EPM3256AFI256-10 - 256-Macrocell CPLD, 10ns, FBGA-256 | Intel
MPN: EPM3256AFI256-10 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.3 | $18.30 |
| 10 | $16.85 | $168.50 |
| 100 | $15.2 | $1,520.00 |
| 500 | $13.75 | $6,875.00 |
| 1,000 | $12.4 | $12,400.00 |
Drop-in alternatives for EPM3256AFI256-10 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3256AFI256-10N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM3256AFC256-10
✅ Drop-In✓ In Stock
$19.95 / Unit
View Datasheet →EPM3256AFC256-10N
✅ Drop-In✓ In Stock
$25.95 / Unit
View Datasheet →EPM3256AFC256-7
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →EPM3256AFI256-10 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 256 |
| User I/Os | 161 |
| Logic Elements / LABs | 16 Logic Elements per LAB |
| Propagation Delay (tPD) | 10 ns |
| Supply Voltage - Core | 3.3 V |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (MultiVolt I/O) |
| Programmability | In-System Programmable (ISP) via IEEE 1149.1 JTAG |
| Process Technology | CMOS EEPROM |
| Package Type | FBGA-256 (FineLine BGA) |
| Operating Temperature | -40C to +85C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | -10 (10 ns pin-to-pin) |
EPM3256AFI256-10 fbga-256 (fineline bga) Pin Configuration Guide
Complete pinout information for EPM3256AFI256-10 (fbga-256 (fineline bga) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3256AFI256-10.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3256AFI256-10 is suitable for 6 applications: PCI Local Bus Interface Glue Logic, Industrial Control / Factory Automation, Memory and Processor Address Decoding, Bus Width Bridging (8/16-bit to 32-bit), Power Sequencing and Reset Logic, Legacy Peripheral Replacement / Glue Logic Modernization.
PCI Local Bus Interface Glue Logic
The EPM3256AFI256-10 fits PCI bus interface glue logic with 161 user I/Os and deterministic 10 ns pin-to-pin delay. PCI Local Bus 2.2 requires 33 MHz operation with predictable address-decode and command-handling timing - the MAX 3000A architecture delivers fixed tPD independent of routing, which FPGAs cannot guarantee. Place the CPLD between the host bridge and 32-bit peripheral bus, using 5.0V-tolerant I/O for PCI signaling at 3.3V core; JTAG ISP enables post-assembly protocol fixes.
Recommended
Industrial Control / Factory Automation
The EPM3256AFI256-10 is ideal for industrial control applications with -40C to +85C operation and 256 macrocells. Implement deterministic state machines for PLC line-control, motor-driver sequencing, or sensor-multiplexing logic where instant-on non-volatile configuration matters. The 161 I/Os comfortably handle multiple encoder inputs (quadrature decode), relay-driver outputs, and Modbus/RS-485 interfaces; the 10 ns tPD guarantees tight control-loop timing regardless of routing density.
Recommended
Memory and Processor Address Decoding
Use the EPM3256AFI256-10 for memory and processor address decoding in embedded systems requiring deterministic chip-select generation. The 256 macrocells handle complex decode tables for multi-bank Flash, SRAM, and peripheral devices, while the 10 ns tPD stays inside typical memory-access budgets even at full 32-bit address width. MultiVolt I/O lets 5.0V memories and 3.3V processors share the same CPLD without level shifters, and JTAG ISP allows late-stage decode-table fixes after PCB bring-up.
Recommended
Bus Width Bridging (8/16-bit to 32-bit)
The EPM3256AFI256-10 bridges 8-bit and 16-bit peripherals to 32-bit host buses with its 161 user I/Os and 10 ns fixed delay. Capture and re-time multiplexed address/data buses in a single device, with the high I/O count accommodating both the wide host bus and multiple narrow peripherals in parallel. EEPROM non-volatile storage means instant-on bus-ready state without external boot configuration, and the deterministic timing simplifies bus-turnaround analysis versus FPGA-based alternatives.
Recommended
Power Sequencing and Reset Logic
The EPM3256AFI256-10 reliably sequences multi-rail power-up/down in servers, telecom line cards, and FPGA-based subsystems. With 161 I/Os and 256 macrocells, monitor PG (power-good) signals from dozens of rails, generate sequenced EN/MR signals, and provide glitch-filtered resets - all with 10 ns deterministic response. MultiVolt I/O interfaces directly to 5.0V supervisors and 3.3V/2.5V downstream regulators without level shifters, and EEPROM non-volatility ensures the sequencer logic is available before any FPGA config begins.
Recommended
Legacy Peripheral Replacement / Glue Logic Modernization
The EPM3256AFI256-10 modernizes legacy designs by replacing 7400-series TTL/MSI glue logic with a single programmable device. Consolidate dozens of AND/OR gates, latches, and one-shots into the 256-macrocell fabric, reducing board area and improving testability through JTAG boundary scan. With 161 I/Os the CPLD can absorb entire decoder/mux/buffer trees, and 10 ns tPD matches the propagation budget of the original TTL gates - even in industrial environments up to +85C.
Recommended
Recommended Products Summary
Engineering reference data for EPM3256AFI256-10 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3256AFI256-10N | EPM3256AFC256-10 | EPM3256AFC256-10N | EPM3256AFC256-7 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 (FineLine BGA) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Macrocells | 256 | 256 | 256 | 256 | 256 |
| User I/Os | 161 | 161 | 161 | 161 | 161 |
| Propagation Delay (tPD) | 10 ns | 10 ns | 10 ns | 10 ns | 7.5 ns (faster -7 grade) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| MultiVolt I/O | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V |
| In-System Programmability | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP | IEEE 1149.1 JTAG ISP |
| Lifecycle Status | Last-time-buy (MAX 3000A EOL) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Industrial temperature grade for harsh environments (vs EPM3256AFC256-10)
- MultiVolt I/O with 5.0V tolerance on a 3.3V core (vs MAX II EPM240)
- 161 user I/Os in FBGA-256 with 10 ns deterministic tPD (vs Xilinx XC95288XL in similar BGA package)
Design Notes
The FBGA-256 FineLine BGA package requires careful PCB layout: 1.0mm ball pitch, microvia-compatible land patterns, and matched-length traces for high-speed buses. Place at least four 0.1uF decoupling capacitors as close as possible to the VCCINT and VCCIO supply balls (typically distributed around the package perimeter). For JTAG ISP, route TMS, TCK, TDI, TDO through a 4-pin header with ESD protection. Solder paste stencil aperture should follow the package recommendation (typically 0.5mm diameter pads with 0.1mm stencil thickness).
Common pitfalls include: (1) mixing VCCIO and VCCINT - VCCINT must be 3.3V while VCCIO can be 2.5V/3.3V/5.0V per MultiVolt spec; (2) using JTAG TCK above the rated 10 MHz during ISP programming can fail silently - keep TCK at or below 10 MHz; (3) leaving the OE/CEO# pins floating causes high-Icc standby - tie to known state via 10k resistor; (4) PCI 2.2 timing requires -4/-5/-6/-7 speed grades, NOT the -10 grade - verify speed grade selection. Always check the BSDL file for the exact device before in-system test.
Estimated: at maximum toggle rate (~100 MHz internal, 161 I/Os at 33 MHz PCI), the EPM3256AFI256-10 dissipates roughly 0.5-1.0 W from the 3.3V core supply. The FBGA-256 package's theta_JA is typically 25-30 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of 15-30 C above ambient. For industrial -40C to +85C operation no heatsink is required, but adequate airflow is recommended when the device is mounted near heat sources (e.g., FPGAs or DC-DC converters).
JTAG chain routing: when the EPM3256AFI256-10 is in a JTAG chain with other devices (FPGAs, boundary-scan ICs), match the TMS and TCK trace lengths within 50 mils to avoid setup/hold violations at high TCK frequencies. Place a 10k pull-up on TCK and a 10k pull-up on TMS to keep them in known states during power-up. Add a 4.7k series resistor on TDI/TDO for signal integrity if the JTAG cable exceeds 6 inches. Refer to AN 39: JTAG Boundary-Scan Testing for MAX Series Devices for full layout guidance.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not provided in the verified web data - listed as [DATA_NEEDED]. The -10N suffix on EPM3256AFI256-10N conventionally indicates lead-free finish per Altera/Intel naming convention. Not AEC-Q100 qualified (industrial-grade CPLD, not automotive).
