EPM7256EGC192-12EM - MAX 7000 CPLD 256 Macro 12ns 192-Pin PGA | Intel / Altera
Teilenummer: EPM7256EGC192-12EM ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $76.5 | $765,00 |
| 100 | $68 | $6.800,00 |
| 250 | $62.5 | $15.625,00 |
| 500 | $58 | $29.000,00 |
EPM7256EGC192-12EM Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits hierarchically between simple PLDs and FPGAs. CPLDs use a classic PLA-like architecture (AND/OR arrays feeding macrocells with flip-flops) and provide deterministic, fast I/O-to-I/O timing with predictable pin-to-pin delays - typically 3-15 ns - making them ideal for glue logic, address decoding, bus arbitration, state-machine control, and boot-loader configuration of FPGAs/ASICs. The MAX 7000 family belongs to the broader Programmable Logic Device > Programmable Logic > Semiconductor Device category tree.
Key specifications include 256 macrocells with 16 macrocell logic array blocks (LABs), 164 user I/O pins (16 of which are JTAG/dedicated), 5 V core / 3.3 V or 5 V I/O multi-voltage compatibility via MultiVolt I/O, 5 ns input setup time, and programmable interconnect array (PIA). The PGA-192 ceramic package supports commercial and industrial temperature grades with a maximum junction temperature of 150 C, while the -EM suffix designates a specific Altera package/temperature/lead-finish ordering option.
Typical applications include high-speed bus bridging and decoding (PCI, VME), peripheral interface glue logic (UART, DMA, memory controllers), state-machine controllers, industrial control boards, telecom backplane interface logic, and configuration controllers for FPGAs/ASICs. The deterministic 12 ns tPD makes it ideal for asynchronous control paths where FPGAs would add unnecessary latency and cost.
When designing with the EPM7256EGC192-12EM, ensure all VCCINT (5 V) and VCCIO bank pins are properly decoupled with 0.1 uF and 10 uF capacitors placed close to the package. The ceramic PGA-192 socket footprint requires through-hole PCB pads - confirm your board supports PGA (not BGA/QFP) before committing to this package. Use the JTAG TCK frequency at or below 16 MHz for ISP programming.
This page synthesizes distributor pricing, drop-in MAX 7000 same-package alternatives, and practical design notes not found in the Altera legacy datasheet, helping engineers extend the lifecycle of mature MAX 7000 designs without PCB rework.
Drop-in-Alternativen für EPM7256EGC192-12EM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM7256EGC192-12EM (gleiche Bauform und Footprint) – abweichend in Supply Voltage (VCCINT).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM7256EGC192-15EM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPM7256EGC192-20EM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPM7256EGC192-10EM
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EPM7256BGC192-15
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EPM7256EGC192-12
✅ Drop-In✓ Auf Lager
$17.85 / Stück
Datenblatt ansehen →EPM7256EGC192-12EM Grenzwerte & elektrische Eigenschaften
| Family | MAX 7000 |
| Device Type | CPLD - Complex Programmable Logic Device |
| Macrocells | 256 |
| Logic Array Blocks (LABs) | 16 |
| Usable Gates | 5,000 |
| User I/Os | 164 |
| Maximum Operating Frequency | 90.9 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 12 ns |
| Supply Voltage (VCCINT) | 5 V |
| I/O Voltage (MultiVolt) | 3.3 V or 5 V |
| Process Technology | EEPROM (non-volatile) |
| Programmability | In-System Programmable via JTAG (IEEE 1149.1) |
| Gehäuse | 192-pin CPGA (Ceramic Pin Grid Array) |
| Speed Grade | -12 |
EPM7256EGC192-12EM Pin-Konfiguration
| Pin A1 | I/O — User I/O pin (macrocell-capable) |
| Pin A19 | VCCIO — I/O bank supply voltage (3.3 V or 5 V) |
| Pin B10 | GCLK1 — Global clock input 1 |
| Pin B12 | GCLK2/OE2 — Global clock 2 / output enable 2 (shared pin) |
| Pin C3 | TDI — JTAG Test Data In |
| Pin C5 | TDO — JTAG Test Data Out |
| Pin D8 | TMS — JTAG Test Mode Select |
| Pin D10 | TCK — JTAG Test Clock |
| Pin E2 | GCLRn — Global clear (active low) |
| Pin E18 | OE1 — Global output enable 1 |
| Pin F11 | VCCINT — Core supply voltage (5 V) |
| Pin L11 | GND — Ground |
| Pin T1 | I/O — User I/O pin (macrocell-capable) |
Typische Anwendungen
EPM7256EGC192-12EM ist geeignet für 6 Anwendungs: PCI / VME Bus Address Decoding and Arbitration, FPGA / ASIC Configuration Controller, Industrial Control Board Glue Logic, Peripheral Interface Bridge (UART / DMA / Memory Controller), Telecom Backplane Interface Logic, Legacy Avionics and Military Bus Interface.
PCI / VME Bus Address Decoding and Arbitration
The EPM7256EGC192-12EM's 12 ns tPD and 90.9 MHz maximum frequency make it ideal for PCI/VME bus address decoding and arbitration glue logic. With 256 macrocells and 164 user I/Os, the device can implement multiple address-decode windows, bus-arbiter state machines, and interrupt controllers in a single CPLD, eliminating the need for several 74-series TTL packages. The deterministic tPD guarantees set-up and hold-time margins across the full industrial temperature range, which is critical for legacy 5 V industrial backplane designs.
Empfohlen
FPGA / ASIC Configuration Controller
The EPM7256EGC192-12EM is widely used as a configuration controller for FPGAs and ASICs in industrial and telecom boards. Its 5 V MultiVolt I/O can interface directly to legacy FPGAs and PROMs while the JTAG ISP allows in-field firmware updates of the glue-logic design. The 256 macrocells comfortably fit complex state machines that sequence FPGA configuration PROMs, monitor CONFIG_DONE, and drive global reset. The 12 ns tPD ensures CONFIG_DONE-to-RESET-release timing margins are met even at cold temperature.
Empfohlen
Industrial Control Board Glue Logic
The EPM7256EGC192-12EM's industrial temperature support and 5 V tolerance make it a workhorse for industrial PLCs, motor-control boards, and SCADA peripherals. It consolidates discrete 74HC/74LS glue logic (decoders, muxes, latches, flip-flops) into a single reprogrammable device, shrinking BOM and improving testability. The 164 user I/Os and 16 LABs handle encoder quadrature decoding, PWM gating, and parallel-bus interfaces to legacy microcontrollers. In-system programmability via JTAG allows field updates without board rework.
Empfohlen
Peripheral Interface Bridge (UART / DMA / Memory Controller)
The EPM7256EGC192-12EM can bridge between microcontrollers and legacy peripherals (UART 16550, DMA 8237, SRAM/DRAM controllers) when no modern SoC peripheral exists. The 12 ns tPD is fast enough to handle synchronous SRAM interfaces at 33 MHz, while the 164 I/Os accommodate parallel DMA handshaking. The 5 V VCCINT and MultiVolt I/O are compatible with both 5 V and 3.3 V peripherals, simplifying mixed-voltage board design in retrofitted industrial systems.
Empfohlen
Telecom Backplane Interface Logic
The EPM7256EGC192-12EM serves as the backplane glue logic on legacy telecom line cards, handling HDB3/AMI encoding, clock-data recovery muxing, and alarm-status aggregation. Its 90.9 MHz fMAX accommodates E1/T1 (2.048 MHz / 1.544 MHz) and even STM-1 (155 MHz) sub-rate processing. The 192-pin CPGA through-hole package is preferred for telecom backplane cards because of superior mechanical reliability in vibration-prone rack environments compared to fine-pitch QFP/BGA.
Empfohlen
Legacy Avionics and Military Bus Interface
The EPM7256EGC192-12EM's ceramic PGA package (CPGA-192) and military-temperature screening option suit legacy MIL-STD-1553 and ARINC-429 bus interface cards. The hermetic ceramic package provides excellent resistance to humidity, vibration, and thermal cycling - critical for avionics applications. The non-volatile EEPROM cells hold configuration through power cycles without external boot PROMs, simplifying board design and reducing BOM for flight-control and mission-computer subsystems.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM7256EGC192-12EM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM7256EGC192-15EM | EPM7256EGC192-20EM | EPM7256EGC192-10EM | EPM7256BGC192-15 | EPM7256EGC192-12 |
|---|---|---|---|---|---|---|
| Package | 192-pin CPGA | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade (tPD) | 12 ns | 15 ns | 20 ns | 10 ns | 15 ns | 12 ns |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 |
| User I/Os | 164 | 164 | 164 | 164 | 164 | 164 |
| VCCINT | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Process / Non-Volatile | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Wichtigste Unterscheidungsmerkmale
- Ceramic PGA-192 package for high-reliability / military applications (vs. EPM7256AQI208-10 (plastic QFP-208))
- 256-macrocell density with 5,000 usable gates in PGA-192 footprint (vs. EPM7256BFC256-10 (BGA-256 same die))
- 12 ns tPD (fastest speed grade offered in CPGA-192 package) (vs. EPM7256EGC192-15EM (15 ns tPD))
Designhinweise
The EPM7256EGC192-12EM requires two supply rails: VCCINT (5 V) for the core logic and VCCIO (3.3 V or 5 V via MultiVolt) for the I/O banks. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a single 10 uF bulk tantalum capacitor near the PGA socket. Total VCCINT current at 256-macrocell utilization is approximately 200-300 mA; total VCCIO current depends on I/O switching but typically adds another 50-100 mA per bank.
The 192-pin Ceramic PGA (CPGA) requires a through-hole socket (e.g., 3M Textool or similar PGA-192 socket) on the PCB. Confirm the PCB land pattern uses 2.54 mm pin pitch and 0.46 mm pin-hole diameter per the Altera package outline. PGA sockets are recommended for prototyping to allow easy device replacement; for production, direct soldering of the CPGA pins through the PCB is acceptable. Do not use a BGA land pattern - the CPGA and BGA packages are NOT drop-in compatible even with the same pin count.
Do not confuse the CPGA-192 EPM7256EGC192-12EM with the BGA-256 EPM7256BFC256 or the QFP-208 EPM7256AEQC208 variants - they share the silicon die but have entirely different pinout, package, and PCB footprints. When migrating a design from CPGA-192 to BGA/QFP, full PCB rework and re-pin assignment in Quartus II are required. Also note that the MAX 7000 family is in last-time-buy; do not use EPM7256EGC192-12EM for new designs without securing a lifetime-need order.
The MAX 7000 family uses TTL-compatible I/O with typical 5 ns input setup time and 12 ns clock-to-output at the -12 grade. For synchronous designs, constrain clock-to-output paths at the tCO specification and account for 0.5 ns/mm PCB trace delay when routing global clocks (GCLK1/GCLK2). Use series termination (33-68 ohm) on clock outputs driving multiple loads to control ringing on the backplane.
Compliance-Informationen
Compliance status not present in the verified web data snippets. The MAX 7000 family legacy parts may be non-RoHS due to the ceramic PGA package and lead-bearing solder finish (EM suffix); consult the full Altera/Intel datasheet for verified compliance declarations before use in RoHS-restricted markets.
