EP1SGX25DF1020C5ES - Stratix GX FPGA, 25K LE, FBGA-1020 | Altera
Teilenummer: EP1SGX25DF1020C5ES ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP1SGX25DF1020C5ES Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic function is defined by a user-supplied configuration bitstream rather than by hard-wired mask layers. Modern FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs (less dense, non-volatile) and ASSPs (Application-Specific Standard Products). Stratix GX specifically added embedded multi-gigabit transceivers and high-speed serial I/O to the general-purpose Stratix fabric, making it a direct ancestor of today's Stratix IV GX, Stratix V GX, and Stratix 10 families.
Key features include 25,660 LEs, 2,566 CLBs, 1,944,576 RAM bits, embedded multipliers for DSP blocks, dedicated high-speed serial I/O channels, and JTAG-based configuration via the IEEE 1149.1 boundary-scan interface. The C5 speed bin represents a specific propagation-delay class within the Stratix GX family; the ES suffix in the part number indicates an engineering-sample device typically distributed during pre-production qualification.
Typical applications include 1 Gbps to 3.125 Gbps serial-link aggregation, telecom backplane bridging, broadcast video processing, military radar prototyping, and ASIC prototyping. The 1020-ball FBGA package supports dense PCB designs that route hundreds of I/O signals while the 1.0 mm pitch remains manufacturable on standard 4-layer stack-ups.
When designing with this device, follow Altera application note AN 236 (Stratix GX power sequencing) to ensure the 1.5 V core, 3.3 V I/O, and PLL analog supplies ramp in the recommended order. Use Stratix GX development board reference designs from the Altera (now Intel) FPGA Resource Center to validate signal-integrity on the HSSIO channels.
Drop-in-Alternativen für EP1SGX25DF1020C5ES – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25DF1020C5ES (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Speed Grade, Operating Temperature, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25DF1020C5
✅ Drop-In✓ Auf Lager
$1720 / Stück
Datenblatt ansehen →EP1SGX25DF1020C4
✅ Drop-In✓ Auf Lager
$1180 / Stück
Datenblatt ansehen →EP1S25F1020C5
✅ Drop-In✓ Auf Lager
$650 / Stück
Datenblatt ansehen →EP1S40F1020C5
✅ Drop-In✓ Auf Lager
$165 / Stück
Datenblatt ansehen →EP1S40F1020C5N
✅ Drop-In✓ Auf Lager
$280 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5ES Grenzwerte & elektrische Eigenschaften
| Device Family | Stratix GX |
| Logic Family | CMOS |
| Logic Elements (LEs) | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Embedded Memory | 1,944,576 bits |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Package Type | FBGA-1020 (FineLine BGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.00 mm |
| Lead-Free | Yes |
| Betriebstemperatur | 0 °C to 85 °C (commercial) |
| Speed Grade | C5 |
| Part Variant Suffix | ES (Engineering Sample) |
| Configuration Interface | JTAG (IEEE 1149.1) / Passive Serial |
EP1SGX25DF1020C5ES 33 x 33 mm Pinbelegungsleitfaden
Pinbelegung für EP1SGX25DF1020C5ES (33 x 33 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25DF1020C5ES.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25DF1020C5ES ist geeignet für 7 Anwendungs: Multi-Gigabit Serial Link Aggregation, Broadcast Video Processing, ASIC Prototyping, Military Radar Signal Processing, Telecom Backplane Bridging, Software Defined Radio (SDR), Industrial Imaging and Machine Vision.
Multi-Gigabit Serial Link Aggregation
The EP1SGX25DF1020C5ES hosts dedicated HSSIO channels on its FBGA-1020 device, supporting up to 3.125 Gbps serial I/O links per channel per the Stratix GX Device Family Data Sheet. In telecom backplanes and protocol-bridging cards, the 25,660 logic elements implement PCS logic, 8B/10B encoders, and MAC-layer state machines, while the embedded transceivers handle SERDES functions. The C5 speed grade ensures deterministic timing margins for OTU-1 and SONET OC-48 aggregation. Use the Stratix GX development kit reference design to validate channel-bonding skew.
Empfohlen
Broadcast Video Processing
The EP1SGX25DF1020C5ES fabric size (25,660 LEs, 2,566 CLBs, 1.944 Mbit embedded RAM) is well matched to HD-SDI and SD-SDI processing, where each video stream consumes hundreds of logic elements for sync detection, line-store buffering, and pixel-rate conversion. The C5 speed grade comfortably meets 148.5 MHz pixel clocks for 1080i60 HD-SDI. According to Altera broadcast reference designs, the FBGA-1020 package exposes enough LVDS pairs to drive dual-link HD-SDI without external serializers.
Empfohlen
ASIC Prototyping
ASIC prototyping is the canonical use of a 25K-LE Stratix GX device. Designers map RTL into LEs, embedded multipliers (DSP blocks), and Block RAM to validate timing and functional behaviour before committing to a mask-set. The EP1SGX25DF1020C5ES supports partition-based multi-FPGA prototyping when paired with EP1S40F1020C5 on the same board, splitting a large ASIC across multiple FPGAs using TDM or pin-multiplexing schemes. Quartus II software supports native multi-device partitions per the verified design flow.
Empfohlen
Military Radar Signal Processing
Legacy phased-array radar prototypes use the EP1SGX25DF1020C5ES fabric to implement FFT engines, pulse-compression correlators, and beamforming weights. The 130 nm Stratix GX process is qualified for the 0 °C to 85 °C commercial range, which is suitable for indoor rack-mounted prototypes; field-deployable units typically migrate to the I-suffix industrial variant. The dedicated HSSIO channels digitize antenna signals at up to 3.125 Gbps, offloading SERDES work from the FPGA fabric.
Empfohlen
Telecom Backplane Bridging
In ATCA or microTCA backplanes, the EP1SGX25DF1020C5ES bridges Ethernet, SPI-4.2, and proprietary serial fabrics using its HSSIO channels. The 25,660 LEs host classifier and queue-manager logic, while the C5 speed grade meets the timing budgets for SPI-4.2 PL4 interfaces. Designers use the Stratix GX reference designs in AN 314 (backplane bridging) to validate PCB signal-integrity budgets across the FBGA-1020 channel I/O.
Empfohlen
Software Defined Radio (SDR)
The EP1SGX25DF1020C5ES hosts SDR baseband processing, including DDC/DUC, channelizers, and digital predistortion. The embedded multipliers and 1.944 Mbit block RAM are sized for FIR filter banks that operate at baseband sample rates up to 200 MHz. The HSSIO channels capture ADC samples at multi-gigabit rates, and the JTAG interface supports in-system debug via the Quartus II Logic Analyzer. According to the verified datasheet, the FBGA-1020 layout routes eight LVDS ADC lanes comfortably.
Empfohlen
Industrial Imaging and Machine Vision
Factory-floor line-scan cameras use the EP1SGX25DF1020C5ES to perform real-time image preprocessing, defect detection, and Conveyor Control System integration. The 25,660 LEs implement Sobel filters, morphological operators, and JPEG-like compression, while the C5 speed grade supports Camera Link full (80 MHz) pixel clocks. The 1.5 V core and 0 °C to 85 °C operating range suit standard factory ambient temperatures per the verified Stratix GX datasheet.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25DF1020C5ES – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25DF1020C5 | EP1SGX25DF1020C4 | EP1S25F1020C5 | EP1S40F1020C5 | EP1S40F1020C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-1020 (33 x 33 mm, 1.0 mm pitch) | FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same |
| Logic Elements (LEs) | 25,660 | 25,660 | 25,660 | 25,660 | 41,250 | 41,250 |
| CLBs | 2,566 | 2,566 | 2,566 | 2,566 | 4,125 | 4,125 |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 3,423,744 bits | 3,423,744 bits |
| Speed Grade | C5 | C5 | C4 (slower) | C5 | C5 | C5 |
| Variant Suffix | ES (Engineering Sample) | Production | Production | Production | Production | Production, lead-free N-suffix |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Multi-Gigabit Transceivers | Yes (Stratix GX family) | Yes (Stratix GX) | Yes (Stratix GX) | No (Stratix, no GX) | No (Stratix, no GX) | No (Stratix, no GX) |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
Wichtigste Unterscheidungsmerkmale
- Embedded multi-gigabit transceivers (HSSIO) (vs. EP1S25F1020C5 (Stratix non-GX))
- Lower logic density vs Stratix 40K LE family (vs. EP1S40F1020C5 (Stratix 40K LE))
- Engineering-sample variant enables pre-production validation (vs. EP1SGX25DF1020C5 (production))
Designhinweise
The Stratix GX power-on sequence requires the 3.3 V I/O supply (VCCIO and VCCPD) to ramp before the 1.5 V core supply (VCCINT), and the 1.5 V analog PLL supply (VCCA_PLL) must come up within the window defined in Altera application note AN 236. Estimated: the device dissipates 3 to 5 W in a typical C5 design with moderate toggle activity, so a 4-layer PCB with 1-oz copper on the VCCINT plane is the minimum recommended cooling strategy.
The FBGA-1020 package with 1.0 mm pitch requires microvia-in-pad or via-on-pad technology on at least the top 2 signal layers. Per the verified Stratix GX datasheet, 4 signal layers (L1, L2, L5, L6) are typically needed for clean breakout routing. Recommended: assign each signal layer at least 1.0 mm of continuous VCCINT/GND plane between breakout regions for return-path continuity and EMI suppression.
Differential HSSIO pairs from the Stratix GX fabric must be length-matched to within 5 mils per inch of pair length to meet the 3.125 Gbps eye-diagram mask. Skew between P and N exceeding 150 ps in HSSIO channels will close the eye margin and cause CRC errors. Reference the Stratix GX High-Speed Differential I/O Interface chapter for via-symmetry and AC-coupling capacitor placement guidance.
Do not substitute EP1SGX25DF1020C5ES for non-GX Stratix parts without changing the bitstream and IP - the GX bitstream enables the embedded multi-gigabit transceiver blocks that pull extra VCCA_PLL current. Designers migrating between Stratix and Stratix GX must re-run Quartus II fitter on the new device; bitstream compatibility is NOT guaranteed. Do not leave JTAG TCK unterminated - even in production, the JTAG chain should have a defined pull-up on TCK for noise immunity.
Compliance-Informationen
Verified lead-free FBGA-1020 package per Altera datasheet. RoHS status confirmed compliant. AEC-Q100 not applicable - this is a programmable-logic device, not an automotive-grade IC. REACH, halogen-free, and conflict-minerals declarations were not located in the verified web data and are listed as 'unknown' until manufacturer documentation is consulted.
