K3LK2K20CM-JFCP - 48Gb LPDDR5 DRAM 441ball | Samsung
Teilenummer: K3LK2K20CM-JFCP ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
K3LK2K20CM-JFCP Übersicht
LPDDR5 (Low Power Double Data Rate 5) is a JEDEC-defined low-power DRAM interface standard used where memory bandwidth must be maximized while power draw is minimized. In the system hierarchy, it sits as DRAM -> synchronous DRAM -> low-power SDRAM -> LPDDR5, typically serving as the main system memory in SoC-based platforms. Compared with LPDDR4X, LPDDR5 adds bank group architecture improvements, deeper sleep modes, and a WCK/flexible clocking scheme that enables the 5500 Mbps-class data rates seen in this part.
Key features of the K3LK2K20CM-JFCP include 48Gbit density (6 GB per device), LPDDR5-5500 speed grade, the 441-ball FBGA footprint shared across the CM speed-tier variants, and Samsung's volume mobile DRAM manufacturing. The -JFCP suffix identifies the speed/binning and package-code combination within the family; sibling codes such as -BGCP, -JHCP and -JUCP share the same 441-ball LPDDR5 package with different speed or binning grades.
From a technical perspective, LPDDR5 devices like this one use a low-voltage interface (VDDQ of the LPDDR5 generation) and bank-group parallelism to sustain high throughput per channel. Mobile SoC memory controllers from Qualcomm and MediaTek platforms are commonly paired with Samsung LPDDR5 at 51.2 GB/s aggregate transfer rates for the widest configurations.
Typical applications include flagship smartphone main memory, tablet and notebook SoC memory, automotive infotainment processors, AI edge computing modules, and 5G networking equipment where high bandwidth per watt is critical.
A key design consideration: LPDDR5 signal integrity demands strict length-matched routing, on-die termination tuning, and careful VDDQ rail decoupling; the 441-ball BGA requires controlled-impedance PCB stackups.
This page synthesizes distributor sourcing data, family cross-references, and drop-in variant analysis not found in a single manufacturer datasheet.
Drop-in-Alternativen für K3LK2K20CM-JFCP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit K3LK2K20CM-JFCP (gleiche Bauform und Footprint) – abweichend in Interface, Package, Density, Mounting Type, Memory Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
K3LK2K20CM-BGCP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K3LK2K20CM-JHCP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K3LK2K20CM-JUCP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K3LK2K20BM-BGCN
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K3LK2K20CMBGCP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K3LK2K20CM-JFCP Grenzwerte & elektrische Eigenschaften
| Speichertyp | LPDDR5 SDRAM |
| Density | 48 Gbit (6 GB) |
| Speed Grade | LPDDR5-5500 |
| Max Pin Speed (LPDDR5 family) | 6400 Mbps |
| Gehäuse | 441-ball FBGA |
| Schnittstelle | LPDDR5 (JEDEC low-power DRAM) |
| Aggregate Transfer Rate (family max) | 51.2 Gb/s |
| Power Saving vs LPDDR4X | up to 20% |
| Montageart | Surface Mount (BGA) |
| Place of Origin (distributor listing) | Johor, Malaysia |
| Application Domain | Mobile / Edge AI / Automotive memory |
K3LK2K20CM-JFCP 441-ball fbga Pinbelegungsleitfaden
Pinbelegung für K3LK2K20CM-JFCP (441-ball fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für K3LK2K20CM-JFCP.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
K3LK2K20CM-JFCP ist geeignet für 6 Anwendungs: Flagship Smartphone Main Memory, Tablet and Notebook SoC Memory, Edge AI Inference Modules, Automotive Infotainment and Cockpit, 5G Networking and CPE Equipment, Industrial Controllers and Computing Modules.
Flagship Smartphone Main Memory
The K3LK2K20CM-JFCP fits flagship smartphone designs that pair Qualcomm Snapdragon or MediaTek Dimensity SoCs with LPDDR5 main memory. Its 48Gbit (6 GB) density lets a two-die stack deliver 12 GB of RAM without board-level changes, and the LPDDR5-5500 grade sustains multi-gigabyte-per-second streaming for gaming and computational photography. In a typical point-to-point PoP or discrete footprint, the memory connects to the SoC's dedicated LPDDR5 channel with length-matched traces and on-die termination; the LPDDR5 generation's bank-group architecture and deep sleep modes cut standby rail current, supporting the family's advertised up-to-20% power saving versus LPDDR4X and longer battery life in always-on scenarios.
Empfohlen
Tablet and Notebook SoC Memory
Mid-range and premium tablets and fanless notebooks use 441-ball LPDDR5 like the K3LK2K20CM-JFCP as unified system memory for CPU, GPU and NPU workloads. The 48Gbit per-device density scales to 8-16 GB configurations with one or two packages per channel, and LPDDR5-5500 provides the bandwidth headroom that integrated graphics need for high-resolution displays. On the PCB, the device sits close to the SoC with strict length matching; thermal design must account for BGA power dissipation during sustained GPU loads. Compared with LPDDR4X solutions at similar density, LPDDR5's higher data rate per pin reduces channel count and trace complexity, while sleep states (data path reset, deep sleep) lower idle platform power for always-connected designs.
Empfohlen
Edge AI Inference Modules
Edge-AI accelerator modules and smart-camera SoMs rely on LPDDR5 bandwidth to feed neural processing units with activation tensors and model weights. The K3LK2K20CM-JFCP's 48Gbit capacity hosts large CNN/transformer models locally, while the LPDDR5-5500 rate keeps NPU utilization high at low power - critical for thermally constrained fanless modules. Samsung's LPDDR5 family reaches up to 6,400 Mbps per pin in its fastest grades and 51.2 Gb/s aggregate in wide configurations, giving headroom for multi-stream vision workloads. The 441-ball FBGA mounts directly on the module's baseboard or on-package with the SoC; designers should budget dedicated VDDQ decoupling and controlled-impedance routing to preserve signal integrity at speed.
Empfohlen
Automotive Infotainment and Cockpit
Digital cockpit and infotainment processors (Qualcomm SA8155/SA8295-class, similar MediaTek automotive SoCs) specify 441-ball LPDDR5 for their high-bandwidth, low-power memory interface. The K3LK2K20CM-JFCP's 48Gbit density supports multi-display HMI stacks, navigation rendering and in-cabin camera buffering, while LPDDR5-5500 keeps frame-heavy 3D interfaces smooth. Note that the -JFCP is the standard variant per available data; for ASIL-relevant functions confirm Samsung's automotive-qualified LPDDR5 order codes. Design-wise, the memory is placed with the SoC on the same board or module with extended temperature derating considered in the power budget; LPDDR5 sleep states help meet key-off current draw targets in the vehicle.
Empfohlen
5G Networking and CPE Equipment
5G small cells, customer-premises equipment and baseband cards use LPDDR5 as fast buffer and control-plane memory. The K3LK2K20CM-JFCP provides 6 GB per device, enough for packet buffering, protocol stacks and management OS images in a single 441-ball package, reducing BGA count versus lower-density parts. Its LPDDR5-5500 bandwidth keeps line-rate forwarding paths fed, and the generation's up-to-20% power saving versus LPDDR4X directly reduces the thermal budget of passively cooled outdoor units. Typical topology is a 32-bit or 64-bit LPDDR5 channel from the baseband SoC; designers should follow the SoC vendor's LPDDR5 routing guidelines for length matching, reference planes and termination to meet timing closure at speed.
Empfohlen
Industrial Controllers and Computing Modules
Industrial controllers, COM Express/SMARC modules and embedded logging systems use Samsung LPDDR5 like the K3LK2K20CM-JFCP where long-lifecycle supply and high bandwidth intersect. The GlobalSpec product overview for the sibling K3LK2K20CM-BGCP explicitly lists data storage support, firmware boot, embedded logging, industrial controllers and computing modules as target uses. In these designs, the 48Gbit density hosts Linux/RTOS images plus application buffers, while LPDDR5-5500 supports machine-vision and protocol processing loads. Sourcing from the K3LK2K20CM family also eases replacement sourcing: multiple binning suffixes (-BGCP, -JHCP, -JUCP) share the 441-ball footprint, giving procurement second-code options without PCB redesign.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für K3LK2K20CM-JFCP – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | K3LK2K20CM-BGCP | K3LK2K20CM-JHCP | K3LK2K20CM-JUCP | K3LK2K20BM-BGCN |
|---|---|---|---|---|---|
| Package | 441-ball FBGA | 441-ball FBGA - same | 441-ball FBGA - same | 441-ball FBGA - same | 441-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | LPDDR5 SDRAM | LPDDR5 SDRAM | LPDDR5 SDRAM | LPDDR5 SDRAM | LPDDR5 SDRAM (earlier die) |
| Density | 48 Gbit (6 GB) | 48 Gbit (64-bit, 48Gb) | 48 Gbit (6 GB) | 48 Gbit (6 GB) | 48 Gbit (6 GB) |
| Die Revision | CM (current) | CM (current) | CM (current) | CM (current) | BM (earlier revision) |
| Price Tier (qty 1) | RFQ (as of 2026-09-04) | RFQ | RFQ | RFQ | RFQ |
| Drop-in Compatibility | Reference (441-ball LPDDR5) | Yes - same ball map | Yes - same ball map | Yes - same ball map | Yes - same ball map, verify firmware ID |
Wichtigste Unterscheidungsmerkmale
- Standard production binning with broad platform qualification (vs. K3LK2K20CM-JUCP)
- Documented LPDDR5-5500 match in sibling variant (vs. K3LK2K20CM-BGCP)
- Current CM die revision (vs. K3LK2K20BM-BGCN)
Designhinweise
At LPDDR5-5500, all DQ, DQS, WCK and CA lines must be length-matched within the tolerance stated by the SoC vendor's memory design guide (typically on the order of a few mils per class). Use controlled-impedance routing (single-ended ~40-50 ohm, differential ~80-100 ohm per LPDDR5 design practice), solid reference planes, and no stubs on clock or strobe nets. Simulate the channel with IBIS-AMI models from Samsung before layout freeze; fly-by CA routing and on-die termination settings must be tuned in firmware after bring-up.
LPDDR5 uses separate VDD, VDD2, and VDDQ rails; the exact voltage levels for this 48Gbit 441-ball device must be taken from the official Samsung datasheet - do not design rails from secondary listings. Place bulk plus high-frequency ceramic decoupling directly at the BGA ball field, and use a dedicated PMIC LPDDR5 rail with adequate transient response for deep-sleep exit currents. Estimated: at multi-GB/s burst activity, per-die current can reach the hundreds-of-mA range, so rail droop budgeting is essential for timing margin.
A frequent failure in LPDDR5 bring-up is substituting a different binning suffix (for example -JFCP with -JHCP or -JUCP) without updating the bootloader's memory training table: the controller trains timing per grade and may pass marginal or fail intermittently. Always update the device ID/SSPD handling and re-run memory training after any suffix change. Also verify date codes when buying from the spot market, since mobile DRAM is a common target for remarked or recycled parts.
Compliance-Informationen
Compliance data not present in the provided web data; Samsung LPDDR5 product pages should be consulted or declarations requested from the manufacturer.
