EPM7256EGC192-12EM - MAX 7000 CPLD 256 Macro 12ns 192-Pin PGA | Intel / Altera
MPN: EPM7256EGC192-12EM β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $76.5 | $765.00 |
| 100 | $68 | $6,800.00 |
| 250 | $62.5 | $15,625.00 |
| 500 | $58 | $29,000.00 |
Drop-in alternatives for EPM7256EGC192-12EM β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM7256EGC192-15EM
β Drop-Inπ Reference alternative (not in catalog)
EPM7256EGC192-20EM
β Drop-Inπ Reference alternative (not in catalog)
EPM7256EGC192-10EM
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM7256BGC192-15
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM7256EGC192-12
β Drop-Inβ In Stock
$17.85 / Unit
View Datasheet βEPM7256EGC192-12EM Maximum Ratings & Electrical Characteristics
| Family | MAX 7000 |
| Device Type | CPLD - Complex Programmable Logic Device |
| Macrocells | 256 |
| Logic Array Blocks (LABs) | 16 |
| Usable Gates | 5,000 |
| User I/Os | 164 |
| Maximum Operating Frequency | 90.9 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 12 ns |
| Supply Voltage (VCCINT) | 5 V |
| I/O Voltage (MultiVolt) | 3.3 V or 5 V |
| Process Technology | EEPROM (non-volatile) |
| Programmability | In-System Programmable via JTAG (IEEE 1149.1) |
| Package | 192-pin CPGA (Ceramic Pin Grid Array) |
| Speed Grade | -12 |
EPM7256EGC192-12EM Pin Configuration
| Pin A1 | I/O β User I/O pin (macrocell-capable) |
| Pin A19 | VCCIO β I/O bank supply voltage (3.3 V or 5 V) |
| Pin B10 | GCLK1 β Global clock input 1 |
| Pin B12 | GCLK2/OE2 β Global clock 2 / output enable 2 (shared pin) |
| Pin C3 | TDI β JTAG Test Data In |
| Pin C5 | TDO β JTAG Test Data Out |
| Pin D8 | TMS β JTAG Test Mode Select |
| Pin D10 | TCK β JTAG Test Clock |
| Pin E2 | GCLRn β Global clear (active low) |
| Pin E18 | OE1 β Global output enable 1 |
| Pin F11 | VCCINT β Core supply voltage (5 V) |
| Pin L11 | GND β Ground |
| Pin T1 | I/O β User I/O pin (macrocell-capable) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM7256EGC192-12EM is suitable for 6 applications: PCI / VME Bus Address Decoding and Arbitration, FPGA / ASIC Configuration Controller, Industrial Control Board Glue Logic, Peripheral Interface Bridge (UART / DMA / Memory Controller), Telecom Backplane Interface Logic, Legacy Avionics and Military Bus Interface.
PCI / VME Bus Address Decoding and Arbitration
The EPM7256EGC192-12EM's 12 ns tPD and 90.9 MHz maximum frequency make it ideal for PCI/VME bus address decoding and arbitration glue logic. With 256 macrocells and 164 user I/Os, the device can implement multiple address-decode windows, bus-arbiter state machines, and interrupt controllers in a single CPLD, eliminating the need for several 74-series TTL packages. The deterministic tPD guarantees set-up and hold-time margins across the full industrial temperature range, which is critical for legacy 5 V industrial backplane designs.
Recommended
FPGA / ASIC Configuration Controller
The EPM7256EGC192-12EM is widely used as a configuration controller for FPGAs and ASICs in industrial and telecom boards. Its 5 V MultiVolt I/O can interface directly to legacy FPGAs and PROMs while the JTAG ISP allows in-field firmware updates of the glue-logic design. The 256 macrocells comfortably fit complex state machines that sequence FPGA configuration PROMs, monitor CONFIG_DONE, and drive global reset. The 12 ns tPD ensures CONFIG_DONE-to-RESET-release timing margins are met even at cold temperature.
Recommended
Industrial Control Board Glue Logic
The EPM7256EGC192-12EM's industrial temperature support and 5 V tolerance make it a workhorse for industrial PLCs, motor-control boards, and SCADA peripherals. It consolidates discrete 74HC/74LS glue logic (decoders, muxes, latches, flip-flops) into a single reprogrammable device, shrinking BOM and improving testability. The 164 user I/Os and 16 LABs handle encoder quadrature decoding, PWM gating, and parallel-bus interfaces to legacy microcontrollers. In-system programmability via JTAG allows field updates without board rework.
Recommended
Peripheral Interface Bridge (UART / DMA / Memory Controller)
The EPM7256EGC192-12EM can bridge between microcontrollers and legacy peripherals (UART 16550, DMA 8237, SRAM/DRAM controllers) when no modern SoC peripheral exists. The 12 ns tPD is fast enough to handle synchronous SRAM interfaces at 33 MHz, while the 164 I/Os accommodate parallel DMA handshaking. The 5 V VCCINT and MultiVolt I/O are compatible with both 5 V and 3.3 V peripherals, simplifying mixed-voltage board design in retrofitted industrial systems.
Recommended
Telecom Backplane Interface Logic
The EPM7256EGC192-12EM serves as the backplane glue logic on legacy telecom line cards, handling HDB3/AMI encoding, clock-data recovery muxing, and alarm-status aggregation. Its 90.9 MHz fMAX accommodates E1/T1 (2.048 MHz / 1.544 MHz) and even STM-1 (155 MHz) sub-rate processing. The 192-pin CPGA through-hole package is preferred for telecom backplane cards because of superior mechanical reliability in vibration-prone rack environments compared to fine-pitch QFP/BGA.
Recommended
Legacy Avionics and Military Bus Interface
The EPM7256EGC192-12EM's ceramic PGA package (CPGA-192) and military-temperature screening option suit legacy MIL-STD-1553 and ARINC-429 bus interface cards. The hermetic ceramic package provides excellent resistance to humidity, vibration, and thermal cycling - critical for avionics applications. The non-volatile EEPROM cells hold configuration through power cycles without external boot PROMs, simplifying board design and reducing BOM for flight-control and mission-computer subsystems.
Recommended
Recommended Products Summary
Engineering reference data for EPM7256EGC192-12EM β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM7256EGC192-15EM | EPM7256EGC192-20EM | EPM7256EGC192-10EM | EPM7256BGC192-15 | EPM7256EGC192-12 |
|---|---|---|---|---|---|---|
| Package | 192-pin CPGA | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade (tPD) | 12 ns | 15 ns | 20 ns | 10 ns | 15 ns | 12 ns |
| Maximum Frequency (fMAX) | 90.9 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 90.9 MHz |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 |
| User I/Os | 164 | 164 | 164 | 164 | 164 | 164 |
| VCCINT | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Process / Non-Volatile | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes | EEPROM / Yes |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Ceramic PGA-192 package for high-reliability / military applications (vs EPM7256AQI208-10 (plastic QFP-208))
- 256-macrocell density with 5,000 usable gates in PGA-192 footprint (vs EPM7256BFC256-10 (BGA-256 same die))
- 12 ns tPD (fastest speed grade offered in CPGA-192 package) (vs EPM7256EGC192-15EM (15 ns tPD))
Design Notes
The EPM7256EGC192-12EM requires two supply rails: VCCINT (5 V) for the core logic and VCCIO (3.3 V or 5 V via MultiVolt) for the I/O banks. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a single 10 uF bulk tantalum capacitor near the PGA socket. Total VCCINT current at 256-macrocell utilization is approximately 200-300 mA; total VCCIO current depends on I/O switching but typically adds another 50-100 mA per bank.
The 192-pin Ceramic PGA (CPGA) requires a through-hole socket (e.g., 3M Textool or similar PGA-192 socket) on the PCB. Confirm the PCB land pattern uses 2.54 mm pin pitch and 0.46 mm pin-hole diameter per the Altera package outline. PGA sockets are recommended for prototyping to allow easy device replacement; for production, direct soldering of the CPGA pins through the PCB is acceptable. Do not use a BGA land pattern - the CPGA and BGA packages are NOT drop-in compatible even with the same pin count.
Do not confuse the CPGA-192 EPM7256EGC192-12EM with the BGA-256 EPM7256BFC256 or the QFP-208 EPM7256AEQC208 variants - they share the silicon die but have entirely different pinout, package, and PCB footprints. When migrating a design from CPGA-192 to BGA/QFP, full PCB rework and re-pin assignment in Quartus II are required. Also note that the MAX 7000 family is in last-time-buy; do not use EPM7256EGC192-12EM for new designs without securing a lifetime-need order.
The MAX 7000 family uses TTL-compatible I/O with typical 5 ns input setup time and 12 ns clock-to-output at the -12 grade. For synchronous designs, constrain clock-to-output paths at the tCO specification and account for 0.5 ns/mm PCB trace delay when routing global clocks (GCLK1/GCLK2). Use series termination (33-68 ohm) on clock outputs driving multiple loads to control ringing on the backplane.
Compliance Information
Compliance status not present in the verified web data snippets. The MAX 7000 family legacy parts may be non-RoHS due to the ceramic PGA package and lead-bearing solder finish (EM suffix); consult the full Altera/Intel datasheet for verified compliance declarations before use in RoHS-restricted markets.
