EP1SGX25FF1020C6BN - Stratix GX FPGA 25.6K LE 1020-BGA | Intel
Teilenummer: EP1SGX25FF1020C6BN ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $850 | $850,00 |
| 10 | $790 | $7.900,00 |
| 100 | $720 | $72.000,00 |
| 500 | $665 | $332.500,00 |
| 1.000 | $620 | $620.000,00 |
EP1SGX25FF1020C6BN Übersicht
What is a Stratix GX FPGA? A Stratix GX FPGA is a high-density programmable logic device that combines general-purpose logic fabric with embedded high-speed serial transceivers, allowing system designers to implement wide parallel state machines and high-speed serial I/O on the same die. In the broader taxonomy: FPGA -> programmable logic -> digital IC -> semiconductor. Stratix GX parts are positioned between pure logic FPGAs (e.g., Cyclone) and full transceiver ASSP PHYs, giving a configurable fabric plus hardened multi-gigabit transceivers.
Key features include 607 maximum user I/O pins, embedded RAM organized as TriMatrix memory blocks (M512/M4K/M-RAM blocks totaling 1,944,576 bits), 20 embedded 18x18 multipliers for DSP, dedicated PLL clock networks, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM via dedicated DQS circuitry. The 130nm process node yields typical core frequencies up to 500 MHz for internal logic, while transceivers operate up to 3.125 Gbps per channel.
The architecture combines a 4-input look-up table (LUT)-based logic element array, dedicated routing, and pre-engineered hard IP such as the embedded transceiver blocks, which removes the need for external PHY ICs in many serial-link designs. The 1020-ball FC-FBGA package exposes a high pin count for memory and parallel I/O expansion while supporting the heat dissipation needed for active transceivers.
Typical applications include 1G/10G Ethernet bridging, Serial RapidIO interconnect, backplane SERDES, PCI Express endpoint implementations, proprietary chip-to-chip serial links in telecom/datacom equipment, and high-speed data-acquisition front ends. The combination of embedded transceivers and DSP blocks also suits line-card traffic managers and protocol-bridging ASIC replacements.
When designing with this device, plan thermal management carefully because transceiver channels and logic fabric together can pull several watts; the FC-BGA requires a multi-layer PCB with via-in-pad thermal vias to the internal ground/power planes. Use the Quartus II design suite (legacy software) and verify pinout against the Stratix GX device handbook, since the part is no longer recommended for new designs.
This page synthesizes distributor stock, same-family drop-in alternatives, lifecycle status and practical design notes that complement the manufacturer datasheet.
Drop-in-Alternativen für EP1SGX25FF1020C6BN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25FF1020C6BN (gleiche Bauform und Footprint) – abweichend in Speed Grade, Operating Temperature, Package Type, Process Technology, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25FF1020C6N
✅ Drop-In✓ Auf Lager
$160 / Stück
Datenblatt ansehen →EP1SGX25FF1020C6
✅ Drop-In✓ Auf Lager
$135 / Stück
Datenblatt ansehen →EP1SGX25FF1020C5N
✅ Drop-In✓ Auf Lager
$1580 / Stück
Datenblatt ansehen →EP1SGX25FF1020C5
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP1SGX25FF1020C4
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP1SGX25DF1020C6BN
✅ Drop-In✓ Auf Lager
$290 / Stück
Datenblatt ansehen →EP1SGX25FF1020C6BN Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Maximum User I/O | 607 |
| Total RAM Bits | 1,944,576 |
| Embedded Multipliers (18x18) | 20 |
| Process Technology | 130 nm |
| Core Voltage (VCCINT) | 1.5 V |
| Gehäuse | 1020-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Transceiver Channels | Up to 20 full-duplex |
| Max Transceiver Data Rate | 3.125 Gbps per channel |
| Internal Logic Frequency (max) | 500 MHz |
| Operating Temperature Grade | Commercial (C6) |
| Speed Grade | 6 |
| Montageart | Surface Mount (BGA) |
| Design Software | Quartus II (legacy) |
EP1SGX25FF1020C6BN 1020-ball fc-fbga (flip-chip fine-pitch bga) Pinbelegungsleitfaden
Pinbelegung für EP1SGX25FF1020C6BN (1020-ball fc-fbga (flip-chip fine-pitch bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25FF1020C6BN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25FF1020C6BN ist geeignet für 6 Anwendungs: Backplane SERDES for Telecom Line Cards, PCI Express Endpoint Card, Serial RapidIO Switch / Endpoint, High-Speed Data Acquisition Front End, 10G Ethernet MAC + Bridging, ASIC/ASSP Prototyping Platform.
Backplane SERDES for Telecom Line Cards
The EP1SGX25FF1020C6BN fits backplane SERDES designs on telecom line cards because its 20 embedded transceiver channels support up to 3.125 Gbps each, enabling proprietary chip-to-chip and backplane links above the 1 Gbps parallel threshold. Each channel provides 8b/10b encoding, word alignment, and rate-matching, removing the need for an external PHY. Placed between the framer ASIC and the backplane connector, the FPGA bridges protocols and absorbs format changes without a dedicated bridging ASIC. The 25,660 LE fabric plus 20 DSP blocks are sufficient for traffic-manager pre-classification, while 1,944,576 RAM bits hold multi-cell packet buffers. The 1020-BGA package exposes 607 user I/O for parallel TDM or LVDS links alongside the high-speed serial.
Empfohlen
PCI Express Endpoint Card
The EP1SGX25FF1020C6BN's hardened transceiver IP blocks can be configured for x1/x4 PCI Express, providing an early-generation endpoint for host-bus adapter cards at 2.5 Gbps per lane. The fabric implements the PCIe Transaction, Data Link and most of the Physical MAC layers, while the hard PHY handles 8b/10b encoding and serialization. This makes the part popular in legacy server/storage cards where PCIe IP licensing fees make a fully soft implementation costly. The 25,660 LE fabric holds DMA engines and lightweight protocol stacks. Board designers use the 1020-BGA with via-in-pad thermal vias because the active transceivers raise junction temperature under sustained 2.5 Gbps traffic.
Empfohlen
Serial RapidIO Switch / Endpoint
Stratix GX transceivers natively support Serial RapidIO at 1.25 / 2.5 / 3.125 Gbps, so the EP1SGX25FF1020C6BN can implement either a 4x or 8x RapidIO endpoint or a small embedded switch. The DSP blocks implement CRC, IDLE sequence insertion, and priority-based scheduling, while the fabric holds the logical I/O and message-passing state machines. Embedded RAM provides per-port virtual-channel buffering at line rate. Compared with a discrete SERDES + ASSP approach this single-chip integration reduces board area and BOM, especially on AMC and ATCA modules. The 1020-BGA footprint was retained across all speed grades, enabling board reuse between designs.
Empfohlen
High-Speed Data Acquisition Front End
The EP1SGX25FF1020C6BN suits high-speed ADC/DAC front ends where 14/16-bit converters running at 100-200 MSPS need an FPGA that can absorb streams, decimate, and forward to a host processor over serial links. The 607 user I/O pins interface directly to LVDS DDR source-synchronous ADC outputs, while the 20 transceivers forward processed data to a DSP or storage array at multiple gigabits per second. The 20 embedded 18x18 multipliers implement FIR decimation filters and digital down-conversion stages. The TriMatrix RAM (1,944,576 bits) holds data-acquisition windows and FFT bins. Industrial and defense test instruments from 2005-2012 used this exact part for its combination of LVDS bandwidth and SERDES in a single die.
Empfohlen
10G Ethernet MAC + Bridging
Ten-Gigabit Ethernet MAC and bridging functions fit comfortably in 25,660 LEs, and the EP1SGX25FF1020C6BN's transceivers can drive XAUI (4 x 3.125 Gbps) directly to an SFP+ or XFP optical module, providing a low-cost 10GE bridge. The fabric implements MAC framing, IFG, CRC, XGXS/PCS alignment, and rate adaptation to client-side parallel LVDS. Designers often pair it with an external PHY for line-side optics. Embedded RAM queues traffic for cut-through or store-and-forward operation. The 1020-BGA package enables both transceiver and parallel LVDS lanes on the same substrate, simplifying layout for switch line cards.
Empfohlen
ASIC/ASSP Prototyping Platform
When a discrete ASIC is not yet ready, the EP1SGX25FF1020C6BN acts as a development vehicle for early firmware bring-up, customer demos, and protocol validation. Its 25,660 LEs and 1.9 Mbit of RAM are enough to host pre-silicon RTL of a moderate-sized ASIC, and the 1020-BGA matches the planned ASIC ball map on many legacy projects, simplifying PCB migration. Twenty 3.125 Gbps transceivers model SERDES behaviour well enough for silicon-accurate validation. Use Quartus II for synthesis and verification - newer Quartus Prime releases dropped support for this family, so legacy toolchain is mandatory for prototyping continuity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25FF1020C6BN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25FF1020C6N | EP1SGX25FF1020C6 | EP1SGX25FF1020C5N | EP1SGX25FF1020C5 | EP1SGX25FF1020C4 | EP1SGX25DF1020C6BN |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | C6 (-1) | C6 (-1) - same | C6 (-1) - same | C5 (-2) - slower | C5 (-2) - slower | C4 (-3) - slowest | C6 (-1) - same |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (lower-power D-variant) |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Max Transceiver Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Embedded multi-gigabit transceivers (no external PHY) (vs. Cyclone series)
- Direct IE-grade ordering code preserves lead-free compliance (vs. EP1SGX25FF1020C6 (without N suffix))
- Higher speed grade C6 vs C5/C4 (vs. EP1SGX25FF1020C5 (lower speed bin))
Designhinweise
The 1020-ball FC-FBGA requires a high-density PCB with via-in-pad and microvia stack-ups (typically 8-12 layers with 0.4 mm ball pitch escape). Use the Altera Stratix GX board design guidelines for trace impedance (50 ohm SE / 100 ohm diff for transceivers), keep MGTL [transceiver] pairs length-matched within 5 mils, and provide solid GND/power planes adjacent to high-speed serial traces. Decoupling must follow the reference capacitor network from the datasheet (typically 0.1uF + 10uF per VCC/GND pair).
Active transceiver channels each dissipate approximately 100-150 mW, so with all 20 channels enabled total device power can exceed 5 W. Use a thermal pad array of via-in-pad microvias to inner copper planes and consider a heat spreader for sealed enclosures. Estimated: at 5 W and theta_JA = 11 C/W (with 4-layer thermal via array), junction temperature rise above ambient is roughly 55 C, so derate ambient to 65 C max for commercial temperature grade operation.
Configuration flash must use an Altera-supported EPCS or EPCQ device (3.3V for legacy AS mode); check the configuration scheme against the latest Quartus II release notes. Always assert CONF_DONE with the proper pull-up, and route JTAG TCK/TMS/TDO/TDI in a daisy chain that respects the 6 ns setup time. Do not hot-plug the FC-BGA - Intel/Altera does not support live insertion. Power-on ramp must satisfy the 0.1 ms-100 ms VCCINT rise time window stated in the datasheet, otherwise the POR circuit may mis-trigger.
Compliance-Informationen
RoHS/REACH/lead-free status for the C6BN ordering code is not explicitly stated in the provided web data; see Intel/Altera product page or manufacturer datasheet for definitive compliance information. AEC-Q100 is not applicable to commercial-grade FPGAs.
