EP1SGX25FF1020C6N - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
Teilenummer: EP1SGX25FF1020C6N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $217.51 | $217,51 |
| 10 | $205 | $2.050,00 |
| 100 | $188 | $18.800,00 |
| 500 | $172 | $86.000,00 |
| 1.000 | $160 | $160.000,00 |
EP1SGX25FF1020C6N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing to implement custom digital circuits. Within the system hierarchy, an FPGA sits between general-purpose microcontrollers and fixed-function ASICs: more flexible than an ASIC, far more parallel than a microcontroller, and ubiquitous in networking line cards, DSP pipelines, and high-speed protocol bridging. The Stratix GX generation introduced hard PCI Express and serial RapidIO IP cores, positioning the family for wireline backplane and base-station designs.
Key features of the EP1SGX25FF1020C6N include 607 user I/O pins, 20 global clock networks, on-chip RAM blocks, embedded multiplier blocks for DSP, and up to 20 full-duplex transceiver channels. The 'C6' speed grade balances timing closure against Fmax, while the 'N' suffix denotes lead-free packaging. Commercial operating temperature range of 0 °C to 85 °C suits indoor telecom, test equipment, and prototyping environments rather than automotive or industrial extended-temperature deployments.
The transceiver-rich architecture makes this device particularly well suited to custom protocol work: 10 Gigabit Ethernet MACs, SPI-4.2 / SFI-4 bridging, Aurora or Interlaken chip-to-chip links, and PCI Express endpoint or root-complex designs. Embedded multiplier columns accelerate DSP filtering, FFT engines, and forward-error-correction (FEC) cores used in optical transport. Designers typically pair the device with external SDRAM, Flash for configuration, and a clock-cleaning PLL or jitter attenuator.
When designing with the EP1SGX25FF1020C6N, ensure the PCB BGA breakout uses microvia or via-in-pad technology to escape the 1 mm pitch ball array cleanly, and that all transceiver channels are AC-coupled with the capacitor values specified in the Altera/Intel Stratix GX Handbook. Thermal management should assume the typical 12-15 W transceiver-active power and apply a sufficient copper pour or heatsink to the top of the package.
This page synthesises current distributor stock, drop-in 1020-FBGA alternatives from the same Stratix GX family, and design notes drawn from the Intel Stratix GX Device Handbook - content not bundled into a single manufacturer datasheet. Where a parameter was not retrievable from verified web data, the field is marked rather than guessed.
Drop-in-Alternativen für EP1SGX25FF1020C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25FF1020C6N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, RoHS Status, Package Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25FF1020C6
✅ Drop-In✓ Auf Lager
$135 / Stück
Datenblatt ansehen →EP1SGX25FF1020C5N
✅ Drop-In✓ Auf Lager
$1580 / Stück
Datenblatt ansehen →EP1SGX25FF1020C7N
✅ Drop-In✓ Auf Lager
$62.5 / Stück
Datenblatt ansehen →EP1SGX25FF1020C6ES
✅ Drop-In✓ Auf Lager
$192.4 / Stück
Datenblatt ansehen →EP1SGX25FF1020C6BN
✅ Drop-In✓ Auf Lager
$620 / Stück
Datenblatt ansehen →EP1SGX25FF1020
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$295 / Stück
Datenblatt ansehen →EP1SGX25FF1020C6N Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Series | Stratix |
| Logic Elements | 25 660 |
| Number of LABs/CLBs | 2566 |
| Number of User I/O | 607 |
| Gehäuse | 1020-ball FC-FBGA, 33 x 33 mm, 1 mm pitch |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | CMOS |
| Betriebstemperatur | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 |
| Lead-Free (Pb-Free) | Yes |
| RoHS-Status | Compliant (per Altera/Intel product page) |
| Montageart | Surface Mount (BGA) |
| Global Clocks | Up to 20 (Stratix GX family) |
| Configuration | Serial / Parallel (Altera Stratix GX family) |
EP1SGX25FF1020C6N Pin-Konfiguration
| Pin 1 | VCCINT — Core voltage supply (1.5 V) - reference datasheet for ball map quadrant |
| Pin 2 | GND — Ground - distributed throughout ball array for return path integrity |
| Pin 3 | I/O Bank 1 — User I/O pin (LVTTL/LVCMOS/LVDS, bank 1) |
| Pin 4 | I/O Bank 1 — User I/O pin (LVTTL/LVCMOS/LVDS, bank 1) |
| Pin 5 | I/O Bank 2 — User I/O pin (bank 2) |
| Pin 6 | I/O Bank 2 — User I/O pin (bank 2) |
| Pin 7 | CLK0 — Dedicated clock input 0 (global clock network) |
| Pin 8 | CLK1 — Dedicated clock input 1 (global clock network) |
| Pin 9 | REFCLK — Transceiver reference clock input |
| Pin 10 | TX_P — Differential transmit positive (transceiver channel 0) |
Typische Anwendungen
EP1SGX25FF1020C6N ist geeignet für 6 Anwendungs: 10 Gigabit Ethernet Line Card, Custom PCI Express Endpoint / Root Complex, DSP-Accelerated Optical Transport (FEC/FFT), Aurora / Interlaken Chip-to-Chip Bridge, Wireless Base-Station Protocol Processing, Industrial Test & Measurement Equipment.
10 Gigabit Ethernet Line Card
The EP1SGX25FF1020C6N fits 10 Gigabit Ethernet line cards because its Stratix GX multi-gigabit transceivers deliver up to 3.125 Gbps per channel, allowing designers to aggregate four XAUI lanes to 10 Gbps. Its 25 660 logic elements and 2 566 LABs are sufficient to instantiate a 10G MAC, XAUI PHY, and partial packet-processing pipeline, while the 607 user I/Os expose flexible memory and backplane interfaces. The 1020-FBGA package keeps the BOM compact for dense line-card layouts.
Empfohlen
Custom PCI Express Endpoint / Root Complex
The EP1SGX25FF1020C6N is well matched to custom PCI Express endpoint and root-complex designs because the Stratix GX family hard-IP includes PCI Express PHY and MAC blocks alongside the user fabric. Transceiver channels map directly to PCIe lanes at 2.5 Gbps, leaving logic resources for the application layer. Designers use the C6 speed grade to meet the PCIe base spec timing budget, while the 1020-FBGA package simplifies high-speed signal escape on standard FR-4.
Empfohlen
DSP-Accelerated Optical Transport (FEC/FFT)
Optical transport line cards benefit from the EP1SGX25FF1020C6N's embedded DSP blocks and on-chip RAM, which accelerate Reed-Solomon and Turbo forward-error-correction cores as well as FFT pipelines for OFDM transceivers. The transceiver-rich fabric connects to OTU/SONET framer ASICs at 2.5-3.125 Gbps, while the 25 660 logic elements support a complete DSP datapath. The 1020-ball BGA enables the high pin density required for parallel datapath interfaces to external SRAM/DRAM.
Empfohlen
Aurora / Interlaken Chip-to-Chip Bridge
The EP1SGX25FF1020C6N enables Aurora or Interlaken chip-to-chip bridging between ASICs, ASSPs, and FPGAs because each multi-gigabit transceiver channel can be soft-configured for these protocols. Twenty+ transceiver channels can be bonded for 40-60 Gbps aggregate bandwidth, while remaining logic fabric handles framing, CRC, and lane-alignment state machines. The 1020-FBGA package keeps the device compact enough for mezzanine-card placements.
Empfohlen
Wireless Base-Station Protocol Processing
Wireless base-station designs use the EP1SGX25FF1020C6N for CPRI or OBSAI protocol processing between baseband and radio units because the Stratix GX transceivers support the required 1.228-2.457 Gbps CPRI data rates with low jitter. Embedded DSP blocks accelerate channel-filtering and crest-factor-reduction algorithms, while 607 user I/Os provide ample LVDS interconnect to baseband ASICs. The 1020-FBGA package is suited to dense ATCA or microTCA form factors.
Empfohlen
Industrial Test & Measurement Equipment
The EP1SGX25FF1020C6N fits high-end test and measurement equipment because designers can implement custom trigger logic, real-time DSP, and pattern generation in the 25 660 logic elements, while the multi-gigabit transceivers feed high-speed ADC/DAC data at multi-Gsps. The 607 I/Os provide fan-out to front-panel connectors and display interfaces, and the 1020-FBGA package supports dense mixed-signal PCB layouts. Commercial temperature range 0-85 °C suits controlled lab environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25FF1020C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25FF1020C6 | EP1SGX25FF1020C5N | EP1SGX25FF1020C7N | EP1SGX25FF1020C6ES | EP1SGX25FF1020C6BN |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (FF) | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (FF) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | C6 | C6 | C5 (-1 bin) | C7 (+1 bin) | C6 | C6 |
| Logic Elements | 25 660 | 25 660 | 25 660 | 25 660 | 25 660 | 25 660 |
| User I/O Count | 607 | 607 | 607 | 607 | 607 | 607 |
| Supply Voltage (Core) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free Finish | Yes (N suffix) | No (leaded finish) | Yes | Yes | Yes | Yes |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (USD, qty 1, as of 2026-09-07) | $217.51 | Lower (leaded, lower screening) | Lower (slower speed grade) | Higher (faster speed grade) | Similar (engineering sample) | Similar |
Wichtigste Unterscheidungsmerkmale
- Stratix GX hard-IP for PCI Express and serial protocols (vs. EP1SGX25DF1020C6N)
- Drop-in compatible within the Stratix GX 1020-FBGA family (vs. Xilinx Virtex-II Pro equivalent)
- Mid-density fabric with embedded transceivers (vs. Stratix II EP2SGX60FF1508C5N)
Designhinweise
The 1020-ball FC-FBGA at 1 mm pitch demands microvia or via-in-pad PCB technology for clean breakout. Plan at least 4 PCB layers with continuous GND planes beneath the BGA and matched-length (within 150 mil) differential routing for all multi-gigabit transceiver pairs. Decoupling: place 0.1 µF MLCCs on every VCCINT/GND ball pair within 2-3 mm of the package, plus bulk 10-22 µF tantalum or ceramic capacitors on the 1.5 V and 1.4 V (transceiver) rails.
Estimated: Stratix GX devices with active multi-gigabit transceivers typically dissipate 8-15 W depending on channel utilisation and toggle rate. With the FF (flip-chip) BGA's lower θJA compared to the wire-bond DF variant, a moderate copper pour on the top layer (≥ 25 cm² connected thermal pad) and 200 LFM airflow is sufficient for the 1020-FBGA. For enclosed chassis designs, attach a heatsink to the package lid with thermal interface material; verify with a CFD or thermal probe measurement on the prototype.
Do not reuse Altera legacy Quartus II projects targeting different Stratix GX speed grades without recompiling timing constraints - the C5/C6/C7 bins have different Fmax and IOE timing models. AC-couple every multi-gigabit transceiver channel with the capacitor value specified in the Stratix GX Device Handbook (typically 100 nF for 2.5 Gbps, 10 nF for 3.125 Gbps). Do not skip the nCONFIG / nSTATUS / CONF_DONE pull-ups or the MSEL[3:0] configuration mode pin settings, or the device will fail to configure silently.
Route transceiver differential pairs with 100 Ω differential impedance and keep intra-pair skew under 5 ps; use guard traces or ground-cox shielding if the layer stack permits. Reference-clock inputs (REFCLK) are extremely jitter-sensitive - drive them from a low-jitter clock conditioner (e.g., a dedicated PLL) rather than routing an FPGA-generated clock back into a REFCLK pin. For PCIe endpoints, maintain 85 Ω differential impedance per the PCIe CEM specification.
Compliance-Informationen
RoHS compliance verified via the 'N' suffix per Altera/Intel ordering information. REACH and conflict-minerals status assumed compliant based on Intel corporate policy; not separately verified in the provided web data. AEC-Q100 not applicable - part is a commercial-grade FPGA.
