EPM3256AFI256-10 - 256-Macrocell CPLD, 10ns, FBGA-256 | Intel
Teilenummer: EPM3256AFI256-10 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.3 | $18,30 |
| 10 | $16.85 | $168,50 |
| 100 | $15.2 | $1.520,00 |
| 500 | $13.75 | $6.875,00 |
| 1.000 | $12.4 | $12.400,00 |
EPM3256AFI256-10 Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs/GALs and FPGAs in the programmable logic hierarchy (SPLD -> CPLD -> FPGA -> programmable logic -> semiconductor). It uses a combination of AND/OR macrocell fabric and a predictable interconnect network to implement glue logic, interface bridging, and state-machine control functions with deterministic, fixed timing - making it ideal for designs that need deterministic sub-100ns response without FPGA configuration overhead.
Key features of the EPM3256AFI256-10 include MultiVolt I/O supporting 5.0V, 3.3V, and 2.5V logic interfaces, 5ns PCI-compliant timing in faster speed grades, 16 macocells per Logic Array Block (LAB) with 256 total macrocells, and a JTAG-compliant boundary-scan test interface. The MAX 3000A architecture shares the same JTAG, ISP, and 4-pin configuration protocols used across the broader MAX family, simplifying design reuse. The FineLine BGA-256 package provides high I/O density (161 user I/Os) for space-constrained systems, while the EEPROM process technology guarantees 100 program/erase cycles and 20-year data retention without external boot memory.
Typical applications include PCI bus interface glue logic, memory and processor address decoding, bus-width adaptation (e.g., 8-bit to 32-bit bridging), high-speed state-machine control, and power-sequencing logic in multi-rail systems. The deterministic timing makes it well-suited for industrial control, telecom line-card interfaces, and legacy peripheral replacement.
When designing with the EPM3256AFI256-10, ensure the I/O bank supply rails match the logic-level targets (VCCIO for output drive, VCCINT for core) and respect the device's 3.3V core requirement. Use Quartus II or MAX+PLUS II for design entry; legacy designs may continue using MAX+PLUS II for source compatibility.
This page synthesizes distributor stock, drop-in MAX 3000A family alternatives, and practical design notes not consolidated on the manufacturer product page or single distributor listing.
Drop-in-Alternativen für EPM3256AFI256-10 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM3256AFI256-10 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, In-System Programmability, Logic Family, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM3256AFI256-10N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPM3256AFC256-10
✅ Drop-In✓ Auf Lager
$19.95 / Stück
Datenblatt ansehen →EPM3256AFC256-10N
✅ Drop-In✓ Auf Lager
$25.95 / Stück
Datenblatt ansehen →EPM3256AFC256-7
✅ Drop-In✓ Auf Lager
$12.1 / Stück
Datenblatt ansehen →EPM3256AFI256-10 Grenzwerte & elektrische Eigenschaften
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 256 |
| User I/Os | 161 |
| Logic Elements / LABs | 16 Logic Elements per LAB |
| Propagation Delay (tPD) | 10 ns |
| Supply Voltage - Core | 3.3 V |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (MultiVolt I/O) |
| Programmability | In-System Programmable (ISP) via IEEE 1149.1 JTAG |
| Process Technology | CMOS EEPROM |
| Package Type | FBGA-256 (FineLine BGA) |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Montageart | Surface Mount (BGA) |
| Speed Grade | -10 (10 ns pin-to-pin) |
EPM3256AFI256-10 fbga-256 (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EPM3256AFI256-10 (fbga-256 (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM3256AFI256-10.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM3256AFI256-10 ist geeignet für 6 Anwendungs: PCI Local Bus Interface Glue Logic, Industrial Control / Factory Automation, Memory and Processor Address Decoding, Bus Width Bridging (8/16-bit to 32-bit), Power Sequencing and Reset Logic, Legacy Peripheral Replacement / Glue Logic Modernization.
PCI Local Bus Interface Glue Logic
The EPM3256AFI256-10 fits PCI bus interface glue logic with 161 user I/Os and deterministic 10 ns pin-to-pin delay. PCI Local Bus 2.2 requires 33 MHz operation with predictable address-decode and command-handling timing - the MAX 3000A architecture delivers fixed tPD independent of routing, which FPGAs cannot guarantee. Place the CPLD between the host bridge and 32-bit peripheral bus, using 5.0V-tolerant I/O for PCI signaling at 3.3V core; JTAG ISP enables post-assembly protocol fixes.
Empfohlen
Industrial Control / Factory Automation
The EPM3256AFI256-10 is ideal for industrial control applications with -40C to +85C operation and 256 macrocells. Implement deterministic state machines for PLC line-control, motor-driver sequencing, or sensor-multiplexing logic where instant-on non-volatile configuration matters. The 161 I/Os comfortably handle multiple encoder inputs (quadrature decode), relay-driver outputs, and Modbus/RS-485 interfaces; the 10 ns tPD guarantees tight control-loop timing regardless of routing density.
Empfohlen
Memory and Processor Address Decoding
Use the EPM3256AFI256-10 for memory and processor address decoding in embedded systems requiring deterministic chip-select generation. The 256 macrocells handle complex decode tables for multi-bank Flash, SRAM, and peripheral devices, while the 10 ns tPD stays inside typical memory-access budgets even at full 32-bit address width. MultiVolt I/O lets 5.0V memories and 3.3V processors share the same CPLD without level shifters, and JTAG ISP allows late-stage decode-table fixes after PCB bring-up.
Empfohlen
Bus Width Bridging (8/16-bit to 32-bit)
The EPM3256AFI256-10 bridges 8-bit and 16-bit peripherals to 32-bit host buses with its 161 user I/Os and 10 ns fixed delay. Capture and re-time multiplexed address/data buses in a single device, with the high I/O count accommodating both the wide host bus and multiple narrow peripherals in parallel. EEPROM non-volatile storage means instant-on bus-ready state without external boot configuration, and the deterministic timing simplifies bus-turnaround analysis versus FPGA-based alternatives.
Empfohlen
Power Sequencing and Reset Logic
The EPM3256AFI256-10 reliably sequences multi-rail power-up/down in servers, telecom line cards, and FPGA-based subsystems. With 161 I/Os and 256 macrocells, monitor PG (power-good) signals from dozens of rails, generate sequenced EN/MR signals, and provide glitch-filtered resets - all with 10 ns deterministic response. MultiVolt I/O interfaces directly to 5.0V supervisors and 3.3V/2.5V downstream regulators without level shifters, and EEPROM non-volatility ensures the sequencer logic is available before any FPGA config begins.
Empfohlen
Legacy Peripheral Replacement / Glue Logic Modernization
The EPM3256AFI256-10 modernizes legacy designs by replacing 7400-series TTL/MSI glue logic with a single programmable device. Consolidate dozens of AND/OR gates, latches, and one-shots into the 256-macrocell fabric, reducing board area and improving testability through JTAG boundary scan. With 161 I/Os the CPLD can absorb entire decoder/mux/buffer trees, and 10 ns tPD matches the propagation budget of the original TTL gates - even in industrial environments up to +85C.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM3256AFI256-10 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM3256AFI256-10N | EPM3256AFC256-10 | EPM3256AFC256-10N | EPM3256AFC256-7 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 (FineLine BGA) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Macrocells | 256 | 256 | 256 | 256 | 256 |
| User I/Os | 161 | 161 | 161 | 161 | 161 |
| Propagation Delay (tPD) | 10 ns | 10 ns | 10 ns | 10 ns | 7.5 ns (faster -7 grade) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| MultiVolt I/O | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V |
| In-System Programmability | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP |
| Lifecycle Status | Last-time-buy (MAX 3000A EOL) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade for harsh environments (vs. EPM3256AFC256-10)
- MultiVolt I/O with 5.0V tolerance on a 3.3V core (vs. MAX II EPM240)
- 161 user I/Os in FBGA-256 with 10 ns deterministic tPD (vs. Xilinx XC95288XL in similar BGA package)
Designhinweise
The FBGA-256 FineLine BGA package requires careful PCB layout: 1.0mm ball pitch, microvia-compatible land patterns, and matched-length traces for high-speed buses. Place at least four 0.1uF decoupling capacitors as close as possible to the VCCINT and VCCIO supply balls (typically distributed around the package perimeter). For JTAG ISP, route TMS, TCK, TDI, TDO through a 4-pin header with ESD protection. Solder paste stencil aperture should follow the package recommendation (typically 0.5mm diameter pads with 0.1mm stencil thickness).
Common pitfalls include: (1) mixing VCCIO and VCCINT - VCCINT must be 3.3V while VCCIO can be 2.5V/3.3V/5.0V per MultiVolt spec; (2) using JTAG TCK above the rated 10 MHz during ISP programming can fail silently - keep TCK at or below 10 MHz; (3) leaving the OE/CEO# pins floating causes high-Icc standby - tie to known state via 10k resistor; (4) PCI 2.2 timing requires -4/-5/-6/-7 speed grades, NOT the -10 grade - verify speed grade selection. Always check the BSDL file for the exact device before in-system test.
Estimated: at maximum toggle rate (~100 MHz internal, 161 I/Os at 33 MHz PCI), the EPM3256AFI256-10 dissipates roughly 0.5-1.0 W from the 3.3V core supply. The FBGA-256 package's theta_JA is typically 25-30 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of 15-30 C above ambient. For industrial -40C to +85C operation no heatsink is required, but adequate airflow is recommended when the device is mounted near heat sources (e.g., FPGAs or DC-DC converters).
JTAG chain routing: when the EPM3256AFI256-10 is in a JTAG chain with other devices (FPGAs, boundary-scan ICs), match the TMS and TCK trace lengths within 50 mils to avoid setup/hold violations at high TCK frequencies. Place a 10k pull-up on TCK and a 10k pull-up on TMS to keep them in known states during power-up. Add a 4.7k series resistor on TDI/TDO for signal integrity if the JTAG cable exceeds 6 inches. Refer to AN 39: JTAG Boundary-Scan Testing for MAX Series Devices for full layout guidance.
Compliance-Informationen
RoHS, REACH, lead-free, and halogen-free status not provided in the verified web data - listed as [DATA_NEEDED]. The -10N suffix on EPM3256AFI256-10N conventionally indicates lead-free finish per Altera/Intel naming convention. Not AEC-Q100 qualified (industrial-grade CPLD, not automotive).
