EPM3512AFC256-23 - MAX 3000A CPLD, 512 Macrocells, 256-BGA | Altera
Teilenummer: EPM3512AFC256-23 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2.180,00 |
| 500 | $18.5 | $9.250,00 |
| 1.000 | $15.75 | $15.750,00 |
EPM3512AFC256-23 Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the architectural simplicity of PAL/GAL with the density of an FPGA, providing fast, deterministic propagation delays for glue logic, bus decoding, and state-machine implementation. The MAX 3000A family sits in the broader hierarchy as CPLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor, serving as the high-density tier above the legacy MAX 7000 series.
Key features include 512 macrocells organized in 16 Logic Array Blocks (LABs) of 32 macrocells each, 100% routable resources, JTAG-based boundary-scan test support, in-system programmability (ISP) through the JTAG interface, and pin compatibility with other MAX 3000A devices in the same 256-pin BGA footprint. The 256-ball FineLine BGA provides a compact 17 mm x 17 mm form factor.
The device is fabricated on a 0.30 µm CMOS EEPROM process, giving the MAX 3000A family its non-volatile, instant-on behavior with zero standby current for configuration memory. The MultiVolt I/O architecture separates VCCINT (3.3 V internal core) from VCCIO (2.5 V/3.3 V/5.0 V selectable output driver) banks, enabling mixed-voltage interfacing without external level translators.
Typical applications include industrial control glue logic, address decoding for microprocessor and DSP systems, bus interfacing between 5 V and 3.3 V peripherals, peripheral controller replacement of discrete 74-series TTL/CMOS logic, and state-machine implementation in test and measurement equipment.
When designing with the EPM3512AFC256-23, allocate sufficient decoupling (one 0.1 µF ceramic per VCC/VCCIO ball group plus bulk capacitors near the supply pins) and follow Altera's recommended JTAG chain topology for in-system programming. The BGA package requires X-ray or optical inspection of solder joints in production.
Drop-in-Alternativen für EPM3512AFC256-23 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM3512AFC256-23 (gleiche Bauform und Footprint) – abweichend in Package, Logic Array Blocks (LABs), Usable Gates, In-System Programmability, Configuration Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM3512AFC256-10N
✅ Drop-In✓ Auf Lager
$43.22 / Stück
Datenblatt ansehen →EPM3512AFC256-10
✅ Drop-In✓ Auf Lager
$17.5 / Stück
Datenblatt ansehen →EPM3512AFC256-22
✅ Drop-In✓ Auf Lager
$16.1 / Stück
Datenblatt ansehen →EPM3512AFC256-20
✅ Drop-In✓ Auf Lager
$9.75 / Stück
Datenblatt ansehen →EPM3512AFC256-2
✅ Drop-In✓ Auf Lager
$14.85 / Stück
Datenblatt ansehen →EPM3256AFC256-10
✅ Drop-In✓ Auf Lager
$19.95 / Stück
Datenblatt ansehen →EPM3256AFC256-10N
✅ Drop-In✓ Auf Lager
$25.95 / Stück
Datenblatt ansehen →EPM3512AFC256-23 Grenzwerte & elektrische Eigenschaften
| Family | MAX 3000A |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| Logic Array Blocks (LABs) | 16 (32 macrocells each) |
| Maximum Operating Frequency | 178.6 MHz |
| Propagation Delay (tPD) | 5.5 ns |
| Pin-to-Pin Delay | 23 ns |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Gehäuse | 256-ball FineLine BGA (FC256), 17 mm x 17 mm |
| Programming Interface | JTAG (IEEE Std. 1149.1) / ISP |
| Process Technology | 0.30 µm CMOS EEPROM |
| Montageart | Surface Mount (BGA) |
EPM3512AFC256-23 256-ball fineline bga (fc256), 17 mm x 17 mm Pinbelegungsleitfaden
Pinbelegung für EPM3512AFC256-23 (256-ball fineline bga (fc256), 17 mm x 17 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM3512AFC256-23.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM3512AFC256-23 ist geeignet für 6 Anwendungs: Industrial Glue Logic Consolidation, Address Decoding for Microprocessor Systems, Mixed-Voltage Bus Interfacing (5 V / 3.3 V / 2.5 V), Peripheral Controller Replacement of 74-series Logic, Test and Measurement Equipment State Machines, Legacy System Sustainment and Obsolete-Part Bridge.
Industrial Glue Logic Consolidation
The EPM3512AFC256-23's 512 macrocells and 10,000 usable gates make it ideal for replacing dozens of 74-series TTL/CMOS logic chips with a single programmable device in industrial control systems. With a 5.5 ns internal propagation delay, it delivers deterministic timing for interlock logic, mode decoding, and peripheral chip-select generation in PLC backplanes. The MultiVolt I/O architecture lets the same CPLD interface with both 5 V legacy peripherals and 3.3 V modern MCUs on a per-bank basis, eliminating external level shifters. In-system programmability via JTAG enables field firmware updates on deployed equipment without removing boards.
Empfohlen
Address Decoding for Microprocessor Systems
The EPM3512AFC256-23 is well suited for address decoding and chip-select generation in 8/16/32-bit microprocessor and DSP systems, where its 512 macrocells can decode wide address buses and generate multiple peripheral selects in a single device. The 5.5 ns tPD ensures decoder outputs settle within a single clock cycle at typical 33-50 MHz bus frequencies, avoiding wait-state insertion. The non-volatile EEPROM configuration means the decoder becomes active at power-up with zero configuration delay, eliminating the boot-time penalty of SRAM-based FPGAs.
Empfohlen
Mixed-Voltage Bus Interfacing (5 V / 3.3 V / 2.5 V)
With MultiVolt I/O banks supporting 2.5 V, 3.3 V, and 5.0 V signaling on the same device, the EPM3512AFC256-23 bridges legacy 5 V peripherals with modern 3.3 V or 2.5 V processors without external level-translator ICs. The 512 macrocells can implement multiple bidirectional bus switches, voltage-translating FIFOs, or protocol converters in a single chip. The 23 ns pin-to-pin delay (-23 speed grade) is acceptable for bus speeds up to about 40 MHz, covering most asynchronous peripheral interconnects including UART, SPI, and parallel data buses.
Empfohlen
Peripheral Controller Replacement of 74-series Logic
The EPM3512AFC256-23 can absorb entire boards of discrete 74LS/74HC/74F-series glue logic, reducing component count, board area, and BOM cost in mature designs. Its 16 LABs with 32 macrocells each provide abundant product-term resources for wide combinational functions and registered state machines. JTAG-based ISP enables last-minute logic changes during prototype bring-up without board respins, accelerating development cycles. The 256-ball BGA package keeps the footprint compact despite the high logic density.
Empfohlen
Test and Measurement Equipment State Machines
The EPM3512AFC256-23's deterministic 5.5 ns tPD and non-volatile instant-on behavior make it a reliable choice for state-machine implementation in test and measurement instruments such as bench multimeters, oscilloscope front panels, and protocol analyzers. The 512 macrocells support deep FSMs with many states and complex output decoding, while the JTAG interface provides built-in boundary-scan test capability that simplifies board-level manufacturing test. The MultiVolt I/O interfaces directly with both legacy 5 V displays and modern 3.3 V ADCs.
Empfohlen
Legacy System Sustainment and Obsolete-Part Bridge
For designs originally implemented with the EPM3512AFC256-23 that have reached end-of-production, the same Altera MAX 3000A family continues to be supported by Altera's Quartus II toolchain, allowing new firmware revisions to be compiled and programmed without hardware redesign. Engineers can also migrate to the pin-compatible EPM3512AFC256-10N (same FC256 BGA, same 512 macrocells, faster timing) to gain performance headroom on the existing PCB footprint. Distributors including VEKEMO, FPGAkey, and Ampheo stock remaining inventory for legacy sustainment programs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM3512AFC256-23 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-22 | EPM3512AFC256-20 | EPM3512AFC256-2 | EPM3256AFC256-10 |
|---|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (FC256) | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same | 256-ball FineLine BGA (FC256) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 | 256 |
| Pin-to-Pin Delay | 23 ns | 10 ns (faster) | 10 ns (faster) | 22 ns (near-identical) | 20 ns (faster) | 2 ns (much faster) | 10 ns (faster) |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 5,000 |
| Logic Array Blocks | 16 | 16 | 16 | 16 | 16 | 16 | 8 |
| I/O Voltage Support | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V | 2.5 V / 3.3 V / 5.0 V |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP |
Wichtigste Unterscheidungsmerkmale
- Highest-density MAX 3000A with 512 macrocells in FC256 BGA (vs. EPM3256AFC256-10)
- Drop-in upgrade path to faster 10 ns timing (vs. EPM3512AFC256-10N)
- MultiVolt I/O supports 2.5 V / 3.3 V / 5.0 V mixed-voltage buses (vs. MAX II (EPM1270F256C5N))
Designhinweise
The MAX 3000A family separates VCCINT (3.3 V core supply) from VCCIO (2.5 V/3.3 V/5.0 V output driver supply). Each supply must be decoupled locally with at least one 0.1 µF ceramic capacitor per supply ball group plus a bulk 10-47 µF tantalum or polymer capacitor near the package. Power sequencing is not strictly required, but VCCINT and VCCIO should ramp within 100 ms of each other to avoid latch-up. Estimated: ICCINT current at 50 MHz operation is approximately 100-200 mA depending on logic utilization - consult the MAX 3000A datasheet power calculator for your specific design.
The 256-ball FineLine BGA package uses a 1.0 mm ball pitch, which requires 0.5 mm via-pad geometry and 4-layer PCB stack-up with continuous ground and power planes for signal return paths. All BGA balls must be routed out using dog-bone fan-out or via-in-pad technology; escape routing requires at least 4 routing layers. Follow Altera's recommended land pattern from the package mechanical drawing. Production solder joint inspection requires X-ray or cross-sectioning; AOI is insufficient for hidden BGA joints.
The MAX 3000A EEPROM configuration memory is rated for a minimum of 100 program/erase cycles - do not use ISP for high-frequency in-field updates without verifying the endurance budget. The -23 speed grade's 23 ns pin-to-pin delay limits fMAX to about 178 MHz internal but typically 40-50 MHz for complex multi-level logic; if timing closure fails in Quartus timing analysis, switch to a faster speed grade (e.g., EPM3512AFC256-10N at 10 ns) rather than reducing design complexity. Always connect unused JTAG pins per datasheet to avoid floating-input issues.
Compliance-Informationen
Compliance information not explicitly stated in the verified web data. The MAX 3000A family was originally launched before RoHS mandates; later production runs may be RoHS-compliant, but this should be verified per lot from the distributor. AEC-Q100 not applicable - the device is not marketed for automotive use.
