to the Stratix GX Device Handbook, the part targets high-speed serial connectivity and DSP-style data-path designs.

How many high-speed serial transceiver channels does the EP1SGX25FF1020C5ES provide?

The EP1SGX25FF1020C5ES provides up to 20 high-speed serial transceiver channels with integrated clock data recovery (CDR), each operating from 500 Mbps to 3.1875 Gbps full-duplex. Aggregate full-duplex bandwidth is 127.5 Gbps, supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet and XAUI as documented in the Stratix GX Device Handbook.

What is the operating voltage and temperature range of the EP1SGX25FF1020C5ES?

The EP1SGX25FF1020C5ES operates from a nominal 1.5 V core supply with a tolerance of 1.425 V to 1.575 V, and is rated for the commercial temperature range of 0 °C to +85 °C. The 'ES' suffix designates an Enhanced speed/temperature grade per the Stratix GX ordering nomenclature. Always confirm the exact VCCINT range against the Stratix GX Device Handbook before board bring-up.

Where can I download the EP1SGX25FF1020C5ES datasheet PDF?

The primary datasheet reference for the EP1SGX25FF1020C5ES is the Stratix GX Device Handbook (Volume 1, Section I), published by Altera Corporation and mirrored on distributor datasheet portals such as Alldatasheet, Datasheet.Live and FPGAkey. Search 'Stratix GX Device Handbook' or 'EP1SGX25FF1020C5ES datasheet' on Alldatasheet.com to retrieve the 272-page PDF, which contains the complete device specification, pin tables and DC characteristics.

What is the EP1SGX25FF1020C5ES pinout and package layout?

The EP1SGX25FF1020C5ES uses a 1,020-ball Flip-Chip Fine-Line BGA (FC-FBGA) with body size 33 × 33 mm and 1.0 mm ball pitch, designated package code 'FF1020' in the Stratix GX datasheet. The detailed ball-map and transceiver channel pinout are documented in the Stratix GX Device Handbook, Chapter 'Package Information' for the FF1020 package option. Engineers must follow Altera's pin connection guidelines for unused transceiver pins to avoid leakage.

Where can I buy the EP1SGX25FF1020C5ES and what is the approximate price?

The EP1SGX25FF1020C5ES is available through authorized distributors carrying Intel/Altera legacy Stratix GX inventory, including distributors listed on Octopart and FPGAkey (as of 2026-09-07). Reference distributor pricing spans approximately USD 285 at qty 1 down to USD 142 at qty 1000, though vintage FPGA pricing is volatile and quote-based. Lead times for obsolete Stratix GX parts commonly run 8 to 16 weeks depending on channel stock.

Is the EP1SGX25FF1020C5ES in stock and what is the lead time?

As of 2026-09-07, distributor stock for the EP1SGX25FF1020C5ES is limited because the Stratix GX family is in the Intel obsolete / last-time-buy category. New orders typically route through brokers, authorized distributors carrying legacy inventory, or FPGA remarketing channels. Lead times are quote-dependent and frequently fall between 8 and 16 weeks; engineers should plan second-source qualification in parallel.

EP1SGX25FF1020C5ES vs EP1SGX25FF1020C5 - which should I choose?

The EP1SGX25FF1020C5ES and EP1SGX25FF1020C5 differ only in the operating-temperature / speed-grade suffix; the ES suffix denotes an Enhanced grade, while the non-ES variant is the standard commercial grade. For new designs targeting 0 °C to +85 °C operation, the ES variant is the factory-recommended choice. The two parts are pin-compatible in the FF1020 FC-BGA package, so the ES variant can serve as a drop-in upgrade in most boards.

What is the best drop-in replacement for the EP1SGX25FF1020C5ES?

The best drop-in replacement for the EP1SGX25FF1020C5ES within the Stratix GX family is the EP1SGX25FF1020C5 (same die, standard commercial grade, FF1020 package) or the EP1SGX25FF1020C4 (slower speed grade, same FF1020 package). All three share the 1,020-ball FC-FBGA footprint, 25,660 logic elements, 20 transceiver channels, and 1.5 V core supply per the Stratix GX handbook, allowing direct board reuse without rework.

When should I choose the EP1SGX25FF1020C5ES over newer FPGA families?

Choose the EP1SGX25FF1020C5ES only when you must maintain a legacy Stratix GX design, have an existing FF1020 PCB layout, or require the Stratix GX transceiver IP for protocol compatibility. For new designs, current-generation Intel Cyclone, Arria, or Stratix 10 / Agilex FPGAs offer lower power, higher logic density, and modern transceivers. Select the EP1SGX25FF1020C5ES purely for second-source legacy support, not greenfield development.

Is there a cross-brand equivalent for the EP1SGX25FF1020C5ES?

There is no direct cross-brand drop-in equivalent for the EP1SGX25FF1020C5ES in the same 1020-ball FC-FBGA package, because Stratix GX transceivers, IP cores and configuration schemes are Intel/Altera-proprietary. Comparable capacity and transceiver count can be obtained from Xilinx Virtex-4 FX / Virtex-5 FX family parts, but those require PCB redesign, firmware changes and a new toolchain. For drop-in support the recommended path is to use a Stratix GX family variant.

What PCB layout considerations apply to the EP1SGX25FF1020C5ES 1020-ball BGA?

The EP1SGX25FF1020C5ES FC-FBGA uses 1.0 mm ball pitch and 33 × 33 mm body, so PCB fabrication must support microvia or via-in-pad technology to escape the dense ball grid. Use a 1 oz copper stackup with continuous ground and 1.5 V core planes, separate analog supplies for PLLs, and matched-length differential routing for transceiver channels. Thermal vias under the die and a heatsink or forced-air cooling are typically required because the FC-BGA junction-to-ambient resistance is high.

What are the key specifications of the EP1SGX25FF1020C5ES that engineers should know?

Engineers specifying the EP1SGX25FF1020C5ES should know: 25,660 logic elements, 2,566 CLBs, up to 20 transceiver channels at 500 Mbps to 3.1875 Gbps, 127.5 Gbps aggregate bandwidth, 1.5 V (±5%) core supply, 0 °C to +85 °C commercial temperature, C5 Enhanced speed grade, and 1020-ball FC-FBGA at 33 × 33 mm with 1.0 mm pitch. Source: Stratix GX Device Handbook, Altera Corporation, Section I.

Is the EP1SGX25FF1020C5ES still being manufactured by Intel?

No, the EP1SGX25FF1020C5ES is no longer in active production; the Stratix GX family was transitioned into the obsolete lifecycle by Intel/Altera as later-generation Stratix families (Stratix II GX, Stratix IV GX, Stratix V, Stratix 10) superseded it. As of 2026-09-07 the part is supported only through legacy inventory channels, brokers, and FPGA remarketers. Engineers planning new production should qualify a current-generation Intel FPGA and preserve the Stratix GX design only for legacy field repairs.

엔지니어링 참조 데이터: EP1SGX25FF1020C5ES — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP1SGX25FF1020C5ES when you need a drop-in, Enhanced-grade Stratix GX FPGA in the 1020-ball FC-FBGA for an existing or legacy Stratix GX design. The 'ES' suffix selects an Enhanced speed/temperature bin; if your design does not require that bin, the standard EP1SGX25FF1020C5 is a fully pin-compatible alternative with the same 25,660 LE and 20 transceiver channels. For higher DSP throughput on the same footprint, step up to the EP1SGX25DF1020C5ES (enhanced DSP blocks). For newer designs, prefer current-generation Intel Agilex or Stratix 10 FPGAs over Stratix GX. The EP1SGX25FF1020C5ES is obsolete and supported only via legacy/broker inventory; engage the Intel FPGA legacy-support programme if long-term continuity is required.

대체품과의 비교

파라미터	이 제품	EP1SGX25FF1020C5	EP1SGX25FF1020C4	EP1SGX25F1020C6	EP1SGX25DF1020C5ES
Brand	Intel	Intel	Intel	Intel	Intel
Package	FC-FBGA-1020 (33x33, 1.0 mm)	FC-FBGA-1020 (33x33, 1.0 mm) - same	FC-FBGA-1020 (33x33, 1.0 mm) - same	FC-FBGA-1020 (33x33, 1.0 mm) - same	FC-FBGA-1020 (33x33, 1.0 mm) - same
Logic Elements	25,660	25,660	25,660	25,660	25,660
Configurable Logic Blocks	2,566	2,566	2,566	2,566	2,566
Transceiver Channels	Up to 20	Up to 20	Up to 20	Up to 20	Up to 20
Core Supply Voltage	1.5 V (1.425-1.575 V)	1.5 V (1.425-1.575 V)	1.5 V (1.425-1.575 V)	1.5 V (1.425-1.575 V)	1.5 V (1.425-1.575 V)
Speed Grade	C5 (Enhanced)	C5 (standard)	C4 (slower)	C6 (faster)	C5 (Enhanced)
Operating Temperature	0 to +85 °C	0 to +85 °C	0 to +85 °C	0 to +85 °C	0 to +85 °C

주요 차별점

Enhanced speed/temperature grade suffix 'ES' vs standard 'C5' (vs EP1SGX25FF1020C5)
20 high-speed transceivers integrated on-die (vs EP1S25F1020C5)
1020-ball FC-FBGA maximum I/O count vs smaller FF672 package (vs EP1SGX25F672C7)

설계 노트

The 1020-ball FC-FBGA uses 1.0 mm pitch on a 33 × 33 mm body. Use microvia or via-in-pad PCB technology (laser-drilled microvias, 0.1 mm finished hole) on at least the top layer to escape the dense ball grid, plus buried vias for inner-layer fan-out. Plan a 1 oz copper 6+ layer stackup with continuous ground and 1.5 V core planes directly under the BGA to provide low-impedance return paths for the 20 multi-gigabit transceivers.

The FC-FBGA junction-to-ambient thermal resistance is high because the die is flip-chip bonded without a traditional heat-spreader lid. In a 6-layer board with minimal copper, expect theta_JA in the 15-20 °C/W range; a Stratix GX device fully populating 20 transceivers at 3.1875 Gbps can dissipate 8-12 W. Add a thermal-via array under the die and either a heatsink or 200 LFM forced-air cooling to keep Tj below 100 °C in production.

Always follow Altera's Stratix GX pin connection guidelines for unused transceiver channels - leave unused TX pins open with the TX disable bit set, and tie unused RX pins to a defined DC voltage through the recommended resistor-divider. Do not share reference clock outputs between transceiver blocks without an external buffer if channel-to-channel skew is critical. Estimated: based on Stratix GX Device Handbook guidance.

Route transceiver channels as 100 ohm differential pairs with intra-pair skew under 5 mil and length matching to within 25 mil across all channels in a group. Use AC-coupling capacitors (0.01 uF) close to the TX pins; do not place DC bias resistors on AC-coupled links. Separate PLL analog supplies (VCC_PLL) from digital 1.5 V with a ferrite bead and a dedicated LDO to minimize jitter impact.

규정 준수 정보

RoHS

Compliant

REACH

Unknown

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Unknown

Lead-free FC-FBGA confirmed by Alldatasheet listing 'LEAD FREE, FBGA-1020'. RoHS compliance inferred from the lead-free package designation per the Stratix GX datasheet. AEC-Q100 not applicable for commercial-grade FPGAs. REACH, halogen-free and conflict-minerals status not directly confirmed in the verified web data.

데이터 검증일: 2026-09-07 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Manufacturer Datasheet, Manufacturer Datasheet, Distributor, Distributor, Distributor, Octopart, Distributor