M1AFS1500-FGG256 - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
Teilenummer: M1AFS1500-FGG256 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $215.29 | $215,29 |
| 10 | $204.53 | $2.045,30 |
| 100 | $193.76 | $19.376,00 |
| 500 | $182.99 | $91.495,00 |
| 1.000 | $172.23 | $172.230,00 |
M1AFS1500-FGG256 Übersicht
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable routing, allowing designers to implement custom digital circuits after manufacturing. FPGAs sit above standard logic ICs and below application-specific ASICs in the semiconductor hierarchy, and the Fusion family extends the concept further by adding configurable analog blocks, large flash memory, and clock management circuitry on the same die.
Key features of the M1AFS1500-FGG256 include flash-based configuration (live at power-up, no external boot PROM required), an embedded ARM Cortex-M1 processor running up to 350 MHz, 276,480 bits of flash memory, and 119 available I/Os for system interfacing. The integrated clock generation and management circuitry reduces external component count compared to SRAM FPGAs that need separate configuration memory and clock devices.
Architecturally, the device is built in CMOS process technology and integrates programmable analog peripherals, system flash, and flash-based fabric in one monolithic chip, giving single-chip mixed-signal capability for control, monitoring, and data-conversion tasks. The ARM Cortex-M1 soft-to-hard migration path allows code written for soft-core implementations to run on this hardened core with higher performance.
Typical applications include industrial automation and motor control, embedded system controllers, power monitoring and smart grid equipment, aerospace and defense systems, and medical instrumentation where mixed-signal integration and single-chip reliability matter.
For design, verify the 256-ball footprint land pattern and reflow profile against the Microchip LBGA recommendations, and confirm supply sequencing per the Fusion datasheet power-up requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für M1AFS1500-FGG256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS1500-FGG256 (gleiche Bauform und Footprint) – abweichend in System Gates, Family, Package, Process Technology, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M1AFS1500-FGG256I
✅ Drop-In✓ Auf Lager
$289.9 / Stück
Datenblatt ansehen →M1AFS1500-1FGG256
✅ Drop-In✓ Auf Lager
$172.23 / Stück
Datenblatt ansehen →M1AFS1500-2FGG256
✅ Drop-In✓ Auf Lager
$124.5 / Stück
Datenblatt ansehen →M1AFS1500-1FGG256I
✅ Drop-In✓ Auf Lager
$136.9 / Stück
Datenblatt ansehen →M1AFS1500-1FG256
✅ Drop-In✓ Auf Lager
$191.42 / Stück
Datenblatt ansehen →M1AFS1500-2FG256
✅ Drop-In✓ Auf Lager
$280.68 / Stück
Datenblatt ansehen →M1AFS1500-FG256
✅ Drop-In✓ Auf Lager
$341.46 / Stück
Datenblatt ansehen →M1AFS1500-1FG256I
✅ Drop-In✓ Auf Lager
$205 / Stück
Datenblatt ansehen →M1AFS1500-FGG256 Grenzwerte & elektrische Eigenschaften
| Manufacturer Part Number | M1AFS1500-FGG256 |
| Family | Fusion (M1 series with ARM Cortex-M1) |
| System Gates | 1500000 |
| Logic Cells | 38400 |
| Maximale Taktfrequenz | 350 MHz |
| User I/O | 119 |
| Flash Memory | 276480 bit |
| Embedded Processor | ARM Cortex-M1 |
| Technology | CMOS, flash-based configuration |
| Gehäuse | 256-LBGA (S-PBGA-B256) |
| Ball Pitch | 1.00 mm |
| Terminal Form | Ball |
| Package Shape | Square |
| Montageart | Surface Mount |
M1AFS1500-FGG256 square Pinbelegungsleitfaden
Pinbelegung für M1AFS1500-FGG256 (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS1500-FGG256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS1500-FGG256 ist geeignet für 6 Anwendungs: Industrial Automation and Motor Control, Embedded System Controllers, Power Monitoring and Smart Grid, Aerospace and Defense Systems, Medical Instrumentation, Test and Measurement Equipment.
Industrial Automation and Motor Control
The M1AFS1500-FGG256 fits industrial automation because its 1.5 million system gates and 38,400 logic cells provide enough fabric for multi-axis PWM generation, encoder decoding, and safety interlock logic, while the ARM Cortex-M1 core at up to 350 MHz runs the communication and supervisory firmware. The Fusion family's configurable analog blocks handle current and voltage monitoring directly on-chip, and the 119 user I/Os interface drives, sensors, and fieldbus transceivers. Flash-based configuration makes the controller live at power-up, eliminating external boot PROMs and improving fault recovery in factory equipment where deterministic startup matters.
Empfohlen
Embedded System Controllers
For general embedded controllers, the M1AFS1500-FGG256 consolidates what would otherwise require a separate microcontroller, CPLD, analog monitoring IC, and clock generator into one monolithic device. The ARM Cortex-M1 hard core executes application code while 38,400 logic cells implement custom peripherals such as UARTs, SPI/I2C masters, and timers tailored to the product. The 276,480-bit flash and integrated clock management reduce board area and BOM cost, and the 256-ball LBGA with 1.00 mm pitch is manufacturable on standard assembly lines, making it practical for mid-volume embedded products needing up to 119 I/O signals.
Empfohlen
Power Monitoring and Smart Grid
Smart meters, protection relays, and power-quality analyzers benefit from the M1AFS1500-FGG256's Fusion architecture, which places configurable analog acquisition blocks and digital logic on the same die. The fabric computes FFTs, RMS calculations, and event detection at sample rates the 350 MHz-capable architecture supports, while the Cortex-M1 core runs protocol stacks such as DLMS or Modbus. The flash-based fabric is immune to configuration loss, a key reliability requirement for grid infrastructure with 20+ year service expectations, and the 119 I/Os handle multiple measurement channels and communication interfaces concurrently.
Empfohlen
Aerospace and Defense Systems
The M1AFS1500-FGG256 suits space-constrained avionics, satellite payloads, and defense electronics because flash-based FPGA configuration resists single-event configuration upset, unlike SRAM FPGAs that require external configuration scrubbing. The device is live at power-up with no boot sequence, reducing time-to-first-function in safety-critical platforms. Its 1.5 million gates implement sensor interfaces, telemetry framing, and glue logic, while the ARM Cortex-M1 core runs onboard control software. Microchip (formerly Actel/Microsemi) Fusion devices have a long heritage in military programs, and the 256-ball LBGA supports standard SMT assembly for high-reliability builds.
Empfohlen
Medical Instrumentation
Medical diagnostic equipment such as patient monitors and portable analyzers uses the M1AFS1500-FGG256 to combine analog front-end sequencing, digital filtering, and system control in one flash-based device. The Fusion configurable analog blocks condition sensor signals on-chip, the fabric implements DSP pipelines within its 38,400 logic cells, and the ARM Cortex-M1 processor at up to 350 MHz runs the user interface and data handling. Monolithic integration reduces the number of components needing calibration and improves mean time between failures, an important metric for clinical devices, while flash configuration ensures deterministic startup required by IEC-driven safety designs.
Empfohlen
Test and Measurement Equipment
Bench instruments, data acquisition systems, and protocol analyzers exploit the M1AFS1500-FGG256's combination of high fabric capacity and embedded processing. The 1.5 million system gates implement capture buffers, trigger engines, and real-time analysis logic, while the Cortex-M1 core manages the instrument's command interface and calibration routines. The 119 user I/Os provide flexible channel connectivity, and integrated clock management circuitry generates the precise sampling clocks these instruments require. Flash-based configuration means the instrument is functional the instant power is applied, shortening measured boot times versus SRAM FPGA platforms that load from external memory.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS1500-FGG256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M1AFS1500-FGG256I | M1AFS1500-1FGG256 | M1AFS1500-2FGG256 | AFS1500-1FG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256) | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| ARM Cortex-M1 Core | Yes | Yes | Yes | Yes | No (base Fusion) |
| Speed Grade | Standard | Standard | -1 (slower) | -2 (faster) | -1 |
| Flash Memory | 276,480 bit | 276,480 bit | 276,480 bit | 276,480 bit | 276,480 bit |
Wichtigste Unterscheidungsmerkmale
- ARM Cortex-M1 hard processor integrated (vs. AFS1500-1FG256I)
- Faster timing available in same footprint (vs. M1AFS1500-1FGG256)
- Industrial temperature option without redesign (vs. M1AFS1500-FGG256I)
Designhinweise
The 256-ball LBGA with 1.00 mm pitch requires a solder-mask-defined or non-solder-mask-defined land pattern per the Microchip package drawing; follow the manufacturer-recommended pad geometry and use solder paste printing with 0.10-0.13 mm stencil thickness. Escape routing on 1.00 mm pitch BGA typically needs via-in-pad or dog-bone fanout with 0.25-0.3 mm vias capped or tented. Verify ball map against the FG256 section of the Fusion family datasheet before layout release.
Fusion FPGAs require multiple supply rails (core, I/O, and analog) with defined power-up sequencing; the M1AFS1500-FGG256 is live at power-up due to flash configuration, so all rails must be within specification before the fabric executes. Estimated: budget core current based on toggle rate and I/O loading per the Fusion datasheet power calculator (Microchip Libero SmartPower), and decouple each rail with at least 10 uF bulk plus 0.1 uF ceramic per power pin group placed within 2 mm of the balls.
Do not substitute the M1AFS1500-FGG256 with a base AFS1500-1FG256I without verifying your software: the M1 part includes the ARM Cortex-M1 hard core, and firmware compiled for the Cortex-M1 will not run on the core-less variant. Similarly, speed grade changes (moving from standard to -1) can break worst-case timing closure in the same footprint; re-run static timing analysis in Microchip Libero SoC after any orderable-suffix change.
Compliance-Informationen
Compliance data not stated in the provided web results; the G suffix on FGG part numbers typically denotes lead-free/RoHS-compliant finish, but this must be confirmed against the Microchip product page before use.
