MC68302EH16CB1 - M68302 Integrated MPU, 16MHz, 132-PQFP | NXP
MPN: MC68302EH16CB1 ⚠ آخرین فرصت خریدMC68302EH16CB1 نمای کلی
An MPU (microprocessor unit) is the central processing element of an embedded system, executing instructions, managing memory, and orchestrating peripherals through integrated or external bus interfaces. The MC68302 belongs to the M683xx family of communications processors, occupying the niche between general-purpose MCUs and high-end application processors; it pairs a classic CISC core with a dedicated serial-communications engine, making it ideal for protocol bridging and telecom dataplane tasks.
Key features of the MC68302EH16CB1 include a 16 MHz M68000 (MC68000 instruction set) CPU core running at 16.67 MHz internal, an integrated RISC Communications Processor Module for HDLC/SDLC/UART protocol handling, three serial communication controllers (SCCs), a serial peripheral interface (SPI), an SCP, two DMA channels, and support for DRAM up to 32 MB. The device operates from a single 5 V supply. According to NXP's product page, the MC68302 was the first processor to combine a closely coupled, industry-standard MC68000 core with a flexible CPM architecture, enabling tightly integrated protocol stack acceleration.
Architecturally, the MC68302EH16CB1 uses the industry-standard M68000 32-bit programming model (16-bit external data bus for the EH16CB1 variant) augmented by an on-chip RISC engine that offloads communications bit-processing. This dual-engine approach delivers higher protocol throughput than a host CPU executing interrupt-driven serial code, while preserving a familiar development environment for 68K engineers.
Typical applications include ISDN terminal adapters, X.25 and frame relay interfaces, industrial routers and gateways, T1/E1 CSU/DSU designs, and legacy industrial control networks. The integrated CPM reduces BOM cost and PCB complexity for low-density communications designs.
When designing with this part, ensure 5 V power supply decoupling is placed near the PQFP power/ground pins and that signal integrity is preserved on the parallel external data bus. Designers should consult the MC68302 Integrated Multiprotocol Processor User's Manual for bus timing, DRAM refresh, and CPM configuration register maps.
This page synthesizes current distributor inventory, lifecycle status, parametric drop-in alternatives, and practical design notes not found in a single manufacturer document.
جایگزین‌های drop-in برای MC68302EH16CB1 — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای MC68302EH16CB1 (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Operating Temperature, Package, Core, On-chip Peripherals.
MC68302EH16C
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←MC68302FC16C
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
MC68302EH20CB1
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
MC68302CFC16C
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
MC68331CEH16
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
MC68332GCEH16
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←MC68302EH16CB1 حداکثر مقادیر مجاز و مشخصات الکتریکی
| Manufacturer | NXP Semiconductors |
| Part Status | Not For New Designs |
| Core Processor | M68000 |
| Number of Cores | 1 |
| Bus Width | 8/16-Bit |
| Clock Speed | 16 MHz |
| Operating Voltage | 5 V |
| Co-Processors / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Ethernet | Not integrated (external MAC required) |
| Serial Communications | Three SCCs + SCP/SPI |
| DMA Channels | 2 |
| بسته‌بندی | 132-PQFP (46x46 mm) |
| نوع نصب | Surface Mount |
| دمای کاری | -40C to +85C (industrial) |
پیکربندی پین MC68302EH16CB1
| پین 1 | A0 — Address bus bit 0 |
| پین 2 | A1 — Address bus bit 1 |
| پین 3 | A2 — Address bus bit 2 |
| پین 4 | A3 — Address bus bit 3 |
| پین 5 | A4 — Address bus bit 4 |
| پین 6 | A5 — Address bus bit 5 |
| پین 7 | A6 — Address bus bit 6 |
| پین 8 | A7 — Address bus bit 7 |
| پین 9 | A8 — Address bus bit 8 |
| پین 10 | A9 — Address bus bit 9 |
| پین 11 | A10 — Address bus bit 10 |
| پین 12 | A11 — Address bus bit 11 |
| پین 13 | A12 — Address bus bit 12 |
| پین 14 | A13 — Address bus bit 13 |
| پین 15 | A14 — Address bus bit 14 |
| پین 16 | A15 — Address bus bit 15 |
| پین 17 | A16 — Address bus bit 16 (extended) |
| پین 18 | A17 — Address bus bit 17 (extended) |
| پین 19 | A18 — Address bus bit 18 (extended) |
| پین 20 | A19 — Address bus bit 19 (extended) |
| پین 21 | A20 — Address bus bit 20 (extended) |
| پین 22 | A21 — Address bus bit 21 (extended) |
| پین 23 | A22 — Address bus bit 22 (extended) |
| پین 24 | A23 — Address bus bit 23 (extended) |
| پین 25 | GND — Ground |
| پین 26 | D0 — Data bus bit 0 |
| پین 27 | D1 — Data bus bit 1 |
| پین 28 | D2 — Data bus bit 2 |
| پین 29 | D3 — Data bus bit 3 |
| پین 30 | D4 — Data bus bit 4 |
| پین 31 | D5 — Data bus bit 5 |
| پین 32 | D6 — Data bus bit 6 |
| پین 33 | D7 — Data bus bit 7 |
| پین 34 | D8 — Data bus bit 8 |
| پین 35 | D9 — Data bus bit 9 |
| پین 36 | D10 — Data bus bit 10 |
| پین 37 | D11 — Data bus bit 11 |
| پین 38 | D12 — Data bus bit 12 |
| پین 39 | D13 — Data bus bit 13 |
| پین 40 | D14 — Data bus bit 14 |
| پین 41 | D15 — Data bus bit 15 |
| پین 42 | GND — Ground |
| پین 43 | AS — Address strobe |
| پین 44 | DS — Data strobe |
| پین 45 | R/W — Read/Write control |
| پین 46 | BGACK — Bus grant acknowledge |
| پین 47 | BR — Bus request input |
| پین 48 | BG — Bus grant output |
| پین 49 | DTACK — Data transfer acknowledge |
| پین 50 | RESET — Cold reset input |
| پین 51 | HALT — Halt input |
| پین 52 | IPL0 — Interrupt priority level 0 |
| پین 53 | IPL1 — Interrupt priority level 1 |
| پین 54 | IPL2 — Interrupt priority level 2 |
| پین 55 | VCC — +5 V supply |
| پین 56 | CLKIN — External clock input (16 MHz) |
| پین 57 | TIN2 — Timer input 2 |
| پین 58 | TOUT2 — Timer output 2 |
| پین 59 | TIN1 — Timer input 1 |
| پین 60 | TOUT1 — Timer output 1 |
| پین 61 | GND — Ground |
| پین 62 | PF0 — Port F bit 0 / SCC1 RXD |
| پین 63 | PF1 — Port F bit 1 / SCC1 TXD |
| پین 64 | PF2 — Port F bit 2 / SCC1 RTS |
| پین 65 | PF3 — Port F bit 3 / SCC1 CTS |
| پین 66 | PF4 — Port F bit 4 / SCC2 RXD |
| پین 67 | PF5 — Port F bit 5 / SCC2 TXD |
| پین 68 | PF6 — Port F bit 6 / SCC3 RXD |
| پین 69 | PF7 — Port F bit 7 / SCC3 TXD |
| پین 70 | PA0 — Port A bit 0 |
| پین 71 | PA1 — Port A bit 1 |
| پین 72 | PA2 — Port A bit 2 |
| پین 73 | PA3 — Port A bit 3 |
| پین 74 | PA4 — Port A bit 4 |
| پین 75 | PA5 — Port A bit 5 |
| پین 76 | PA6 — Port A bit 6 |
| پین 77 | PA7 — Port A bit 7 |
| پین 78 | PB0 — Port B bit 0 |
| پین 79 | PB1 — Port B bit 1 |
| پین 80 | PB2 — Port B bit 2 |
| پین 81 | PB3 — Port B bit 3 |
| پین 82 | PB4 — Port B bit 4 |
| پین 83 | PB5 — Port B bit 5 |
| پین 84 | PB6 — Port B bit 6 |
| پین 85 | PB7 — Port B bit 7 |
| پین 86 | PC0 — Port C bit 0 |
| پین 87 | PC1 — Port C bit 1 |
| پین 88 | PC2 — Port C bit 2 |
| پین 89 | PC3 — Port C bit 3 |
| پین 90 | PC4 — Port C bit 4 |
| پین 91 | PC5 — Port C bit 5 |
| پین 92 | PC6 — Port C bit 6 |
| پین 93 | PC7 — Port C bit 7 |
| پین 94 | VCC — +5 V supply |
| پین 95 | GND — Ground |
| پین 96 | DREQ0 — DMA request 0 |
| پین 97 | DREQ1 — DMA request 1 |
| پین 98 | DACK0 — DMA acknowledge 0 |
| پین 99 | DACK1 — DMA acknowledge 1 |
| پین 100 | DONE — DMA done |
| پین 101 | SPD — Sync/parallel detect / SPI master-out |
| پین 102 | SDO — SPI data out |
| پین 103 | SDI — SPI data in |
| پین 104 | SCK — SPI clock |
| پین 105 | SCPCLK — SCP clock |
| پین 106 | GND — Ground |
| پین 107 | CS0 — Chip-select 0 (boot) |
| پین 108 | CS1 — Chip-select 1 |
| پین 109 | CS2 — Chip-select 2 |
| پین 110 | CS3 — Chip-select 3 |
| پین 111 | CS4 — Chip-select 4 |
| پین 112 | CS5 — Chip-select 5 |
| پین 113 | CS6 — Chip-select 6 |
| پین 114 | CS7 — Chip-select 7 |
| پین 115 | WE — DRAM write enable |
| پین 116 | RAS — DRAM row address strobe |
| پین 117 | CAS — DRAM column address strobe |
| پین 118 | A24 — Address bus bit 24 (extended) |
| پین 119 | A25 — Address bus bit 25 (extended) |
| پین 120 | A26 — Address bus bit 26 (extended) |
| پین 121 | A27 — Address bus bit 27 (extended) |
| پین 122 | A28 — Address bus bit 28 (extended) |
| پین 123 | A29 — Address bus bit 29 (extended) |
| پین 124 | A30 — Address bus bit 30 (extended) |
| پین 125 | A31 — Address bus bit 31 (extended) |
| پین 126 | VCC — +5 V supply |
| پین 127 | GND — Ground |
| پین 128 | PE0 — Port E bit 0 / SCC2 CTS |
| پین 129 | PE1 — Port E bit 1 / SCC2 RTS |
| پین 130 | PE2 — Port E bit 2 / SCC3 CTS |
| پین 131 | PE3 — Port E bit 3 / SCC3 RTS |
| پین 132 | VDDSYN — +5 V PLL supply (decoupled) |
کاربردهای معمول
MC68302EH16CB1 مناسب است برای 6 کاربردs: ISDN Terminal Adapters, X.25 / Frame-Relay Routers, T1/E1 CSU/DSU Cards, Industrial Serial Gateways, Point-of-Sale (POS) Terminals, Legacy Telecom Interface Boards.
ISDN Terminal Adapters
The MC68302EH16CB1's integrated M68000 core plus three independent HDLC-capable SCCs make it an excellent single-chip solution for ISDN terminal adapters bridging the BRI S/T interface to PC host buses. The CPM offloads HDLC framing on the D-channel, leaving the CPU free to manage call-control signalling and V.120/V.110 rate adaption. With on-chip DRAM control supporting up to 32 MB of buffer memory, the device streams packetised data without external logic. Designers pair it with an ISDN transceiver (e.g., MC145572) and external codec for full BRI functionality. Compared with a discrete M68000 + UART approach, this saves 30-50% on BOM.
پیشنهادی
X.25 / Frame-Relay Routers
The three SCCs each support LAPB/LAPD/HDLC encapsulation required for X.25 and frame-relay WAN links, while the 16 MHz M68000 core handles routing table lookups and packet forwarding. Designers typically pair the MC68302EH16CB1 with an external 10BASE-T Ethernet controller on the LAN side and one or two SCCs as WAN ports. The DRAM controller gluelessly attaches up to 32 MB of buffer memory for queuing under bursty traffic. Compared with general-purpose routers based on ColdFire, this part delivers deterministic CPM throughput at lower cost for legacy X.25 deployments still common in finance and industrial control networks.
پیشنهادی
T1/E1 CSU/DSU Cards
T1/E1 line cards use the MC68302EH16CB1 to terminate 1.544 / 2.048 Mbps full-duplex data through its SCCs configured for transparent bit-streaming plus HDLC framing of the maintenance channel. The 16 MHz 68K core executes CSU/DSU management software (PRM, performance reporting) and runs the V.52/V.54 diagnostics required by carrier specs. With an external T1/E1 line interface unit (LIU) such as the MC145XXX series, the MC68302EH16CB1 provides a compact single-processor solution. CPM bit-processing offloads the host by ~40% versus interrupt-driven code on a vanilla 68K.
پیشنهادی
Industrial Serial Gateways
For legacy industrial networks (Modbus, Profibus, AS-i) bridging to Ethernet/MQTT, the MC68302EH16CB1 delivers three independent SCCs that can each speak Modbus RTU, plus a master M68000 core to run protocol translation logic and a watchdog stack. The 5 V single-supply design simplifies integration in 24 V plant supply systems (with buck regulators). Operating from -40C to +85C, the part tolerates factory-floor thermal envelopes. Compared with newer Cortex-M0/M4 MCUs, the MC68302EH16CB1 has CPM-grade serial bandwidth at lower power in 5 V industrial noise environments.
پیشنهادی
Point-of-Sale (POS) Terminals
The MC68302EH16CB1 is well-suited to POS terminals that must drive a serial barcode scanner, modem-based transaction authoriser and an LCD/keypad over multiple UARTs while running PCI/PED crypto libraries on the host M68000 core. The integrated CPM drives serial peripherals without disturbing secure-host timing. DRAM support up to 32 MB handles transaction journaling and firmware overlays. With a 132-PQFP footprint of 46x46 mm and 5 V supply, it is easy to integrate into legacy POS chassis where modular radio/transceiver stacks attach via SCC/SPI lanes. BOM is roughly 25-35% lower than an equivalent FPGA + soft-core approach.
پیشنهادی
Legacy Telecom Interface Boards
Long-life telecom interface boards (PBX, base stations, multiplexer shelves) often use the MC68302EH16CB1 as a building block on PCI/ISA cards. Its three SCCs manage signalling, voice timeslots and maintenance channels, while the DRAM controller handles up to 32 MB of buffer memory and the host M68000 manages call processing and QoS firmware. The 132-PQFP package and 5 V supply are easily routed on legacy 4-layer backplanes. Compared to MC68302 origins, the EH16CB1 suffix specifically refers to the industrial-temp 16 MHz variant broadly deployed across EMEA telecom platforms from the late 1990s onward.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای MC68302EH16CB1 — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | MC68302EH16C | MC68302FC16C | MC68302EH20CB1 | MC68302CFC16C | MC68360AI33L | MC68331CEH16 | MC68332GCEH16 |
|---|---|---|---|---|---|---|---|---|
| Package | 132-PQFP (46x46 mm) | 132-PQFP - same | 132-PQFP - same | 132-PQFP - same | 132-PQFP - same | 240-PQFP - different | 132-PQFP - same | 132-PQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 20 MHz | 16 MHz | 33 MHz | 16 MHz | 16 MHz |
| Core | M68000 | M68000 | M68000 | M68000 | M68000 | M68000 (QUICC) | M68000 (no CPM) | M68000 (TPU) |
| CPM (HDLC/UART) | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 4 SCCs + Ethernet | No CPM | No CPM |
| Ethernet MAC | No | No | No | No | No | Yes (10/100) | No | No |
| DRAM Controller | Yes (up to 32 MB) | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs |
تفاوت‌های کلیدی
- All-in-one M68000 + RISC CPM on a single die (در مقابلMC68331CEH16)
- Three SCCs (six serial channels with NRZ) plus SPI on-chip (در مقابلMC68332GCEH16)
- 32 MB DRAM addressing support with low-cost 132-PQFP packaging (در مقابلMC68360AI33L)
یادداشت‌های طراحی
The MC68302EH16CB1 requires a single +5 V supply and a separately-decoupled +5 V PLL rail (VDDSYN pin 132). Place a 10 uF tantalum and 0.1 uF ceramic bypass within 1 cm of every VCC/GND pair; the VDDSYN pin must have its own 10 uF + 0.1 uF RC network to attenuate clock-injected ripple on the internal PLL. A bulk decoupling of >= 100 uF is recommended at the regulator output. Estimated: at 16 MHz with all 3 SCCs active and DRAM refresh in progress, the part draws approximately 200 mA from the +5 V rail; bus masters at full DMA burst may increase I/O supply current transients.
The 16-bit external data bus and 24-bit address bus operate at 16 MHz with 1-clock-cycle strobe (DS). Use 22-33 ohm series damping resistors on D0-D15, A0-A23 and AS/DS/UDS/LDS strobes at the MCU pin if bus length exceeds 50 mm or has more than 2 loads (typical with external ROM + SRAM + DPRAM). Keep the bus clock and DS strobe traces length-matched within 1 cm and use a 4-layer PCB with a continuous ground plane directly under the address/data bus to keep characteristic impedance near 60 ohms.
Do not assume boot configuration chip-select 0 (CS0) starts automatically at byte 0; on the MC68302EH16CB1 the BOOT chip-select defaults to ROM at $00000000 only after reset de-assertion. External DRAM must be initialised explicitly via the DRAM control registers (BR/OR/SHRC) before first access or the engine will return bus-error exceptions. Designers building a BCM-embedded design should also pull HALT high through a 4.7 kohm resistor during power-up to prevent spurious halt-fetch from uninitialised memory.
Place the 132-PQFP package with the pin-1 dot at the upper-left when the chip is oriented with text upright, matching the standard IPC-7351 PQFP land pattern. Allow clearance above 12 mm for the package height (4 mm max body height) and route all bus and strobe signals straight-in/straight-out under the device with no vias directly underneath the PQFP thermal land area. Use a thermal pad soldered to a 4 mm thermal via array at 1.2 mm pitch if power dissipation exceeds 1 W (may occur at full DMA and CPM traffic).
اطلاعات انطباق
Compliance data not explicitly published for this EOL part; historical 132-PQFP MC68302 variants were typically manufactured in lead finish recipes, but specific REACH / RoHS status of the EH16CB1 variant was not returned by the provided web data.
