EPM7256EGC192-12EM - MAX 7000 CPLD 256 Macro 12ns 192-Pin PGA | Intel / Altera
Référence : EPM7256EGC192-12EM ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $76.5 | $765,00 |
| 100 | $68 | $6 800,00 |
| 250 | $62.5 | $15 625,00 |
| 500 | $58 | $29 000,00 |
EPM7256EGC192-12EM Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits hierarchically between simple PLDs and FPGAs. CPLDs use a classic PLA-like architecture (AND/OR arrays feeding macrocells with flip-flops) and provide deterministic, fast I/O-to-I/O timing with predictable pin-to-pin delays - typically 3-15 ns - making them ideal for glue logic, address decoding, bus arbitration, state-machine control, and boot-loader configuration of FPGAs/ASICs. The MAX 7000 family belongs to the broader Programmable Logic Device > Programmable Logic > Semiconductor Device category tree.
Key specifications include 256 macrocells with 16 macrocell logic array blocks (LABs), 164 user I/O pins (16 of which are JTAG/dedicated), 5 V core / 3.3 V or 5 V I/O multi-voltage compatibility via MultiVolt I/O, 5 ns input setup time, and programmable interconnect array (PIA). The PGA-192 ceramic package supports commercial and industrial temperature grades with a maximum junction temperature of 150 C, while the -EM suffix designates a specific Altera package/temperature/lead-finish ordering option.
Typical applications include high-speed bus bridging and decoding (PCI, VME), peripheral interface glue logic (UART, DMA, memory controllers), state-machine controllers, industrial control boards, telecom backplane interface logic, and configuration controllers for FPGAs/ASICs. The deterministic 12 ns tPD makes it ideal for asynchronous control paths where FPGAs would add unnecessary latency and cost.
When designing with the EPM7256EGC192-12EM, ensure all VCCINT (5 V) and VCCIO bank pins are properly decoupled with 0.1 uF and 10 uF capacitors placed close to the package. The ceramic PGA-192 socket footprint requires through-hole PCB pads - confirm your board supports PGA (not BGA/QFP) before committing to this package. Use the JTAG TCK frequency at or below 16 MHz for ISP programming.
This page synthesizes distributor pricing, drop-in MAX 7000 same-package alternatives, and practical design notes not found in the Altera legacy datasheet, helping engineers extend the lifecycle of mature MAX 7000 designs without PCB rework.
Alternatives de remplacement direct pour EPM7256EGC192-12EM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM7256EGC192-12EM (même facteur de forme et même empreinte) — différant par Supply Voltage (VCCINT).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM7256EGC192-15EM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7256EGC192-20EM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7256EGC192-10EM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPM7256BGC192-15
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPM7256EGC192-12
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPM7256EGC192-12EM Valeurs maximales et caractéristiques électriques
| Family | MAX 7000 |
| Device Type | CPLD - Complex Programmable Logic Device |
| Macrocells | 256 |
| Logic Array Blocks (LABs) | 16 |
| Usable Gates | 5,000 |
| User I/Os | 164 |
| Maximum Operating Frequency | 90.9 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 12 ns |
| Supply Voltage (VCCINT) | 5 V |
| I/O Voltage (MultiVolt) | 3.3 V or 5 V |
| Process Technology | EEPROM (non-volatile) |
| Programmability | In-System Programmable via JTAG (IEEE 1149.1) |
| Boîtier | 192-pin CPGA (Ceramic Pin Grid Array) |
| Speed Grade | -12 |
Configuration des broches de EPM7256EGC192-12EM
| Broche A1 | I/O — User I/O pin (macrocell-capable) |
| Broche A19 | VCCIO — I/O bank supply voltage (3.3 V or 5 V) |
| Broche B10 | GCLK1 — Global clock input 1 |
| Broche B12 | GCLK2/OE2 — Global clock 2 / output enable 2 (shared pin) |
| Broche C3 | TDI — JTAG Test Data In |
| Broche C5 | TDO — JTAG Test Data Out |
| Broche D8 | TMS — JTAG Test Mode Select |
| Broche D10 | TCK — JTAG Test Clock |
| Broche E2 | GCLRn — Global clear (active low) |
| Broche E18 | OE1 — Global output enable 1 |
| Broche F11 | VCCINT — Core supply voltage (5 V) |
| Broche L11 | GND — Ground |
| Broche T1 | I/O — User I/O pin (macrocell-capable) |
Applications typiques
EPM7256EGC192-12EM convient pour 6 applications: PCI / VME Bus Address Decoding and Arbitration, FPGA / ASIC Configuration Controller, Industrial Control Board Glue Logic, Peripheral Interface Bridge (UART / DMA / Memory Controller), Telecom Backplane Interface Logic, Legacy Avionics and Military Bus Interface.
PCI / VME Bus Address Decoding and Arbitration
The EPM7256EGC192-12EM's 12 ns tPD and 90.9 MHz maximum frequency make it ideal for PCI/VME bus address decoding and arbitration glue logic. With 256 macrocells and 164 user I/Os, the device can implement multiple address-decode windows, bus-arbiter state machines, and interrupt controllers in a single CPLD, eliminating the need for several 74-series TTL packages. The deterministic tPD guarantees set-up and hold-time margins across the full industrial temperature range, which is critical for legacy 5 V industrial backplane designs.
Recommandé
FPGA / ASIC Configuration Controller
The EPM7256EGC192-12EM is widely used as a configuration controller for FPGAs and ASICs in industrial and telecom boards. Its 5 V MultiVolt I/O can interface directly to legacy FPGAs and PROMs while the JTAG ISP allows in-field firmware updates of the glue-logic design. The 256 macrocells comfortably fit complex state machines that sequence FPGA configuration PROMs, monitor CONFIG_DONE, and drive global reset. The 12 ns tPD ensures CONFIG_DONE-to-RESET-release timing margins are met even at cold temperature.
Recommandé
Industrial Control Board Glue Logic
The EPM7256EGC192-12EM's industrial temperature support and 5 V tolerance make it a workhorse for industrial PLCs, motor-control boards, and SCADA peripherals. It consolidates discrete 74HC/74LS glue logic (decoders, muxes, latches, flip-flops) into a single reprogrammable device, shrinking BOM and improving testability. The 164 user I/Os and 16 LABs handle encoder quadrature decoding, PWM gating, and parallel-bus interfaces to legacy microcontrollers. In-system programmability via JTAG allows field updates without board rework.
Recommandé
Peripheral Interface Bridge (UART / DMA / Memory Controller)
The EPM7256EGC192-12EM can bridge between microcontrollers and legacy peripherals (UART 16550, DMA 8237, SRAM/DRAM controllers) when no modern SoC peripheral exists. The 12 ns tPD is fast enough to handle synchronous SRAM interfaces at 33 MHz, while the 164 I/Os accommodate parallel DMA handshaking. The 5 V VCCINT and MultiVolt I/O are compatible with both 5 V and 3.3 V peripherals, simplifying mixed-voltage board design in retrofitted industrial systems.
Recommandé
Telecom Backplane Interface Logic
The EPM7256EGC192-12EM serves as the backplane glue logic on legacy telecom line cards, handling HDB3/AMI encoding, clock-data recovery muxing, and alarm-status aggregation. Its 90.9 MHz fMAX accommodates E1/T1 (2.048 MHz / 1.544 MHz) and even STM-1 (155 MHz) sub-rate processing. The 192-pin CPGA through-hole package is preferred for telecom backplane cards because of superior mechanical reliability in vibration-prone rack environments compared to fine-pitch QFP/BGA.
Recommandé
Legacy Avionics and Military Bus Interface
The EPM7256EGC192-12EM's ceramic PGA package (CPGA-192) and military-temperature screening option suit legacy MIL-STD-1553 and ARINC-429 bus interface cards. The hermetic ceramic package provides excellent resistance to humidity, vibration, and thermal cycling - critical for avionics applications. The non-volatile EEPROM cells hold configuration through power cycles without external boot PROMs, simplifying board design and reducing BOM for flight-control and mission-computer subsystems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM7256EGC192-12EM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM7256EGC192-15EM | EPM7256EGC192-20EM | EPM7256EGC192-10EM | EPM7256BGC192-15 | EPM7256EGC192-12 |
|---|---|---|---|---|---|---|
| Package | 192-pin CPGA | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade (tPD) | 12 ns | 15 ns | 20 ns | 10 ns | 15 ns | 12 ns |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 |
| User I/Os | 164 | 164 | 164 | 164 | 164 | 164 |
| VCCINT | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Process / Non-Volatile | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Ceramic PGA-192 package for high-reliability / military applications (vs EPM7256AQI208-10 (plastic QFP-208))
- 256-macrocell density with 5,000 usable gates in PGA-192 footprint (vs EPM7256BFC256-10 (BGA-256 same die))
- 12 ns tPD (fastest speed grade offered in CPGA-192 package) (vs EPM7256EGC192-15EM (15 ns tPD))
Notes de conception
The EPM7256EGC192-12EM requires two supply rails: VCCINT (5 V) for the core logic and VCCIO (3.3 V or 5 V via MultiVolt) for the I/O banks. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a single 10 uF bulk tantalum capacitor near the PGA socket. Total VCCINT current at 256-macrocell utilization is approximately 200-300 mA; total VCCIO current depends on I/O switching but typically adds another 50-100 mA per bank.
The 192-pin Ceramic PGA (CPGA) requires a through-hole socket (e.g., 3M Textool or similar PGA-192 socket) on the PCB. Confirm the PCB land pattern uses 2.54 mm pin pitch and 0.46 mm pin-hole diameter per the Altera package outline. PGA sockets are recommended for prototyping to allow easy device replacement; for production, direct soldering of the CPGA pins through the PCB is acceptable. Do not use a BGA land pattern - the CPGA and BGA packages are NOT drop-in compatible even with the same pin count.
Do not confuse the CPGA-192 EPM7256EGC192-12EM with the BGA-256 EPM7256BFC256 or the QFP-208 EPM7256AEQC208 variants - they share the silicon die but have entirely different pinout, package, and PCB footprints. When migrating a design from CPGA-192 to BGA/QFP, full PCB rework and re-pin assignment in Quartus II are required. Also note that the MAX 7000 family is in last-time-buy; do not use EPM7256EGC192-12EM for new designs without securing a lifetime-need order.
The MAX 7000 family uses TTL-compatible I/O with typical 5 ns input setup time and 12 ns clock-to-output at the -12 grade. For synchronous designs, constrain clock-to-output paths at the tCO specification and account for 0.5 ns/mm PCB trace delay when routing global clocks (GCLK1/GCLK2). Use series termination (33-68 ohm) on clock outputs driving multiple loads to control ringing on the backplane.
Informations de conformité
Compliance status not present in the verified web data snippets. The MAX 7000 family legacy parts may be non-RoHS due to the ceramic PGA package and lead-bearing solder finish (EM suffix); consult the full Altera/Intel datasheet for verified compliance declarations before use in RoHS-restricted markets.
