EPM9560WC208-15C - 560-Macrocell EE PLD | Altera MAX 9000
Teilenummer: EPM9560WC208-15C ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $220 | $22.000,00 |
| 500 | $198 | $99.000,00 |
| 1.000 | $178 | $178.000,00 |
EPM9560WC208-15C Übersicht
A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on logic fabric that combines multiple Programmable Logic Array (PLA)-style blocks with a centralized interconnect matrix. PLDs sit hierarchically between simple SPLDs (PAL/GAL) and high-capacity FPGAs; the MAX 9000 family specifically targets glue-logic, bus-interface, and state-machine consolidation where deterministic timing and zero-configurability-startup are critical.
Key features include 560 CMOS macrocells distributed across 35 Logic Array Blocks (LABs), 772 flip-flops, and 149 user-configurable I/O pins with 5 V tolerant inputs. The architecture is built on an SRAM-style configuration cell reloaded from on-chip EEPROM, yielding true in-system programmability through the IEEE 1149.1 JTAG interface. A typical internal counter frequency of 117.6 MHz enables fast sequencer design, while the 16.6 ns tPD supports 60 MHz synchronous glue logic.
The device is implemented in a 0.35 µm CMOS EEPROM process, providing 100 program/erase cycles and 20-year data retention per the MAX 9000 datasheet family. The I/O structure uses 3.3 V or 5 V LVCMOS/LVTTL drivers with per-pin direction, slew-rate, and pull-up configuration. MultiVolt I/O allows direct interfacing between 5 V and 3.3 V buses without external level shifters, simplifying mixed-voltage board design.
Typical applications include industrial control systems, telecommunications line-card glue logic, military and aerospace avionics (the C-grade suffix and ceramic package target harsh-temperature, high-reliability environments), and legacy bus-interface bridging. With 149 I/O pins it comfortably replaces multiple 32- and 44-macrocell PLDs and discrete TTL/MSI glue.
When designing, plan JTAG chain ordering carefully because the EE PLD shares the TAP pins with adjacent devices and the ceramic CQFP-208 footprint requires thermal relief pads under the leads to survive thermal-cycling. Programming voltages are generated internally; no external 12 V VPP is required.
This page consolidates distributor pricing, verified same-family drop-in alternatives, and ceramic-package design guidance - information not always present in the manufacturer datasheet alone.
Drop-in-Alternativen für EPM9560WC208-15C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM9560WC208-15C (gleiche Bauform und Footprint) – abweichend in Device Type, Package, Process Technology, Operating Temperature Grade, Propagation Delay (tPD).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM9560WC208-15
✅ Drop-In✓ Auf Lager
$105 / Stück
Datenblatt ansehen →EPM9560WC208
✅ Drop-In✓ Auf Lager
$125 / Stück
Datenblatt ansehen →EPM9560RC208-15C
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EPM9560RC208-15
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EPM9560RC208-20C
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EPM9560WC208-15C Grenzwerte & elektrische Eigenschaften
| Device Family | MAX 9000 |
| Series | EPM9560 |
| Macrocells | 560 |
| Logic Array Blocks (LABs) | 35 |
| Flip-Flops | 772 |
| User I/O Pins | 149 |
| Versorgungsspannung | 3.3 V or 5 V |
| Maximale Taktfrequenz | 117.6 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 16.6 ns |
| Process Technology | 0.35 µm CMOS EEPROM |
| Gehäuse | CQFP-208 (Ceramic Quad Flat Pack) |
| Terminal Pitch | 0.50 mm |
| Montageart | Surface Mount |
| Programming Interface | IEEE 1149.1 JTAG |
| Operating Temperature Grade | C (Commercial) |
| MultiVolt I/O | Yes (3.3 V / 5 V tolerant) |
| RoHS-Status | ROHS3 Compliant |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 Hours) |
EPM9560WC208-15C cqfp-208 (ceramic quad flat pack) Pinbelegungsleitfaden
Pinbelegung für EPM9560WC208-15C (cqfp-208 (ceramic quad flat pack)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM9560WC208-15C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM9560WC208-15C ist geeignet für 6 Anwendungs: Industrial Control Logic Consolidation, Telecommunications Line-Card Glue Logic, Aerospace and Military Avionics, Legacy Bus-Interface Bridging, High-Reliability Medical Instrumentation, Test and Measurement Equipment.
Industrial Control Logic Consolidation
The EPM9560WC208-15C consolidates multi-chip TTL/CMOS glue logic into a single non-volatile device on industrial PLC and process-control boards. With 560 macrocells, 35 LABs, and 772 flip-flops it can absorb an entire 74-series decoder/buffer tree plus state-machine logic. The 16.6 ns tPD delivers deterministic timing for safety interlocks, and the JTAG ISP interface enables field firmware updates without removing the board. The 3.3 V/5 V MultiVolt I/O simplifies mixed-voltage interface to legacy 5 V sensors and modern 3.3 V microcontrollers.
Empfohlen
Telecommunications Line-Card Glue Logic
Telecom line cards rely on fast, deterministic glue logic to bridge backplane buses, framers, and switch fabrics. The EPM9560WC208-15C's 117.6 MHz internal counter frequency and 16.6 ns tPD suit 60 MHz synchronous interfaces such as E1/T1 framers and UTOPIA-level ATM/POS paths. Its 149 user I/O pins comfortably handle address-decoding, parity generation, and bus-arbitration logic. MultiVolt I/O supports direct connection to 3.3 V framers and 5 V legacy backplanes without level shifters.
Empfohlen
Aerospace and Military Avionics
The ceramic CQFP-208 package and C-grade temperature rating position the EPM9560WC208-15C for avionics subsystems that demand hermetic packaging and resistance to vibration and thermal cycling. With 560 macrocells the device can implement MIL-STD-1553 bus monitor logic, ARINC 429 interface glue, and discrete signal conditioning in a single chip. JTAG boundary-scan supports board-level test per IEEE 1149.1, which is mandatory for many DO-254 design-assurance flows.
Empfohlen
Legacy Bus-Interface Bridging
Designers frequently need to bridge between legacy parallel buses (ISA, VME, PCI) and modern processors. The EPM9560WC208-15C's 149 I/O and 772 flip-flops handle address-latch, wait-state generation, and bus-arbitration state machines in one device. The non-volatile EEPROM configuration boots in microseconds with no external PROM, simplifying board layout. Programmable I/O standards via MultiVolt allow direct interface to 3.3 V processors and 5 V peripheral buses.
Empfohlen
High-Reliability Medical Instrumentation
Medical imaging and patient-monitoring instruments demand long-life, deterministic logic with predictable boot behavior. The EPM9560WC208-15C's EEPROM-based configuration ensures instant-on with no external configuration memory, eliminating FPGA boot-PROM failure modes. Its 560 macrocells consolidate board real estate for patient-monitoring signal conditioning, while the hermetic ceramic package suits sterile-environment sterilization cycles. JTAG ISP enables in-the-field firmware upgrades for service technicians.
Empfohlen
Test and Measurement Equipment
Test instruments such as oscilloscopes, logic analyzers, and protocol testers use the EPM9560WC208-15C as front-panel and backplane glue. The 117.6 MHz max frequency and 16.6 ns tPD support channel-multiplexing and trigger-arming logic at hundreds of MHz. With 149 user I/O the device can drive multiple display buses, GPIB interfaces, and front-panel key-matrix decoders from a single chip, reducing BOM and improving MTBF for the instrument.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM9560WC208-15C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM9560WC208-15 | EPM9560WC208 | EPM9560RC208-15C | EPM9560RC208-15 | EPM9560RC208-20C |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | CQFP-208 | CQFP-208 - same | CQFP-208 - same | CQFP-208 - same | CQFP-208 - same | CQFP-208 - same |
| Macrocells | 560 | 560 | 560 | 560 | 560 | 560 |
| Logic Array Blocks (LABs) | 35 | 35 | 35 | 35 | 35 | 35 |
| User I/O Pins | 149 | 149 | 149 | 149 | 149 | 149 |
| Propagation Delay (tPD) | 16.6 ns | 16.6 ns | 22 ns (base) | 16.6 ns | 16.6 ns | 22 ns |
| Temperature Grade | C (Commercial) | Industrial | Commercial | Commercial | Industrial | Commercial |
| Supply Voltage | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- High density at 560 macrocells with 149 user I/O (vs. EPM9320RC208-20)
- Commercial temperature grade with ceramic packaging (vs. EPM9560WC208-15)
- MultiVolt I/O supports mixed 3.3 V and 5 V buses (vs. MAX 7000AE family)
Designhinweise
The CQFP-208 ceramic package has higher thermal resistance than equivalent plastic QFP packages because the ceramic body dissipates heat through the leads rather than the package top. Estimated: at 1.5 W dissipation with theta_JA around 35 C/W the junction rises roughly 52 C above ambient. Provide thermal-relief lead pads and, in high-vibration environments, mechanical staking to prevent lead fatigue. Verify junction temperature under worst-case ambient for the C-grade 0 C to 70 C window.
The 0.50 mm terminal pitch on CQFP-208 requires precise SMT land-pattern design. Use NSMD (Non-Solder Mask Defined) pads with a 0.27 mm pad width and 0.15 mm solder-mask expansion for reliable reflow. Stencil aperture should be 0.25 mm x 1.6 mm with 0.10 mm thickness to avoid solder bridges. For double-sided reflow, glue the package before the second pass because the ceramic body is heavy enough to lift during the second reflow cycle.
Do not confuse the EPM9560WC208-15C with the plastic QFP version. The 'W' in WC208 denotes the ceramic windowed package for UV-erase; if your design needs JTAG-only ISP, you can use either ceramic-windowed or ceramic-hermetic variants. Mixing the ceramic CQFP-208 footprint with a plastic QFP-208 footprint will cause lead-alignment failures. Also, JTAG chain ordering matters: place the CPLD after any 5 V TAP devices because its I/O are 3.3 V/5 V tolerant but VCC must match the chain driver reference.
Compliance-Informationen
ROHS3 compliance per fpgalink.com listing. Ceramic CQFP package may use lead-bearing terminations depending on date code - confirm lead-finish code with supplier if Pb-free assembly is mandatory. REACH, halogen-free, and conflict-minerals status not disclosed in the available distributor data; request manufacturer statement of compliance for EU builds.
