EPM7256EGC192-12 - MAX 7000 CPLD 256MC 5K Gates 12ns | Intel
MPN: EPM7256EGC192-12 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.4 | $284.00 |
| 100 | $23.95 | $2,395.00 |
| 500 | $20.1 | $10,050.00 |
| 1,000 | $17.85 | $17,850.00 |
Drop-in alternatives for EPM7256EGC192-12 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM7256EGC192-15
β Drop-Inπ Reference alternative (not in catalog)
EPM7256EGC192-20
β Drop-Inπ Reference alternative (not in catalog)
EPM7256EGC192-12EM
β Drop-Inβ In Stock
$58 / Unit
View Datasheet βEPM7256EGC192-12P
β Drop-Inπ Reference alternative (not in catalog)
EPM7256EGC192-12PP
β Drop-Inπ Reference alternative (not in catalog)
EPM7256EGC192-12 Maximum Ratings & Electrical Characteristics
| Family | MAX 7000 |
| Device Logic Cells | 256 macrocells |
| Usable Gates | 5,000 |
| Propagation Delay (tPD) | 12 ns |
| Maximum Operating Frequency | 90.9 MHz |
| User I/O Pins | 164 |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V (5 V nominal) |
| Package | 192-pin CPGA (Ceramic Pin Grid Array) |
| Mounting Type | Through Hole (PGA socket) |
| Technology | CMOS, EEPROM-based |
| Operating Temperature | 0C to +70C (commercial) |
| Programmable Interface | JTAG (IEEE 1149.1) / ISP |
| Logic Blocks (LABs) | 16 |
| Macrocells per LAB | 16 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| JEDEC Package Code | S-CPGA-P192 |
EPM7256EGC192-12 s-cpga-p192 Pin Configuration Guide
Complete pinout information for EPM7256EGC192-12 (s-cpga-p192 package) with 164 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM7256EGC192-12.
Refer to the datasheet for full pin configuration.
Estimated pin count: 164 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM7256EGC192-12 is suitable for 6 applications: Legacy Microprocessor Bus Glue Logic, Industrial Control Backplane Decoder, Peripheral I/O Expansion and Protocol Bridging, Replacement of Multiple 74LS/74HC Logic Packages, Test Equipment and ATE Pin Electronics, Aerospace and Defense Avionics Backplanes.
Legacy Microprocessor Bus Glue Logic
The EPM7256EGC192-12 is widely used as bus-interface glue logic between legacy microprocessors (e.g., 8051, 68k, x86) and peripherals such as memory, UARTs, and bus controllers. Its 256 macrocells and 164 user I/O pins are sufficient to implement address decoding, wait-state generation, chip-select logic, and interrupt priority encoders in a single device. The 12 ns tPD keeps decode paths well within a 25 MHz 8051 bus cycle, and the 90.9 MHz fCNT accommodates handshake state machines for parallel-port peripherals. Five-volt tolerance and 164 I/O pins also let engineers retire 6 to 10 discrete 74LS/74HC packages, reducing board area and BoM complexity.
Recommended
Industrial Control Backplane Decoder
In VME, cPCI, and proprietary industrial backplanes the EPM7256EGC192-12 acts as a slot-decoder and interrupt-arbiter, replacing discrete PROM + PAL implementations with a single in-system-programmable CPLD. The 192-pin CPGA delivers 164 user I/O pins that comfortably handle 32-bit data plus 32-bit address plus control and arbitration signals in one device. The 5V tolerance matches legacy backplane signaling and the JTAG (IEEE 1149.1) interface supports both factory ISP and field reconfiguration via boundary-scan, which is critical for industrial equipment with 10- to 20-year service lives. The 12 ns tPD keeps arbitration decisions within one bus cycle at bus speeds up to 50 MHz.
Recommended
Peripheral I/O Expansion and Protocol Bridging
Designers use the EPM7256EGC192-12 to expand the I/O count of microcontrollers and to bridge between incompatible protocols such as SPI-to-parallel, I2C-to-GPIO, or UART-to-memory-mapped buses. Its 256 macrocells accommodate multi-channel state machines with separate baud-rate generators, FIFO flags, and chip-select decoders in one device. The 90.9 MHz internal frequency allows 25 MHz SPI masters with substantial timing margin, and 164 I/O pins provide headroom for 8- to 16-bit parallel peripherals. In-system programmability via JTAG lets OEM service centers re-flash the bridge firmware without desoldering the package.
Recommended
Replacement of Multiple 74LS/74HC Logic Packages
A classic application for the EPM7256EGC192-12 is replacing a board full of discrete 74LS244, 74LS245, 74LS138, 74LS374, and 74LS08 packages with one CPLD that integrates the same logic in a programmable AND-OR array. With 256 macrocells the device can absorb roughly 20 to 30 SSI/MSI packages, dramatically reducing PCB area, BoM cost, and assembly time. The 164 I/O pins accommodate the combined footprint of these packages, and the 12 ns tPD matches or improves on the propagation delay of cascaded TTL packages. JTAG ISP also enables late-stage design changes without re-spinning the board.
Recommended
Test Equipment and ATE Pin Electronics
Automatic Test Equipment (ATE) and bench-instrument designers use the EPM7256EGC192-12 as a flexible pattern-generator and pin-control CPLD because its 164 user I/O can drive 64- to 128-channel test heads directly, and its 12 ns tPD supports vector rates up to ~80 MHz when paired with an external clock. The JTAG interface simplifies ATE self-test and calibration. Designers can re-program patterns in-system as devices-under-test evolve, avoiding costly hardware redesigns. Five-volt tolerance also matches legacy TTL-level test fixtures used in defense and aerospace production lines.
Recommended
Aerospace and Defense Avionics Backplanes
The EPM7256EGC192-12 in CPGA package is used in aerospace and defense avionics backplanes where through-hole ceramic packages are preferred for vibration tolerance and field-replaceability. The device's 256 macrocells and 164 I/O pins support MIL-STD-1553 databus interfaces, ARINC 429 decoders, and discrete signal conditioning in one programmable device. Five-volt tolerance matches legacy avionics power buses, and JTAG ISP supports both factory programming and fielded-system updates. The CPGA package also meets the reliability expectations of long-life aerospace programs (15-25 year service windows), where component obsolescence planning is critical.
Recommended
Recommended Products Summary
Engineering reference data for EPM7256EGC192-12 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM7256EGC192-15 | EPM7256EGC192-20 | EPM7256EGC192-12EM | EPM7256EGC192-12P | EPM7256EGC192-12PP |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 192-pin CPGA | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 |
| Propagation Delay (tPD) | 12 ns | 15 ns | 20 ns | 12 ns | 12 ns | 12 ns |
| Maximum Frequency (fCNT) | 90.9 MHz | [DATA_NEEDED] | [DATA_NEEDED] | 90.9 MHz | 90.9 MHz | 90.9 MHz |
| User I/O Pins | 164 | 164 | 164 | 164 | 164 | 164 |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Operating Temperature | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C |
Key Differentiators
- Highest-speed 12 ns pin-compatible CPGA option in MAX 7000 family (vs EPM7256EGC192-15)
- Through-hole CPGA package preferred for legacy and aerospace designs (vs EPM7256BQC208-7)
- Industry-standard 5V supply with JTAG ISP (vs MAX II EPM570)
Design Notes
Estimated: the EPM7256EGC192-12 typically draws 250-400 mA from a 5V supply, depending on toggle rate and output loading. Decouple the VCCINT pins with one 0.1 uF X7R ceramic capacitor per VCC/GND pair, placed as close to the package as possible. Add a 10 uF tantalum or 22 uF low-ESR aluminum bulk capacitor near the device to suppress switching-current transients, especially when many outputs toggle simultaneously during JTAG ISP programming.
The 192-pin CPGA requires a PGA socket or careful through-hole pin alignment; ensure your PCB has plated through-holes on a 2.54 mm (100 mil) grid with pad diameter of at least 1.5 mm to accept standard PGA sockets. Keep the JTAG signals (TDI, TDO, TMS, TCK) away from high-speed clock traces to avoid noise coupling that could disrupt ISP programming. For new surface-mount designs, select a QFP/BGA MAX 7000 variant instead.
Three common pitfalls: (1) do not apply 3.3V signals to a 5V MAX 7000 device without a level shifter - the inputs are 5V TTL tolerant but not 3.3V LVTTL compatible; (2) make sure unused I/O pins are configured as outputs driving ground, or as inputs with internal pull-ups enabled, to minimize power consumption and noise injection; (3) verify the JTAG chain order when programming multiple devices in series - reverse order will leave the chain un-programmable.
Estimated: the CPGA package has a theta_JA of approximately 25-30 C/W in still air, and at 400 mA and 5V (2W dissipation) the junction temperature rise is roughly 50-60C above ambient. For enclosed industrial enclosures without forced airflow, derate by 20% or specify the industrial-temperature (I suffix) variant. Always check the manufacturer thermal data for the latest theta_JC/theta_JA numbers, as ceramic PGA packages often have higher thermal resistance than equivalent QFP/BGA packages.
Compliance Information
RoHS compliant per distributor listings (Arrow, Mouser, DigiKey). Lead-free finish confirmed; halogen-free status not explicitly stated in the provided data and marked as 'unknown'. Not AEC-Q100 qualified - this is a commercial-grade part; select the I-suffix variant (industrial temperature) for industrial deployments.
