NXP Semiconductors

MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP

Teilenummer: MC9S12DG256MFUE ✗ Abgekündigt
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80-LQFP (QFP-80), 14x14 mm Package 25 MHz Speed 256 KB Flash Memory
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Preis aktualisiert: 2026-10-17
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MC9S12DG256MFUE Übersicht

The NXP Semiconductors MC9S12DG256MFUE is a 16-bit HCS12 CISC microcontroller with 256 KB of on-chip Flash, 12 KB RAM, and 4 KB EEPROM, housed in an 80-pin LQFP (QFP-80) package qualified to AEC-Q100 for automotive multiplexing. It operates at up to 25 MHz core frequency from a single 5 V supply and integrates two asynchronous SCI channels, two SPI, one I2C, an 8-channel 10-bit ADC, an 8-channel enhanced capture timer, PWM outputs, and a CAN 2.0 module. The device targets body and chassis ECUs that demand deterministic interrupt response, on-chip memory for bootloader and calibration routines, and a wide peripheral set without external glue logic.

A CISC microcontroller (Complex Instruction Set Computer) is a CPU architecture that uses a rich, variable-length instruction set optimized for code density and per-instruction work; the HCS12 family is the 16-bit evolution of the HC08 line, retaining the same M68HC12 instruction set while adding a wider 16-bit datapath, an enhanced indexed addressing mode, and a higher bus bandwidth. Microcontrollers sit at the lowest tier of the compute hierarchy (microcontroller -> embedded processor -> MPU) and are the workhorse of real-time control loops where latency, determinism, and integration matter more than raw throughput.

Key features include BDM (Background Debug Mode) and a serial monitor for non-intrusive in-circuit debugging, an external bus interface for memory expansion, an XGate co-processor channel on related family members, and a 32-bit timer for precise event timing. The on-chip EEPROM simplifies parameter storage, while the flash controller supports in-application reprogramming for field firmware updates. The CAN 2.0 A/B module includes 15 message buffers and hardware filtering for offloading the CPU in OSEK/VDX-based automotive stacks.

Typical applications include automotive body controllers, instrument clusters, HVAC modules, door/zone ECUs, and industrial PLC-style controllers. The wide AEC-Q100 grade-1 temperature range and the CAN/SPI/SCI mix make the part attractive for any automotive network node that needs non-volatile storage of calibration data.

When designing with this MCU, ensure the 5 V rail is clean and decoupled with 100 nF ceramic + 10 uF bulk capacitors within 25 mm of the VDD/VSS pins. The oscillator loop has tight layout requirements; keep the crystal traces short and guarded by a ground ring. Refer to the manufacturer datasheet for background-debug, mode-of-operation, and PLL configuration guidance before bringing up code.

Drop-in-Alternativen für MC9S12DG256MFUE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12DG256MFUE (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, ADC, Connectivity, Core Processor.

NXP Semiconductors
Operating Temperature: -40C to +125C (automotive grade)
Package: 112-LQFP (20x20 mm)
ADC: 2 x 10-bit, 8 channels each (16 channels total)
Vergleichen mit MC9S12DG256MFUE →
NXP Semiconductors
Operating Temperature: -40 C to +85 C
Connectivity: EBI/EMI, I2C, SCI, SPI
Core Processor: HCS12
Vergleichen mit MC9S12DG256MFUE →
NXP Semiconductors
Operating Temperature: -40C to +85C (industrial)
Package: 80-QFP (14x14 mm)
Connectivity: 3x SCI (UART), 1x SPI, 1x IIC
Vergleichen mit MC9S12DG256MFUE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12DG256CFUE

✅ Drop-In
📦 80-LQFP (QFP-80)
same 256 KB Flash, same HCS12 core, same 80-QFP package, suffix C denotes different mask revision

📋 Referenzalternative (nicht im Katalog)

MC9S12DG128CFUE

✅ Drop-In
📦 80-LQFP (QFP-80)
128 KB Flash vs 256 KB Flash (-50%), same HCS12 core at 25 MHz, same 80-QFP footprint

📋 Referenzalternative (nicht im Katalog)

MC9S12E256CFUE

✅ Drop-In
NXP Semiconductors
📦 PQFP-80
NXP Semiconductors (formerly Freescale) · HCS12 / MC9S12E · HCS12 (16-bit) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 16 KB · 4 KB

✓ Auf Lager

$9.75 / Stück

Datenblatt ansehen →

MC9S12E128CFUE

✅ Drop-In
NXP Semiconductors
📦 80-LQFP (QFP-80)
HCS12 · 16-Bit · 25 MHz (50 MHz internal bus via PLL) · 128 KB (128K x 8) · FLASH · 8 KB · 60

✓ Auf Lager

$10.65 / Stück

Datenblatt ansehen →

MC9S12C96CFUER

✅ Drop-In
📦 80-QFP
96 KB Flash vs 256 KB Flash (-62.5%), same HCS12 core at 25 MHz, same 80-QFP package

📋 Referenzalternative (nicht im Katalog)

MC9S12DG256MFUE Grenzwerte & elektrische Eigenschaften

Core HCS12 (16-bit CISC)
Program Memory 256 KB Flash
RAM 12 KB
EEPROM 4 KB
Maximum CPU Frequency 25 MHz
I/O Pins 59
ADC 8-channel, 10-bit
Timer 8-channel Enhanced Capture Timer
Communication 2x SCI, 2x SPI, I2C, CAN 2.0
Gehäuse 80-LQFP (QFP-80), 14x14 mm
Montageart Surface Mount
Betriebstemperatur -40C to +125C (AEC-Q100)
AEC-Q100 Grade Qualified
RoHS-Status Compliant

MC9S12DG256MFUE Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 VDDR — Voltage regulator power supply
Pin 2 VDD1 — Core logic supply (1.8 V regulated)
Pin 3 VSS1 — Core logic ground
Pin 4 VDD2 — I/O supply (5 V)
Pin 5 VSS2 — I/O ground
Pin 6 BKGD — Background debug mode pin
Pin 7 RESET — Active-low external reset
Pin 8 XCLKS — Crystal oscillator mode select
Pin 9 XTAL — Crystal oscillator input
Pin 10 EXTAL — Crystal oscillator input / external clock
Pin 11 TEST — Test mode enable (tie to VSS)
Pin 12 PAD0 — Port AD bit 0 / AN0
Pin 13 PAD1 — Port AD bit 1 / AN1
Pin 14 PAD2 — Port AD bit 2 / AN2
Pin 15 PAD3 — Port AD bit 3 / AN3
Pin 16 PAD4 — Port AD bit 4 / AN4
Pin 17 PAD5 — Port AD bit 5 / AN5
Pin 18 PAD6 — Port AD bit 6 / AN6
Pin 19 PAD7 — Port AD bit 7 / AN7
Pin 20 VSSAD — ADC ground reference
Pin 21 VDDAD — ADC supply reference (5 V)
Pin 22 PS0 — Port S bit 0 / SCI0 TX
Pin 23 PS1 — Port S bit 1 / SCI0 RX
Pin 24 PS2 — Port S bit 2 / SPI0 SCK
Pin 25 PS3 — Port S bit 3 / SPI0 MOSI
Pin 26 PS4 — Port S bit 4 / SPI0 MISO
Pin 27 PS5 — Port S bit 5 / SPI0 SS
Pin 28 PS6 — Port S bit 6
Pin 29 PS7 — Port S bit 7
Pin 30 PT0 — Port T bit 0 / IOC0 (timer)
Pin 31 PT1 — Port T bit 1 / IOC1 (timer)
Pin 32 PT2 — Port T bit 2 / IOC2 (timer)
Pin 33 PT3 — Port T bit 3 / IOC3 (timer)
Pin 34 PT4 — Port T bit 4 / IOC4 (timer)
Pin 35 PT5 — Port T bit 5 / IOC5 (timer)
Pin 36 PT6 — Port T bit 6 / IOC6 (timer)
Pin 37 PT7 — Port T bit 7 / IOC7 (timer)
Pin 38 PM0 — Port M bit 0 / CAN TX
Pin 39 PM1 — Port M bit 1 / CAN RX
Pin 40 PM2 — Port M bit 2
Pin 41 PM3 — Port M bit 3
Pin 42 PM4 — Port M bit 4
Pin 43 PM5 — Port M bit 5
Pin 44 PM6 — Port M bit 6
Pin 45 PM7 — Port M bit 7
Pin 46 PP0 — Port P bit 0 / PWM0
Pin 47 PP1 — Port P bit 1 / PWM1
Pin 48 PP2 — Port P bit 2 / PWM2
Pin 49 PP3 — Port P bit 3 / PWM3
Pin 50 PP4 — Port P bit 4 / PWM4
Pin 51 PP5 — Port P bit 5 / PWM5
Pin 52 PP6 — Port P bit 6 / PWM6
Pin 53 PP7 — Port P bit 7 / PWM7
Pin 54 PJ0 — Port J bit 0 / Address line
Pin 55 PJ1 — Port J bit 1 / Address line
Pin 56 PJ2 — Port J bit 2 / Address line
Pin 57 PJ3 — Port J bit 3 / Address line
Pin 58 PJ4 — Port J bit 4 / Address line
Pin 59 PJ5 — Port J bit 5 / Address line
Pin 60 PJ6 — Port J bit 6 / Address line
Pin 61 PJ7 — Port J bit 7 / Address line
Pin 62 PK0 — Port K bit 0 / Data line
Pin 63 PK1 — Port K bit 1 / Data line
Pin 64 PK2 — Port K bit 2 / Data line
Pin 65 PK3 — Port K bit 3 / Data line
Pin 66 PK4 — Port K bit 4 / Data line
Pin 67 PK5 — Port K bit 5 / Data line
Pin 68 PK6 — Port K bit 6 / Data line
Pin 69 PK7 — Port K bit 7 / Data line
Pin 70 PA0 — Port A bit 0 / Address line
Pin 71 PA1 — Port A bit 1 / Address line
Pin 72 PA2 — Port A bit 2 / Address line
Pin 73 PA3 — Port A bit 3 / Address line
Pin 74 PA4 — Port A bit 4 / Address line
Pin 75 PA5 — Port A bit 5 / Address line
Pin 76 PA6 — Port A bit 6 / Address line
Pin 77 PA7 — Port A bit 7 / Address line
Pin 78 PB0 — Port B bit 0 / Data line
Pin 79 PB1 — Port B bit 1 / Data line
Pin 80 PE0 — Port E bit 0 / Mode select

Typische Anwendungen

MC9S12DG256MFUE ist geeignet für 6 Anwendungs: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control ECU, Industrial PLC and Machine Controller, Door Zone and Seat Control Module, Battery Management Slave Module.

🚗

Automotive Body Control Module

The MC9S12DG256MFUE fits automotive body-control ECUs because it combines 256 KB Flash for the BCM application code with on-chip CAN 2.0, two SCI channels, and an 8-channel 10-bit ADC in a single 80-LQFP package. The AEC-Q100 qualification and -40C to +125C operating range let it sit behind the cabin fuse box and survive underhood thermal stress. Designers use the HCS12 CISC core for deterministic interrupt response on door, lighting, and wiper control loops, while the 4 KB EEPROM stores trim and calibration data that must survive key-off battery disconnects. Compared with a discrete CAN + MCU solution, the integrated ADC and PWM channels reduce BOM cost by 20-30% in production BCM designs.

📺

Instrument Cluster Controller

The MC9S12DG256MFUE is well matched to instrument cluster mainboards that drive stepper motors, gauge steppers, and warning lamps. Its 8-channel enhanced capture timer delivers the precise PWM edges required for pointer damping algorithms, while the 8-channel 10-bit ADC reads fuel, temperature, and oil-pressure sensors with adequate resolution for cluster bar-graph displays. The 256 KB Flash stores graphical gauge fonts and diagnostic trouble-code tables, and the 12 KB RAM keeps the active screen framebuffer. Compared with external timer ICs, integrating the PWM into the MCU eliminates synchronization latency between gauge channels and simplifies EMC compliance.

🏭

HVAC Climate Control ECU

Climate-control ECUs benefit from the MC9S12DG256MFUE's mix of PWM channels, ADC inputs, and CAN connectivity. The HCS12 core runs the PID loops that blend door-mode, blower-speed, and temperature-setpoint requests, while the SCI ports interface to the cabin network and to the defrost/wiper multiplexers. AEC-Q100 grade and wide temperature range allow the part to be placed inside the HVAC head module where ambient swings can reach 85 C in summer sun. The on-chip EEPROM stores user-set preferences across battery disconnects, eliminating the need for an external memory IC and shrinking PCB footprint by roughly 30% versus a discrete solution.

🏭

Industrial PLC and Machine Controller

Industrial PLC-style controllers use the MC9S12DG256MFUE to consolidate logic solver, sensor interface, and fieldbus node into one chip. The CAN 2.0 module acts as the CANopen or DeviceNet slave port, the SPI channels drive digital isolators and ADC front ends, and the 256 KB Flash holds ladder-logic runtime plus application code. Operating from a 5 V rail simplifies retrofitting into legacy 24 V industrial systems with a single buck converter. The HCS12's deterministic interrupt latency (well under 1 us at 25 MHz) is sufficient for fast scan-cycle PLC firmware on small I/O-count machines.

🚗

Door Zone and Seat Control Module

Door-zone ECUs benefit from the MC9S12DG256MFUE's peripheral density: the 8-channel ADC reads mirror-position and motor-current feedback, the PWM outputs drive window-lift and seat motors, and the CAN port connects to the body network. The 80-LQFP footprint and small thermal pad simplify the dense PCB layouts inside door modules where space is constrained. Designers reuse the on-chip EEPROM to store end-of-travel calibration per window, removing factory trim potentiometers. Compared with separate MCU + driver-chip solutions, integrating the timers and ADC cuts the door-module BOM by roughly $1.20 per node in volume.

⚡

Battery Management Slave Module

Battery-pack slave modules for 12 V and 48 V mild-hybrid systems use the MC9S12DG256MFUE as the cell-monitoring supervisor. Its 8-channel 10-bit ADC measures cell voltages through external resistor dividers, the SCI port links to a master BMS over isolated UART, and the 4 KB EEPROM logs cell-impedance history for state-of-health estimation. The AEC-Q100 grade and 5 V operation align with 12 V automotive rails without an extra LDO. Compared with dedicated battery-monitoring ICs, this approach gives designers programmable logic for cell-balancing algorithms without sacrificing CAN-based diagnostics.

Zusammenfassung der empfohlenen Produkte

TJA1050 NXP Semiconductors Verwendet in: Automotive Body Control Module MC33399PEF LIN transceiver for body network Verwendet in: Automotive Body Control Module MC33991 Gauge stepper driver companion Verwendet in: Instrument Cluster Controller MCZ33996 Solenoid/Lamp driver companion Verwendet in: Instrument Cluster Controller MC33883 Half-bridge driver for blower motor Verwendet in: HVAC Climate Control ECU TJA1040 High-speed CAN transceiver Verwendet in: HVAC Climate Control ECU PCA82C251 External CAN transceiver for fieldbus Verwendet in: Industrial PLC and Machine Controller MAX1487 RS-485 transceiver for Modbus Verwendet in: Industrial PLC and Machine Controller MC33931 H-bridge driver for window motor Verwendet in: Door Zone and Seat Control Module MCZ33661 LIN driver companion Verwendet in: Door Zone and Seat Control Module MC33771 Dedicated battery cell monitor IC Verwendet in: Battery Management Slave Module TJA1057 CAN transceiver for BMS comms Verwendet in: Battery Management Slave Module
What is the flash memory size of the MC9S12DG256MFUE?
The MC9S12DG256MFUE integrates 256 KB of on-chip Flash program memory, supported by 12 KB of RAM and 4 KB of EEPROM for non-volatile parameter storage. According to the NXP datasheet, the Flash supports in-application programming across 64-byte sectors, enabling field firmware updates without external bootloader devices.
What is the core architecture of the MC9S12DG256MFUE?
The MC9S12DG256MFUE uses the HCS12 core, a 16-bit CISC processor derived from the M68HC12 family running up to 25 MHz. It retains the M68HC12 instruction set with enhanced indexed addressing and a wider datapath, which is well suited to deterministic automotive and industrial control code.
What package does the MC9S12DG256MFUE ship in?
The MC9S12DG256MFUE ships in an 80-pin LQFP (QFP-80) package, 14 x 14 mm body, with a 0.65 mm pitch. The exposed pad variant of this family uses an LQFP-112 (PV suffix), so verify the suffix - MFUE is the 80-pin option.
Is the MC9S12DG256MFUE AEC-Q100 qualified for automotive use?
Yes. The MC9S12DG256MFUE is AEC-Q100 qualified, making it suitable for automotive body and chassis ECUs. It is also flagged NRND by NXP, so new automotive designs should evaluate the active S12G or S12Z successor families for long-term production.
What is the difference between the MC9S12DG256MFUE and the MC9S12DG256CFUE?
The MC9S12DG256MFUE is the 80-QFP variant, while the MC9S12DG256CFUE typically denotes the 112-pin LQFP (PV suffix) option in the same family. Both share the 256 KB Flash HCS12 core at 25 MHz; the CFUE/PVE offers more I/O pins because of the larger package.
Where can I buy the MC9S12DG256MFUE at the best price?
The MC9S12DG256MFUE is in stock at authorized distributors including DigiKey and Mouser as of 2026-10-17, with volume pricing dropping to roughly $14.95 at 1000 pieces. Octopart aggregates six distributors and Flip Electronics carries franchise stock for hard-to-find NXP parts.
What is the lead time for the MC9S12DG256MFUE?
Lead time for the MC9S12DG256MFUE is typically 8-12 weeks through authorized distributors as of 2026-10-17, because the part is flagged NRND. For new designs, sourcing the active S12G or S12Z equivalent is recommended to avoid future allocation risk.
Is the MC9S12DG256MFUE in stock right now?
Stock status varies by reel and tray option as of 2026-10-17. DigiKey lists the 80-QFP tray variant with limited stock and the Mouser listing indicates inventory is available for small quantities. For volume orders contact NXP franchised distributors directly.
What is the operating voltage of the MC9S12DG256MFUE?
The MC9S12DG256MFUE operates from a 5 V supply rail, with the internal regulator output specified at 2.35 V to 2.75 V for the core logic per the datasheet electrical characteristics. External 5 V tolerance on I/O pins depends on the specific pad configuration; consult the datasheet I/O section for Vih/Vil limits.
What peripherals are integrated in the MC9S12DG256MFUE?
The MC9S12DG256MFUE integrates two SCI (UART) channels, two SPI, one I2C, one CAN 2.0 module, an 8-channel 10-bit ADC, and an 8-channel enhanced capture timer with PWM. This peripheral mix covers the typical automotive body-controller node without requiring external UART, CAN, or ADC devices.
Can the MC9S12DG256MFUE be replaced by the MC9S12DT256?
Yes, the MC9S12DT256 is the larger 112-pin LQFP variant in the same family with identical 256 KB Flash HCS12 core, allowing software portability. However the package and pinout differ, so PCB redesign is required; only swap MPNs that share the 80-QFP footprint for true drop-in compatibility.
What is the best drop-in replacement for the MC9S12DG256MFUE?
The closest 80-QFP drop-in replacement is the MC9S12DG128CFUE (128 KB Flash, same 80-pin QFP, same HCS12 core at 25 MHz) for designs that fit in 128 KB. For a same-Flash alternative, the MC9S12DG256CFUE shares the same die but ships in 112-LQFP, requiring PCB rework.
Where can I download the MC9S12DG256MFUE datasheet?
The NXP MC9S12DG256MFUE product page at https://www.nxp.com/part/MC9S12DG256MFUE hosts the official datasheet and S12DG reference manual. Distributor pages (DigiKey 1167788, Mouser N2XN0KY4UWWRIdukqPiqxw) also link to the manufacturer PDF via the NXP product tree.
Where can I find the MC9S12DG256MFUE pinout?
The 80-LQFP pinout for the MC9S12DG256MFUE is documented on page 1 of the S12DG reference manual, also reproduced in the NXP product page datasheet. Pin 1 is at the top-left corner of the QFP body with the dot marker, and the device multiplexes analog, timer, and bus signals to maximize I/O count.
Is the MC9S12DG256MFUE the same as the MC9S12C96CFUER?
No. The MC9S12C96CFUER is a different HCS12 family member with only 96 KB Flash versus 256 KB Flash in the MC9S12DG256MFUE. Both share the 80-QFP package footprint but differ in memory size and peripheral count, so firmware must be re-validated before substitution.

Technische Referenzdaten für MC9S12DG256MFUE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S12DG256MFUE when you need a proven 16-bit HCS12 MCU with 256 KB Flash and 4 KB EEPROM for an automotive body, chassis, or cluster ECU that already has NXP HCS12 firmware in production. Its 80-LQFP package and AEC-Q100 grade-1 temperature range cover typical cabin and underhood placements. If your design fits in 128 KB Flash, the MC9S12DG128CFUE is a pin-compatible lower-cost drop-in. If you need the CAN 2.0 message-handling overhead but smaller memory, the MC9S12C96CFUER also shares the footprint. For new designs entering production today, evaluate the active S12G or S12Z families first because the MC9S12DG256MFUE is flagged NRND - it remains supported but is no longer recommended for new automotive designs per NXP's PCN policy.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12DG256CFUE MC9S12DG128CFUE MC9S12E256CFUE MC9S12E128CFUE MC9S12C96CFUER
Package 80-LQFP (QFP-80), 14x14 mm 80-LQFP (QFP-80) - same 80-LQFP (QFP-80) - same PQFP-80 - same 80-LQFP (QFP-80) - same 80-QFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12 (16-bit CISC) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit)
Program Memory (Flash) 256 KB 256 KB 128 KB 256 KB 128 KB 96 KB
Maximum CPU Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
RAM 12 KB 12 KB 8 KB 12 KB 8 KB 4 KB
AEC-Q100 Grade Qualified Qualified Qualified Qualified Qualified Qualified

Wichtigste Unterscheidungsmerkmale

  • 256 KB Flash with on-chip EEPROM (vs. MC9S12DG128CFUE)
  • AEC-Q100 qualified with 5 V I/O (vs. MC9S12C96CFUER)
  • Integrated CAN 2.0 with 15 message buffers (vs. MC9S12E256CFUE)

Designhinweise

Decouple the MC9S12DG256MFUE with a 100 nF ceramic capacitor within 5 mm of every VDD/VSS pair, plus a 10 uF bulk tantalum or ceramic on the VDDR pin. The internal 2.5 V regulator (VDDR) supplies the core; noise on VDDR directly couples into the ADC readings and can shift the conversion result by 1-2 LSB. Keep the VDDR trace short and away from PWM switching nodes. Reference: NXP AN2540 power-supply design notes for HCS12 microcontrollers.

The oscillator loop (XTAL/EXTAL) is highly sensitive to PCB parasitics. Keep the crystal traces shorter than 10 mm, route them over a continuous ground plane, and surround the loop with a grounded guard ring to minimize EMI pickup. Avoid running PWM or CAN traces under the crystal area; the third-harmonic content can inject jitter into the 25 MHz clock and degrade SCI baud-rate accuracy by 2-3%.

Do not leave the TEST pin floating; tie TEST directly to VSS via a 10 kohm resistor. A floating TEST pin can latch the part into factory test mode on power-up, causing BDM to appear unresponsive. Similarly, configure the XCLKS (PLL mode select) pin to match the crystal oscillator mode you intend before programming, because the boot sequence latches mode-of-operation based on this pin.

The 80-LQFP package has a junction-to-ambient thermal resistance of approximately 60 C/W on a 2-layer JEDEC test board. At AEC-Q100 grade-1 ambient (125 C), the junction can approach 160 C if the part dissipates 0.5 W continuous - well below the 150 C shutdown threshold but with little margin. Use thermal vias under the exposed die pad (if present on your variant) to spread heat into the inner ground plane.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

AEC-Q100 qualified per NXP product page; RoHS and REACH compliant per DigiKey listing. Lead-free reflow profile JEDEC J-STD-020.

Daten verifiziert am: 2026-10-17 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors MC9S12DG256MFUE HCS12 CISC 16-bit microcontroller M68HC12 Flash memory EEPROM CAN 2.0 SCI SPI I2C ADC PWM BDM AEC-Q100 LQFP-80 QFP-80 surface mount RoHS REACH automotive body control module instrument cluster industrial PLC
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