EPM3512AFC256-10N - MAX 3000A CPLD, 512 Macros, 256 FBGA | Altera
Teilenummer: EPM3512AFC256-10N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $72.03 | $72,03 |
| 10 | $64.83 | $648,30 |
| 100 | $57.62 | $5.762,00 |
| 500 | $50.42 | $25.210,00 |
| 1.000 | $43.22 | $43.220,00 |
EPM3512AFC256-10N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs/PLDs and large FPGAs in the programmable logic hierarchy: SPLD -> CPLD -> FPGA. The MAX architecture integrates multiple Logic Array Blocks (LABs) interconnected by a programmable interconnect array (PIA) and provides predictable, deterministic timing suitable for glue logic, bus decoding, and state-machine replacement.
Key features of the EPM3512AFC256-10N include in-system programmability (ISP) through the built-in IEEE Std. 1149.1 JTAG interface and IEEE Std. 1532 concurrent ISP support, 10 ns tPD (pin-to-pin delay), up to 4.5 ns tSU (setup time), and 32 product-terms per macrocell. The device supports multiVolt I/O for interfacing with 2.5 V, 3.3 V, and 5 V systems (with external pull-ups), and provides open-drain output options. It is built on 5.0 V-tolerant I/O cells powered by 3.3 V VCCINT.
Architecturally, the EPM3512AFC256-10A-equivalent die uses Altera's classic MAX EEPROM-based logic fabric with a global PIA, four dedicated input clocks per device, and per-macrocell flip-flops with configurable clear/preset and clock-enable. The 256-pin FBGA offers high board-density routing for designs with extensive user I/O. Programming is supported through the ByteBlasterMV, MasterBlaster, or USB-Blaster download cables using Altera Quartus II design software.
Typical applications include bus-interface bridging, address decoding and chip-select generation, peripheral glue logic in embedded systems, and pin-compatible upgrades to MAX 7000S/AE devices in 5 V legacy boards. The 256-ball FBGA footprint is ideal for space-constrained designs where high I/O count is required.
When designing with this part, ensure VCCINT is a clean 3.3 V (typical Icc 35-180 mA standby to operating) and that JTAG chain integrity is verified for ISP. Plan for 100% factory-test vector coverage since the part is one-time-programmable (OTP) in production configurations and not field-upgradable without a JTAG chain.
This page synthesizes distributor pricing, drop-in compatible MAX 3000A/MAX 7000 alternatives, FBGA package handling notes, and JTAG ISP guidance not consolidated in the original Altera datasheet.
Drop-in-Alternativen für EPM3512AFC256-10N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM3512AFC256-10N (gleiche Bauform und Footprint) – abweichend in Package, Programming Interface, Maximum Operating Frequency, Speed Grade, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM3512AFC256-10
✅ Drop-In✓ Auf Lager
$17.5 / Stück
Datenblatt ansehen →EPM3512AFC256-10N Grenzwerte & elektrische Eigenschaften
| Family | MAX 3000A |
| Macrocells | 512 |
| Usable Gates | 10000 |
| User I/O Pins | 208 |
| Pin-to-Pin Delay (tPD) | 10 ns |
| Setup Time (tSU) | 4.5 ns |
| VCCINT (Core Supply) | 3.3 V |
| VCCIO (I/O Supply) | 3.3 V or 2.5 V |
| Technology | CMOS EEPROM-based, non-volatile |
| Operating Temperature (Commercial) | 0 C to +70 C |
| Gehäuse | 256-ball FBGA (17 mm x 17 mm) |
| ISP Interface | IEEE Std. 1149.1 JTAG, IEEE Std. 1532 |
| Montageart | Surface Mount (BGA) |
EPM3512AFC256-10N 256-ball fbga (17 mm x 17 mm) Pinbelegungsleitfaden
Pinbelegung für EPM3512AFC256-10N (256-ball fbga (17 mm x 17 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM3512AFC256-10N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM3512AFC256-10N ist geeignet für 6 Anwendungs: Bus Interface Bridging and Address Decoding, Peripheral Glue Logic Replacement, Legacy 3.3 V Embedded System Upgrades, Industrial Control Logic, State Machine Replacement, Telecommunications Backplane Glue Logic.
Bus Interface Bridging and Address Decoding
The EPM3512AFC256-10N's 512 macrocells and 10 ns tPD make it well suited for high-density address decoding and bus-interface bridging in embedded systems. Its deterministic MAX-architecture timing produces stable chip-select generation across the full commercial temperature range (0 C to +70 C), critical for synchronous memory and peripheral interfaces where metastable decoding would cause system lockups. The 208 user I/Os allow one device to replace several discrete 74LS/74F glue-logic packages on a legacy CPU/ASIC bus, saving board area and reducing BOM. The built-in IEEE 1149.1 JTAG interface enables ISP updates for late-stage board revision changes.
Empfohlen
Peripheral Glue Logic Replacement
The EPM3512AFC256-10N is commonly used to replace multiple discrete PAL/GAL and 74xx logic packages with a single programmable device, reducing board complexity and assembly cost. With 10K usable gates and 208 I/Os, a designer can integrate up to ~30 SSI/MSI functions including interrupt controllers, wait-state generators, and FIFO flag logic into one 256-ball FBGA. The MAX 3000A architecture's per-macrocell flip-flops with clear/preset and clock-enable provide the latching and registered-logic primitives needed for state-machine replacement. Programming is non-volatile (EEPROM), so no external configuration device is required.
Empfohlen
Legacy 3.3 V Embedded System Upgrades
The EPM3512AFC256-10N's 3.3 V VCCINT and multiVolt VCCIO (2.5 V or 3.3 V) make it an ideal 3.3 V-system upgrade for legacy designs that previously used 5 V PALs but require reduced power. The I/O pins are 5 V tolerant with external pull-up resistors when VCCIO is at 3.3 V, enabling mixed-voltage interfacing to 5 V peripherals without level translators. The 256-ball FBGA (17 mm x 17 mm) keeps the design compact for embedded form factors, while 10 ns tPD supports 50 MHz+ control-plane signal paths. Designers upgrading from MAX 7000S/MAX 7000AE devices find MAX 3000A pin-compatible in many cases.
Empfohlen
Industrial Control Logic
Industrial control boards benefit from the EPM3512AFC256-10N's predictable MAX architecture timing, 208 user I/Os, and 10 ns propagation delay. The deterministic timing simplifies Worst-Case timing analysis for safety-critical paths, and the EEPROM-based non-volatile configuration eliminates the need for separate boot PROMs. Commercial 0 C to +70 C operation is adequate for indoor industrial enclosures; the 256-ball FBGA footprint provides high-density I/O for PLC backplane and HMI controller designs. JTAG ISP enables in-field firmware updates through a JTAG header on the production board, supporting late-stage customization and configuration changes.
Empfohlen
State Machine Replacement
The EPM3512AFC256-10N is widely deployed as a replacement for discrete MSI state machines, particularly in protocol-conversion and sequencing logic. Each macrocell provides a flip-flop with programmable clear, preset, and clock-enable, supporting Moore and Mealy machines directly. With 32 product-terms per macrocell and a global PIA (Programmable Interconnect Array), the device supports deep combinatorial logic alongside registered outputs. The 10 ns tPD enables state-transition frequencies up to 50 MHz for serial-protocol bit-banging and 25 MHz for parallel hand-shaking interfaces common in legacy data-acquisition systems.
Empfohlen
Telecommunications Backplane Glue Logic
In telecommunications backplanes, the EPM3512AFC256-10N's 208 I/Os make it ideal for switch-fabric glue logic, line-card presence detection, and clock-distribution control. Its 10 ns tPD supports 50 MHz control-plane traffic typical of T1/E1 and low-speed SONET interfaces, while the multiVolt I/O allows direct connection to 2.5 V backplane drivers when VCCIO is set to 2.5 V. The IEEE 1149.1 JTAG ISP interface aligns with board-level boundary-scan test requirements for telecom hardware, simplifying manufacturing test flows. The 256-ball FBGA's high pin density minimizes backplane trace congestion in densely-populated line cards.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM3512AFC256-10N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM3512AFC256-10 | EPM3512AFC144-10N |
|---|---|---|---|
| Package | 256-ball FBGA (17x17 mm) | 256-ball FBGA (17x17 mm) - same | 144-ball FBGA - DIFFERENT |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same |
| Family | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 | 512 (same die, smaller package) |
| User I/O | 208 | 208 | ~98 (smaller package) |
| Pin-to-Pin Delay (tPD) | 10 ns | 10 ns | 10 ns |
| VCCINT | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free / RoHS | Yes (N suffix) | No (tin-lead finish) | Yes (N suffix) |
| Lifecycle | Obsolete (as of 2026-09-12) | Obsolete | Obsolete |
| Pin-Compatible Drop-In | (this product) | YES (verified parametric equivalent per DigiKey) | NO (different ball count) |
Wichtigste Unterscheidungsmerkmale
- Largest I/O count in MAX 3000A family (208 user I/O) (vs. EPM3256AFC256-10)
- Lead-free (RoHS) finish option for modern assembly (vs. EPM3512AFC256-10)
- Industry-standard JTAG ISP via IEEE 1149.1 / 1532 (vs. EPM3512AFC144-10N)
Designhinweise
Estimated: For a typical commercial-grade EPM3512AFC256-10N with VCCINT = 3.3 V, average Icc is 35-180 mA depending on toggle rate and utilization, yielding ~0.12 W to ~0.6 W dissipation. With a 256-ball FBGA theta_JA typically in the 25-35 C/W range on a 4-layer JEDEC test board (per Altera MAX 3000A datasheet thermal considerations), junction temperature rise stays well below 20 C above ambient at 0.6 W. No external heatsink is required for commercial (0 C to +70 C) operation. For dense stacked designs, ensure at least 4 thermal vias under the BGA thermal pad region if specified.
FBGA-256 (17 mm x 17 mm) requires controlled-impedance PCB stack-up with 0.8 mm ball pitch. Use NSMD (Non-Solder Mask Defined) pads with 0.40-0.45 mm diameter, ENIG or OSP surface finish, and Type-3 or Type-4 solder paste (SAC305). Per IPC-7351 / IPC-7093 BGA guidelines, place a minimum 6x6 thermal-via array under the central thermal balls, each via 0.2-0.3 mm drilled and tented/plugged to prevent solder wicking. X-ray inspection is mandatory post-reflow; optical inspection cannot reliably verify BGA solder joints.
Do NOT assume the EPM3512AFC256-10N can be replaced by the lower-density EPM3256AFC256-10N - both share the FBGA-256 footprint but differ in macrocell count (512 vs 256), which is fatal for board-level functionality even if pin-by-pin compatible at the I/O ball level. The 'N' suffix denotes lead-free finish - the 'non-N' EPM3512AFC256-10 is tin-lead and may not pass modern RoHS assembly lines. JTAG chain integrity (TCK/TMS/TDI/TDO with proper 10 kohm pull-ups on TCK/TMS/TDI) must be verified before ISP - a single broken JTAG link bricks in-system programming.
Compliance-Informationen
RoHS compliance inferred from 'N' suffix in MPN per Altera/Intel nomenclature. REACH, halogen-free, and conflict-minerals status not stated in archived datasheet excerpts - marked as 'unknown'. AEC-Q100 not applicable - part is commercial-grade (0 C to +70 C).
