M1AFS1500-FGG256 - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
MPN: M1AFS1500-FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $215.29 | $215.29 |
| 10 | $204.53 | $2,045.30 |
| 100 | $193.76 | $19,376.00 |
| 500 | $182.99 | $91,495.00 |
| 1,000 | $172.23 | $172,230.00 |
Drop-in alternatives for M1AFS1500-FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-FGG256I
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$289.9 / Unit
View Datasheet →M1AFS1500-1FGG256
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View Datasheet →M1AFS1500-2FGG256
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View Datasheet →M1AFS1500-1FGG256I
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View Datasheet →M1AFS1500-1FG256
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View Datasheet →M1AFS1500-2FG256
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View Datasheet →M1AFS1500-FG256
✅ Drop-In✓ In Stock
$341.46 / Unit
View Datasheet →M1AFS1500-1FG256I
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View Datasheet →M1AFS1500-FGG256 Maximum Ratings & Electrical Characteristics
| Manufacturer Part Number | M1AFS1500-FGG256 |
| Family | Fusion (M1 series with ARM Cortex-M1) |
| System Gates | 1500000 |
| Logic Cells | 38400 |
| Maximum Clock Frequency | 350 MHz |
| User I/O | 119 |
| Flash Memory | 276480 bit |
| Embedded Processor | ARM Cortex-M1 |
| Technology | CMOS, flash-based configuration |
| Package | 256-LBGA (S-PBGA-B256) |
| Ball Pitch | 1.00 mm |
| Terminal Form | Ball |
| Package Shape | Square |
| Mounting Type | Surface Mount |
M1AFS1500-FGG256 square Pin Configuration Guide
Complete pinout information for M1AFS1500-FGG256 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-FGG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-FGG256 is suitable for 6 applications: Industrial Automation and Motor Control, Embedded System Controllers, Power Monitoring and Smart Grid, Aerospace and Defense Systems, Medical Instrumentation, Test and Measurement Equipment.
Industrial Automation and Motor Control
The M1AFS1500-FGG256 fits industrial automation because its 1.5 million system gates and 38,400 logic cells provide enough fabric for multi-axis PWM generation, encoder decoding, and safety interlock logic, while the ARM Cortex-M1 core at up to 350 MHz runs the communication and supervisory firmware. The Fusion family's configurable analog blocks handle current and voltage monitoring directly on-chip, and the 119 user I/Os interface drives, sensors, and fieldbus transceivers. Flash-based configuration makes the controller live at power-up, eliminating external boot PROMs and improving fault recovery in factory equipment where deterministic startup matters.
Recommended
Embedded System Controllers
For general embedded controllers, the M1AFS1500-FGG256 consolidates what would otherwise require a separate microcontroller, CPLD, analog monitoring IC, and clock generator into one monolithic device. The ARM Cortex-M1 hard core executes application code while 38,400 logic cells implement custom peripherals such as UARTs, SPI/I2C masters, and timers tailored to the product. The 276,480-bit flash and integrated clock management reduce board area and BOM cost, and the 256-ball LBGA with 1.00 mm pitch is manufacturable on standard assembly lines, making it practical for mid-volume embedded products needing up to 119 I/O signals.
Recommended
Power Monitoring and Smart Grid
Smart meters, protection relays, and power-quality analyzers benefit from the M1AFS1500-FGG256's Fusion architecture, which places configurable analog acquisition blocks and digital logic on the same die. The fabric computes FFTs, RMS calculations, and event detection at sample rates the 350 MHz-capable architecture supports, while the Cortex-M1 core runs protocol stacks such as DLMS or Modbus. The flash-based fabric is immune to configuration loss, a key reliability requirement for grid infrastructure with 20+ year service expectations, and the 119 I/Os handle multiple measurement channels and communication interfaces concurrently.
Recommended
Aerospace and Defense Systems
The M1AFS1500-FGG256 suits space-constrained avionics, satellite payloads, and defense electronics because flash-based FPGA configuration resists single-event configuration upset, unlike SRAM FPGAs that require external configuration scrubbing. The device is live at power-up with no boot sequence, reducing time-to-first-function in safety-critical platforms. Its 1.5 million gates implement sensor interfaces, telemetry framing, and glue logic, while the ARM Cortex-M1 core runs onboard control software. Microchip (formerly Actel/Microsemi) Fusion devices have a long heritage in military programs, and the 256-ball LBGA supports standard SMT assembly for high-reliability builds.
Recommended
Medical Instrumentation
Medical diagnostic equipment such as patient monitors and portable analyzers uses the M1AFS1500-FGG256 to combine analog front-end sequencing, digital filtering, and system control in one flash-based device. The Fusion configurable analog blocks condition sensor signals on-chip, the fabric implements DSP pipelines within its 38,400 logic cells, and the ARM Cortex-M1 processor at up to 350 MHz runs the user interface and data handling. Monolithic integration reduces the number of components needing calibration and improves mean time between failures, an important metric for clinical devices, while flash configuration ensures deterministic startup required by IEC-driven safety designs.
Recommended
Test and Measurement Equipment
Bench instruments, data acquisition systems, and protocol analyzers exploit the M1AFS1500-FGG256's combination of high fabric capacity and embedded processing. The 1.5 million system gates implement capture buffers, trigger engines, and real-time analysis logic, while the Cortex-M1 core manages the instrument's command interface and calibration routines. The 119 user I/Os provide flexible channel connectivity, and integrated clock management circuitry generates the precise sampling clocks these instruments require. Flash-based configuration means the instrument is functional the instant power is applied, shortening measured boot times versus SRAM FPGA platforms that load from external memory.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-FGG256I | M1AFS1500-1FGG256 | M1AFS1500-2FGG256 | AFS1500-1FG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256) | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| ARM Cortex-M1 Core | Yes | Yes | Yes | Yes | No (base Fusion) |
| Speed Grade | Standard | Standard | -1 (slower) | -2 (faster) | -1 |
| Temperature Grade | [DATA_NEEDED: temperature grade] | Industrial | [DATA_NEEDED] | [DATA_NEEDED] | Industrial |
| Flash Memory | 276,480 bit | 276,480 bit | 276,480 bit | 276,480 bit | 276,480 bit |
Key Differentiators
- ARM Cortex-M1 hard processor integrated (vs AFS1500-1FG256I)
- Faster timing available in same footprint (vs M1AFS1500-1FGG256)
- Industrial temperature option without redesign (vs M1AFS1500-FGG256I)
Design Notes
The 256-ball LBGA with 1.00 mm pitch requires a solder-mask-defined or non-solder-mask-defined land pattern per the Microchip package drawing; follow the manufacturer-recommended pad geometry and use solder paste printing with 0.10-0.13 mm stencil thickness. Escape routing on 1.00 mm pitch BGA typically needs via-in-pad or dog-bone fanout with 0.25-0.3 mm vias capped or tented. Verify ball map against the FG256 section of the Fusion family datasheet before layout release.
Fusion FPGAs require multiple supply rails (core, I/O, and analog) with defined power-up sequencing; the M1AFS1500-FGG256 is live at power-up due to flash configuration, so all rails must be within specification before the fabric executes. Estimated: budget core current based on toggle rate and I/O loading per the Fusion datasheet power calculator (Microchip Libero SmartPower), and decouple each rail with at least 10 uF bulk plus 0.1 uF ceramic per power pin group placed within 2 mm of the balls.
Do not substitute the M1AFS1500-FGG256 with a base AFS1500-1FG256I without verifying your software: the M1 part includes the ARM Cortex-M1 hard core, and firmware compiled for the Cortex-M1 will not run on the core-less variant. Similarly, speed grade changes (moving from standard to -1) can break worst-case timing closure in the same footprint; re-run static timing analysis in Microchip Libero SoC after any orderable-suffix change.
Compliance Information
Compliance data not stated in the provided web results; the G suffix on FGG part numbers typically denotes lead-free/RoHS-compliant finish, but this must be confirmed against the Microchip product page before use.
