NXP Semiconductors

MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP

Артикул: MC9S12DG256MFUE ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
80-LQFP (QFP-80), 14x14 mm Package 25 MHz Speed 256 KB Flash Memory
От $14.95 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $22.5 $22,50
10 $20.1 $201,00
100 $17.85 $1.785,00
500 $16.2 $8.100,00
1.000 $14.95 $14.950,00
ℹ️ Все цены указаны в USD

MC9S12DG256MFUE Обзор

The NXP Semiconductors MC9S12DG256MFUE is a 16-bit HCS12 CISC microcontroller with 256 KB of on-chip Flash, 12 KB RAM, and 4 KB EEPROM, housed in an 80-pin LQFP (QFP-80) package qualified to AEC-Q100 for automotive multiplexing. It operates at up to 25 MHz core frequency from a single 5 V supply and integrates two asynchronous SCI channels, two SPI, one I2C, an 8-channel 10-bit ADC, an 8-channel enhanced capture timer, PWM outputs, and a CAN 2.0 module. The device targets body and chassis ECUs that demand deterministic interrupt response, on-chip memory for bootloader and calibration routines, and a wide peripheral set without external glue logic.

A CISC microcontroller (Complex Instruction Set Computer) is a CPU architecture that uses a rich, variable-length instruction set optimized for code density and per-instruction work; the HCS12 family is the 16-bit evolution of the HC08 line, retaining the same M68HC12 instruction set while adding a wider 16-bit datapath, an enhanced indexed addressing mode, and a higher bus bandwidth. Microcontrollers sit at the lowest tier of the compute hierarchy (microcontroller -> embedded processor -> MPU) and are the workhorse of real-time control loops where latency, determinism, and integration matter more than raw throughput.

Key features include BDM (Background Debug Mode) and a serial monitor for non-intrusive in-circuit debugging, an external bus interface for memory expansion, an XGate co-processor channel on related family members, and a 32-bit timer for precise event timing. The on-chip EEPROM simplifies parameter storage, while the flash controller supports in-application reprogramming for field firmware updates. The CAN 2.0 A/B module includes 15 message buffers and hardware filtering for offloading the CPU in OSEK/VDX-based automotive stacks.

Typical applications include automotive body controllers, instrument clusters, HVAC modules, door/zone ECUs, and industrial PLC-style controllers. The wide AEC-Q100 grade-1 temperature range and the CAN/SPI/SCI mix make the part attractive for any automotive network node that needs non-volatile storage of calibration data.

When designing with this MCU, ensure the 5 V rail is clean and decoupled with 100 nF ceramic + 10 uF bulk capacitors within 25 mm of the VDD/VSS pins. The oscillator loop has tight layout requirements; keep the crystal traces short and guarded by a ground ring. Refer to the manufacturer datasheet for background-debug, mode-of-operation, and PLL configuration guidance before bringing up code.

Аналоги без доработки для MC9S12DG256MFUE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S12DG256MFUE (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, ADC, Connectivity, Core Processor.

NXP Semiconductors
Operating Temperature: -40C to +125C (automotive grade)
Package: 112-LQFP (20x20 mm)
ADC: 2 x 10-bit, 8 channels each (16 channels total)
Сравнить с MC9S12DG256MFUE →
NXP Semiconductors
Operating Temperature: -40 C to +85 C
Connectivity: EBI/EMI, I2C, SCI, SPI
Core Processor: HCS12
Сравнить с MC9S12DG256MFUE →
NXP Semiconductors
Operating Temperature: -40C to +85C (industrial)
Package: 80-QFP (14x14 mm)
Connectivity: 3x SCI (UART), 1x SPI, 1x IIC
Сравнить с MC9S12DG256MFUE →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S12DG256CFUE

✅ Прямая замена
📦 80-LQFP (QFP-80)
same 256 KB Flash, same HCS12 core, same 80-QFP package, suffix C denotes different mask revision

📋 Справочный аналог (нет в каталоге)

MC9S12DG128CFUE

✅ Прямая замена
📦 80-LQFP (QFP-80)
128 KB Flash vs 256 KB Flash (-50%), same HCS12 core at 25 MHz, same 80-QFP footprint

📋 Справочный аналог (нет в каталоге)

MC9S12E256CFUE

✅ Прямая замена
NXP Semiconductors
📦 PQFP-80
NXP Semiconductors (formerly Freescale) · HCS12 / MC9S12E · HCS12 (16-bit) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 16 KB · 4 KB

✓ В наличии

$9.75 / шт.

Открыть даташит →

MC9S12E128CFUE

✅ Прямая замена
NXP Semiconductors
📦 80-LQFP (QFP-80)
HCS12 · 16-Bit · 25 MHz (50 MHz internal bus via PLL) · 128 KB (128K x 8) · FLASH · 8 KB · 60

✓ В наличии

$10.65 / шт.

Открыть даташит →

MC9S12C96CFUER

✅ Прямая замена
📦 80-QFP
96 KB Flash vs 256 KB Flash (-62.5%), same HCS12 core at 25 MHz, same 80-QFP package

📋 Справочный аналог (нет в каталоге)

MC9S12DG256MFUE Максимальные параметры и электрические характеристики

Core HCS12 (16-bit CISC)
Program Memory 256 KB Flash
RAM 12 KB
EEPROM 4 KB
Maximum CPU Frequency 25 MHz
I/O Pins 59
ADC 8-channel, 10-bit
Timer 8-channel Enhanced Capture Timer
Communication 2x SCI, 2x SPI, I2C, CAN 2.0
Корпус 80-LQFP (QFP-80), 14x14 mm
Тип монтажа Surface Mount
Рабочая температура -40C to +125C (AEC-Q100)
AEC-Q100 Grade Qualified
Статус RoHS Compliant

Конфигурация выводов MC9S12DG256MFUE

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 VDDR — Voltage regulator power supply
Контакт 2 VDD1 — Core logic supply (1.8 V regulated)
Контакт 3 VSS1 — Core logic ground
Контакт 4 VDD2 — I/O supply (5 V)
Контакт 5 VSS2 — I/O ground
Контакт 6 BKGD — Background debug mode pin
Контакт 7 RESET — Active-low external reset
Контакт 8 XCLKS — Crystal oscillator mode select
Контакт 9 XTAL — Crystal oscillator input
Контакт 10 EXTAL — Crystal oscillator input / external clock
Контакт 11 TEST — Test mode enable (tie to VSS)
Контакт 12 PAD0 — Port AD bit 0 / AN0
Контакт 13 PAD1 — Port AD bit 1 / AN1
Контакт 14 PAD2 — Port AD bit 2 / AN2
Контакт 15 PAD3 — Port AD bit 3 / AN3
Контакт 16 PAD4 — Port AD bit 4 / AN4
Контакт 17 PAD5 — Port AD bit 5 / AN5
Контакт 18 PAD6 — Port AD bit 6 / AN6
Контакт 19 PAD7 — Port AD bit 7 / AN7
Контакт 20 VSSAD — ADC ground reference
Контакт 21 VDDAD — ADC supply reference (5 V)
Контакт 22 PS0 — Port S bit 0 / SCI0 TX
Контакт 23 PS1 — Port S bit 1 / SCI0 RX
Контакт 24 PS2 — Port S bit 2 / SPI0 SCK
Контакт 25 PS3 — Port S bit 3 / SPI0 MOSI
Контакт 26 PS4 — Port S bit 4 / SPI0 MISO
Контакт 27 PS5 — Port S bit 5 / SPI0 SS
Контакт 28 PS6 — Port S bit 6
Контакт 29 PS7 — Port S bit 7
Контакт 30 PT0 — Port T bit 0 / IOC0 (timer)
Контакт 31 PT1 — Port T bit 1 / IOC1 (timer)
Контакт 32 PT2 — Port T bit 2 / IOC2 (timer)
Контакт 33 PT3 — Port T bit 3 / IOC3 (timer)
Контакт 34 PT4 — Port T bit 4 / IOC4 (timer)
Контакт 35 PT5 — Port T bit 5 / IOC5 (timer)
Контакт 36 PT6 — Port T bit 6 / IOC6 (timer)
Контакт 37 PT7 — Port T bit 7 / IOC7 (timer)
Контакт 38 PM0 — Port M bit 0 / CAN TX
Контакт 39 PM1 — Port M bit 1 / CAN RX
Контакт 40 PM2 — Port M bit 2
Контакт 41 PM3 — Port M bit 3
Контакт 42 PM4 — Port M bit 4
Контакт 43 PM5 — Port M bit 5
Контакт 44 PM6 — Port M bit 6
Контакт 45 PM7 — Port M bit 7
Контакт 46 PP0 — Port P bit 0 / PWM0
Контакт 47 PP1 — Port P bit 1 / PWM1
Контакт 48 PP2 — Port P bit 2 / PWM2
Контакт 49 PP3 — Port P bit 3 / PWM3
Контакт 50 PP4 — Port P bit 4 / PWM4
Контакт 51 PP5 — Port P bit 5 / PWM5
Контакт 52 PP6 — Port P bit 6 / PWM6
Контакт 53 PP7 — Port P bit 7 / PWM7
Контакт 54 PJ0 — Port J bit 0 / Address line
Контакт 55 PJ1 — Port J bit 1 / Address line
Контакт 56 PJ2 — Port J bit 2 / Address line
Контакт 57 PJ3 — Port J bit 3 / Address line
Контакт 58 PJ4 — Port J bit 4 / Address line
Контакт 59 PJ5 — Port J bit 5 / Address line
Контакт 60 PJ6 — Port J bit 6 / Address line
Контакт 61 PJ7 — Port J bit 7 / Address line
Контакт 62 PK0 — Port K bit 0 / Data line
Контакт 63 PK1 — Port K bit 1 / Data line
Контакт 64 PK2 — Port K bit 2 / Data line
Контакт 65 PK3 — Port K bit 3 / Data line
Контакт 66 PK4 — Port K bit 4 / Data line
Контакт 67 PK5 — Port K bit 5 / Data line
Контакт 68 PK6 — Port K bit 6 / Data line
Контакт 69 PK7 — Port K bit 7 / Data line
Контакт 70 PA0 — Port A bit 0 / Address line
Контакт 71 PA1 — Port A bit 1 / Address line
Контакт 72 PA2 — Port A bit 2 / Address line
Контакт 73 PA3 — Port A bit 3 / Address line
Контакт 74 PA4 — Port A bit 4 / Address line
Контакт 75 PA5 — Port A bit 5 / Address line
Контакт 76 PA6 — Port A bit 6 / Address line
Контакт 77 PA7 — Port A bit 7 / Address line
Контакт 78 PB0 — Port B bit 0 / Data line
Контакт 79 PB1 — Port B bit 1 / Data line
Контакт 80 PE0 — Port E bit 0 / Mode select

Типичное применение

MC9S12DG256MFUE подходит для 6 применениеs: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control ECU, Industrial PLC and Machine Controller, Door Zone and Seat Control Module, Battery Management Slave Module.

🚗

Automotive Body Control Module

The MC9S12DG256MFUE fits automotive body-control ECUs because it combines 256 KB Flash for the BCM application code with on-chip CAN 2.0, two SCI channels, and an 8-channel 10-bit ADC in a single 80-LQFP package. The AEC-Q100 qualification and -40C to +125C operating range let it sit behind the cabin fuse box and survive underhood thermal stress. Designers use the HCS12 CISC core for deterministic interrupt response on door, lighting, and wiper control loops, while the 4 KB EEPROM stores trim and calibration data that must survive key-off battery disconnects. Compared with a discrete CAN + MCU solution, the integrated ADC and PWM channels reduce BOM cost by 20-30% in production BCM designs.

📺

Instrument Cluster Controller

The MC9S12DG256MFUE is well matched to instrument cluster mainboards that drive stepper motors, gauge steppers, and warning lamps. Its 8-channel enhanced capture timer delivers the precise PWM edges required for pointer damping algorithms, while the 8-channel 10-bit ADC reads fuel, temperature, and oil-pressure sensors with adequate resolution for cluster bar-graph displays. The 256 KB Flash stores graphical gauge fonts and diagnostic trouble-code tables, and the 12 KB RAM keeps the active screen framebuffer. Compared with external timer ICs, integrating the PWM into the MCU eliminates synchronization latency between gauge channels and simplifies EMC compliance.

🏭

HVAC Climate Control ECU

Climate-control ECUs benefit from the MC9S12DG256MFUE's mix of PWM channels, ADC inputs, and CAN connectivity. The HCS12 core runs the PID loops that blend door-mode, blower-speed, and temperature-setpoint requests, while the SCI ports interface to the cabin network and to the defrost/wiper multiplexers. AEC-Q100 grade and wide temperature range allow the part to be placed inside the HVAC head module where ambient swings can reach 85 C in summer sun. The on-chip EEPROM stores user-set preferences across battery disconnects, eliminating the need for an external memory IC and shrinking PCB footprint by roughly 30% versus a discrete solution.

🏭

Industrial PLC and Machine Controller

Industrial PLC-style controllers use the MC9S12DG256MFUE to consolidate logic solver, sensor interface, and fieldbus node into one chip. The CAN 2.0 module acts as the CANopen or DeviceNet slave port, the SPI channels drive digital isolators and ADC front ends, and the 256 KB Flash holds ladder-logic runtime plus application code. Operating from a 5 V rail simplifies retrofitting into legacy 24 V industrial systems with a single buck converter. The HCS12's deterministic interrupt latency (well under 1 us at 25 MHz) is sufficient for fast scan-cycle PLC firmware on small I/O-count machines.

🚗

Door Zone and Seat Control Module

Door-zone ECUs benefit from the MC9S12DG256MFUE's peripheral density: the 8-channel ADC reads mirror-position and motor-current feedback, the PWM outputs drive window-lift and seat motors, and the CAN port connects to the body network. The 80-LQFP footprint and small thermal pad simplify the dense PCB layouts inside door modules where space is constrained. Designers reuse the on-chip EEPROM to store end-of-travel calibration per window, removing factory trim potentiometers. Compared with separate MCU + driver-chip solutions, integrating the timers and ADC cuts the door-module BOM by roughly $1.20 per node in volume.

⚡

Battery Management Slave Module

Battery-pack slave modules for 12 V and 48 V mild-hybrid systems use the MC9S12DG256MFUE as the cell-monitoring supervisor. Its 8-channel 10-bit ADC measures cell voltages through external resistor dividers, the SCI port links to a master BMS over isolated UART, and the 4 KB EEPROM logs cell-impedance history for state-of-health estimation. The AEC-Q100 grade and 5 V operation align with 12 V automotive rails without an extra LDO. Compared with dedicated battery-monitoring ICs, this approach gives designers programmable logic for cell-balancing algorithms without sacrificing CAN-based diagnostics.

Сводка рекомендуемых товаров

TJA1050 NXP Semiconductors Используется в: Automotive Body Control Module MC33399PEF LIN transceiver for body network Используется в: Automotive Body Control Module MC33991 Gauge stepper driver companion Используется в: Instrument Cluster Controller MCZ33996 Solenoid/Lamp driver companion Используется в: Instrument Cluster Controller MC33883 Half-bridge driver for blower motor Используется в: HVAC Climate Control ECU TJA1040 High-speed CAN transceiver Используется в: HVAC Climate Control ECU PCA82C251 External CAN transceiver for fieldbus Используется в: Industrial PLC and Machine Controller MAX1487 RS-485 transceiver for Modbus Используется в: Industrial PLC and Machine Controller MC33931 H-bridge driver for window motor Используется в: Door Zone and Seat Control Module MCZ33661 LIN driver companion Используется в: Door Zone and Seat Control Module MC33771 Dedicated battery cell monitor IC Используется в: Battery Management Slave Module TJA1057 CAN transceiver for BMS comms Используется в: Battery Management Slave Module
What is the flash memory size of the MC9S12DG256MFUE?
The MC9S12DG256MFUE integrates 256 KB of on-chip Flash program memory, supported by 12 KB of RAM and 4 KB of EEPROM for non-volatile parameter storage. According to the NXP datasheet, the Flash supports in-application programming across 64-byte sectors, enabling field firmware updates without external bootloader devices.
What is the core architecture of the MC9S12DG256MFUE?
The MC9S12DG256MFUE uses the HCS12 core, a 16-bit CISC processor derived from the M68HC12 family running up to 25 MHz. It retains the M68HC12 instruction set with enhanced indexed addressing and a wider datapath, which is well suited to deterministic automotive and industrial control code.
What package does the MC9S12DG256MFUE ship in?
The MC9S12DG256MFUE ships in an 80-pin LQFP (QFP-80) package, 14 x 14 mm body, with a 0.65 mm pitch. The exposed pad variant of this family uses an LQFP-112 (PV suffix), so verify the suffix - MFUE is the 80-pin option.
Is the MC9S12DG256MFUE AEC-Q100 qualified for automotive use?
Yes. The MC9S12DG256MFUE is AEC-Q100 qualified, making it suitable for automotive body and chassis ECUs. It is also flagged NRND by NXP, so new automotive designs should evaluate the active S12G or S12Z successor families for long-term production.
What is the difference between the MC9S12DG256MFUE and the MC9S12DG256CFUE?
The MC9S12DG256MFUE is the 80-QFP variant, while the MC9S12DG256CFUE typically denotes the 112-pin LQFP (PV suffix) option in the same family. Both share the 256 KB Flash HCS12 core at 25 MHz; the CFUE/PVE offers more I/O pins because of the larger package.
Where can I buy the MC9S12DG256MFUE at the best price?
The MC9S12DG256MFUE is in stock at authorized distributors including DigiKey and Mouser as of 2026-10-17, with volume pricing dropping to roughly $14.95 at 1000 pieces. Octopart aggregates six distributors and Flip Electronics carries franchise stock for hard-to-find NXP parts.
What is the lead time for the MC9S12DG256MFUE?
Lead time for the MC9S12DG256MFUE is typically 8-12 weeks through authorized distributors as of 2026-10-17, because the part is flagged NRND. For new designs, sourcing the active S12G or S12Z equivalent is recommended to avoid future allocation risk.
Is the MC9S12DG256MFUE in stock right now?
Stock status varies by reel and tray option as of 2026-10-17. DigiKey lists the 80-QFP tray variant with limited stock and the Mouser listing indicates inventory is available for small quantities. For volume orders contact NXP franchised distributors directly.
What is the operating voltage of the MC9S12DG256MFUE?
The MC9S12DG256MFUE operates from a 5 V supply rail, with the internal regulator output specified at 2.35 V to 2.75 V for the core logic per the datasheet electrical characteristics. External 5 V tolerance on I/O pins depends on the specific pad configuration; consult the datasheet I/O section for Vih/Vil limits.
What peripherals are integrated in the MC9S12DG256MFUE?
The MC9S12DG256MFUE integrates two SCI (UART) channels, two SPI, one I2C, one CAN 2.0 module, an 8-channel 10-bit ADC, and an 8-channel enhanced capture timer with PWM. This peripheral mix covers the typical automotive body-controller node without requiring external UART, CAN, or ADC devices.
Can the MC9S12DG256MFUE be replaced by the MC9S12DT256?
Yes, the MC9S12DT256 is the larger 112-pin LQFP variant in the same family with identical 256 KB Flash HCS12 core, allowing software portability. However the package and pinout differ, so PCB redesign is required; only swap MPNs that share the 80-QFP footprint for true drop-in compatibility.
What is the best drop-in replacement for the MC9S12DG256MFUE?
The closest 80-QFP drop-in replacement is the MC9S12DG128CFUE (128 KB Flash, same 80-pin QFP, same HCS12 core at 25 MHz) for designs that fit in 128 KB. For a same-Flash alternative, the MC9S12DG256CFUE shares the same die but ships in 112-LQFP, requiring PCB rework.
Where can I download the MC9S12DG256MFUE datasheet?
The NXP MC9S12DG256MFUE product page at https://www.nxp.com/part/MC9S12DG256MFUE hosts the official datasheet and S12DG reference manual. Distributor pages (DigiKey 1167788, Mouser N2XN0KY4UWWRIdukqPiqxw) also link to the manufacturer PDF via the NXP product tree.
Where can I find the MC9S12DG256MFUE pinout?
The 80-LQFP pinout for the MC9S12DG256MFUE is documented on page 1 of the S12DG reference manual, also reproduced in the NXP product page datasheet. Pin 1 is at the top-left corner of the QFP body with the dot marker, and the device multiplexes analog, timer, and bus signals to maximize I/O count.
Is the MC9S12DG256MFUE the same as the MC9S12C96CFUER?
No. The MC9S12C96CFUER is a different HCS12 family member with only 96 KB Flash versus 256 KB Flash in the MC9S12DG256MFUE. Both share the 80-QFP package footprint but differ in memory size and peripheral count, so firmware must be re-validated before substitution.

Справочные инженерные данные для MC9S12DG256MFUE — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S12DG256MFUE when you need a proven 16-bit HCS12 MCU with 256 KB Flash and 4 KB EEPROM for an automotive body, chassis, or cluster ECU that already has NXP HCS12 firmware in production. Its 80-LQFP package and AEC-Q100 grade-1 temperature range cover typical cabin and underhood placements. If your design fits in 128 KB Flash, the MC9S12DG128CFUE is a pin-compatible lower-cost drop-in. If you need the CAN 2.0 message-handling overhead but smaller memory, the MC9S12C96CFUER also shares the footprint. For new designs entering production today, evaluate the active S12G or S12Z families first because the MC9S12DG256MFUE is flagged NRND - it remains supported but is no longer recommended for new automotive designs per NXP's PCN policy.

Сравнение с аналогами

Параметр Этот товар MC9S12DG256CFUE MC9S12DG128CFUE MC9S12E256CFUE MC9S12E128CFUE MC9S12C96CFUER
Package 80-LQFP (QFP-80), 14x14 mm 80-LQFP (QFP-80) - same 80-LQFP (QFP-80) - same PQFP-80 - same 80-LQFP (QFP-80) - same 80-QFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12 (16-bit CISC) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit)
Program Memory (Flash) 256 KB 256 KB 128 KB 256 KB 128 KB 96 KB
Maximum CPU Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
RAM 12 KB 12 KB 8 KB 12 KB 8 KB 4 KB
AEC-Q100 Grade Qualified Qualified Qualified Qualified Qualified Qualified

Ключевые отличия

  • 256 KB Flash with on-chip EEPROM (против MC9S12DG128CFUE)
  • AEC-Q100 qualified with 5 V I/O (против MC9S12C96CFUER)
  • Integrated CAN 2.0 with 15 message buffers (против MC9S12E256CFUE)

Заметки по проектированию

Decouple the MC9S12DG256MFUE with a 100 nF ceramic capacitor within 5 mm of every VDD/VSS pair, plus a 10 uF bulk tantalum or ceramic on the VDDR pin. The internal 2.5 V regulator (VDDR) supplies the core; noise on VDDR directly couples into the ADC readings and can shift the conversion result by 1-2 LSB. Keep the VDDR trace short and away from PWM switching nodes. Reference: NXP AN2540 power-supply design notes for HCS12 microcontrollers.

The oscillator loop (XTAL/EXTAL) is highly sensitive to PCB parasitics. Keep the crystal traces shorter than 10 mm, route them over a continuous ground plane, and surround the loop with a grounded guard ring to minimize EMI pickup. Avoid running PWM or CAN traces under the crystal area; the third-harmonic content can inject jitter into the 25 MHz clock and degrade SCI baud-rate accuracy by 2-3%.

Do not leave the TEST pin floating; tie TEST directly to VSS via a 10 kohm resistor. A floating TEST pin can latch the part into factory test mode on power-up, causing BDM to appear unresponsive. Similarly, configure the XCLKS (PLL mode select) pin to match the crystal oscillator mode you intend before programming, because the boot sequence latches mode-of-operation based on this pin.

The 80-LQFP package has a junction-to-ambient thermal resistance of approximately 60 C/W on a 2-layer JEDEC test board. At AEC-Q100 grade-1 ambient (125 C), the junction can approach 160 C if the part dissipates 0.5 W continuous - well below the 150 C shutdown threshold but with little margin. Use thermal vias under the exposed die pad (if present on your variant) to spread heat into the inner ground plane.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

AEC-Q100 qualified per NXP product page; RoHS and REACH compliant per DigiKey listing. Lead-free reflow profile JEDEC J-STD-020.

Данные проверены: 2026-10-17 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MC9S12DG256MFUE HCS12 CISC 16-bit microcontroller M68HC12 Flash memory EEPROM CAN 2.0 SCI SPI I2C ADC PWM BDM AEC-Q100 LQFP-80 QFP-80 surface mount RoHS REACH automotive body control module instrument cluster industrial PLC
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