MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP
Référence : MC9S12DG256MFUE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.1 | $201,00 |
| 100 | $17.85 | $1 785,00 |
| 500 | $16.2 | $8 100,00 |
| 1 000 | $14.95 | $14 950,00 |
MC9S12DG256MFUE Présentation
A CISC microcontroller (Complex Instruction Set Computer) is a CPU architecture that uses a rich, variable-length instruction set optimized for code density and per-instruction work; the HCS12 family is the 16-bit evolution of the HC08 line, retaining the same M68HC12 instruction set while adding a wider 16-bit datapath, an enhanced indexed addressing mode, and a higher bus bandwidth. Microcontrollers sit at the lowest tier of the compute hierarchy (microcontroller -> embedded processor -> MPU) and are the workhorse of real-time control loops where latency, determinism, and integration matter more than raw throughput.
Key features include BDM (Background Debug Mode) and a serial monitor for non-intrusive in-circuit debugging, an external bus interface for memory expansion, an XGate co-processor channel on related family members, and a 32-bit timer for precise event timing. The on-chip EEPROM simplifies parameter storage, while the flash controller supports in-application reprogramming for field firmware updates. The CAN 2.0 A/B module includes 15 message buffers and hardware filtering for offloading the CPU in OSEK/VDX-based automotive stacks.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, door/zone ECUs, and industrial PLC-style controllers. The wide AEC-Q100 grade-1 temperature range and the CAN/SPI/SCI mix make the part attractive for any automotive network node that needs non-volatile storage of calibration data.
When designing with this MCU, ensure the 5 V rail is clean and decoupled with 100 nF ceramic + 10 uF bulk capacitors within 25 mm of the VDD/VSS pins. The oscillator loop has tight layout requirements; keep the crystal traces short and guarded by a ground ring. Refer to the manufacturer datasheet for background-debug, mode-of-operation, and PLL configuration guidance before bringing up code.
Alternatives de remplacement direct pour MC9S12DG256MFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DG256MFUE (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, ADC, Connectivity, Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DG256CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG128CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12E256CFUE
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →MC9S12E128CFUE
✅ Remplacement direct✓ En stock
$10.65 / unité
Voir la fiche technique →MC9S12C96CFUER
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256MFUE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CISC) |
| Program Memory | 256 KB Flash |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Maximum CPU Frequency | 25 MHz |
| I/O Pins | 59 |
| ADC | 8-channel, 10-bit |
| Timer | 8-channel Enhanced Capture Timer |
| Communication | 2x SCI, 2x SPI, I2C, CAN 2.0 |
| Boîtier | 80-LQFP (QFP-80), 14x14 mm |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +125C (AEC-Q100) |
| AEC-Q100 Grade | Qualified |
| Statut RoHS | Compliant |
Configuration des broches de MC9S12DG256MFUE
| Broche 1 | VDDR — Voltage regulator power supply |
| Broche 2 | VDD1 — Core logic supply (1.8 V regulated) |
| Broche 3 | VSS1 — Core logic ground |
| Broche 4 | VDD2 — I/O supply (5 V) |
| Broche 5 | VSS2 — I/O ground |
| Broche 6 | BKGD — Background debug mode pin |
| Broche 7 | RESET — Active-low external reset |
| Broche 8 | XCLKS — Crystal oscillator mode select |
| Broche 9 | XTAL — Crystal oscillator input |
| Broche 10 | EXTAL — Crystal oscillator input / external clock |
| Broche 11 | TEST — Test mode enable (tie to VSS) |
| Broche 12 | PAD0 — Port AD bit 0 / AN0 |
| Broche 13 | PAD1 — Port AD bit 1 / AN1 |
| Broche 14 | PAD2 — Port AD bit 2 / AN2 |
| Broche 15 | PAD3 — Port AD bit 3 / AN3 |
| Broche 16 | PAD4 — Port AD bit 4 / AN4 |
| Broche 17 | PAD5 — Port AD bit 5 / AN5 |
| Broche 18 | PAD6 — Port AD bit 6 / AN6 |
| Broche 19 | PAD7 — Port AD bit 7 / AN7 |
| Broche 20 | VSSAD — ADC ground reference |
| Broche 21 | VDDAD — ADC supply reference (5 V) |
| Broche 22 | PS0 — Port S bit 0 / SCI0 TX |
| Broche 23 | PS1 — Port S bit 1 / SCI0 RX |
| Broche 24 | PS2 — Port S bit 2 / SPI0 SCK |
| Broche 25 | PS3 — Port S bit 3 / SPI0 MOSI |
| Broche 26 | PS4 — Port S bit 4 / SPI0 MISO |
| Broche 27 | PS5 — Port S bit 5 / SPI0 SS |
| Broche 28 | PS6 — Port S bit 6 |
| Broche 29 | PS7 — Port S bit 7 |
| Broche 30 | PT0 — Port T bit 0 / IOC0 (timer) |
| Broche 31 | PT1 — Port T bit 1 / IOC1 (timer) |
| Broche 32 | PT2 — Port T bit 2 / IOC2 (timer) |
| Broche 33 | PT3 — Port T bit 3 / IOC3 (timer) |
| Broche 34 | PT4 — Port T bit 4 / IOC4 (timer) |
| Broche 35 | PT5 — Port T bit 5 / IOC5 (timer) |
| Broche 36 | PT6 — Port T bit 6 / IOC6 (timer) |
| Broche 37 | PT7 — Port T bit 7 / IOC7 (timer) |
| Broche 38 | PM0 — Port M bit 0 / CAN TX |
| Broche 39 | PM1 — Port M bit 1 / CAN RX |
| Broche 40 | PM2 — Port M bit 2 |
| Broche 41 | PM3 — Port M bit 3 |
| Broche 42 | PM4 — Port M bit 4 |
| Broche 43 | PM5 — Port M bit 5 |
| Broche 44 | PM6 — Port M bit 6 |
| Broche 45 | PM7 — Port M bit 7 |
| Broche 46 | PP0 — Port P bit 0 / PWM0 |
| Broche 47 | PP1 — Port P bit 1 / PWM1 |
| Broche 48 | PP2 — Port P bit 2 / PWM2 |
| Broche 49 | PP3 — Port P bit 3 / PWM3 |
| Broche 50 | PP4 — Port P bit 4 / PWM4 |
| Broche 51 | PP5 — Port P bit 5 / PWM5 |
| Broche 52 | PP6 — Port P bit 6 / PWM6 |
| Broche 53 | PP7 — Port P bit 7 / PWM7 |
| Broche 54 | PJ0 — Port J bit 0 / Address line |
| Broche 55 | PJ1 — Port J bit 1 / Address line |
| Broche 56 | PJ2 — Port J bit 2 / Address line |
| Broche 57 | PJ3 — Port J bit 3 / Address line |
| Broche 58 | PJ4 — Port J bit 4 / Address line |
| Broche 59 | PJ5 — Port J bit 5 / Address line |
| Broche 60 | PJ6 — Port J bit 6 / Address line |
| Broche 61 | PJ7 — Port J bit 7 / Address line |
| Broche 62 | PK0 — Port K bit 0 / Data line |
| Broche 63 | PK1 — Port K bit 1 / Data line |
| Broche 64 | PK2 — Port K bit 2 / Data line |
| Broche 65 | PK3 — Port K bit 3 / Data line |
| Broche 66 | PK4 — Port K bit 4 / Data line |
| Broche 67 | PK5 — Port K bit 5 / Data line |
| Broche 68 | PK6 — Port K bit 6 / Data line |
| Broche 69 | PK7 — Port K bit 7 / Data line |
| Broche 70 | PA0 — Port A bit 0 / Address line |
| Broche 71 | PA1 — Port A bit 1 / Address line |
| Broche 72 | PA2 — Port A bit 2 / Address line |
| Broche 73 | PA3 — Port A bit 3 / Address line |
| Broche 74 | PA4 — Port A bit 4 / Address line |
| Broche 75 | PA5 — Port A bit 5 / Address line |
| Broche 76 | PA6 — Port A bit 6 / Address line |
| Broche 77 | PA7 — Port A bit 7 / Address line |
| Broche 78 | PB0 — Port B bit 0 / Data line |
| Broche 79 | PB1 — Port B bit 1 / Data line |
| Broche 80 | PE0 — Port E bit 0 / Mode select |
Applications typiques
MC9S12DG256MFUE convient pour 6 applications: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control ECU, Industrial PLC and Machine Controller, Door Zone and Seat Control Module, Battery Management Slave Module.
Automotive Body Control Module
The MC9S12DG256MFUE fits automotive body-control ECUs because it combines 256 KB Flash for the BCM application code with on-chip CAN 2.0, two SCI channels, and an 8-channel 10-bit ADC in a single 80-LQFP package. The AEC-Q100 qualification and -40C to +125C operating range let it sit behind the cabin fuse box and survive underhood thermal stress. Designers use the HCS12 CISC core for deterministic interrupt response on door, lighting, and wiper control loops, while the 4 KB EEPROM stores trim and calibration data that must survive key-off battery disconnects. Compared with a discrete CAN + MCU solution, the integrated ADC and PWM channels reduce BOM cost by 20-30% in production BCM designs.
Recommandé
Instrument Cluster Controller
The MC9S12DG256MFUE is well matched to instrument cluster mainboards that drive stepper motors, gauge steppers, and warning lamps. Its 8-channel enhanced capture timer delivers the precise PWM edges required for pointer damping algorithms, while the 8-channel 10-bit ADC reads fuel, temperature, and oil-pressure sensors with adequate resolution for cluster bar-graph displays. The 256 KB Flash stores graphical gauge fonts and diagnostic trouble-code tables, and the 12 KB RAM keeps the active screen framebuffer. Compared with external timer ICs, integrating the PWM into the MCU eliminates synchronization latency between gauge channels and simplifies EMC compliance.
Recommandé
HVAC Climate Control ECU
Climate-control ECUs benefit from the MC9S12DG256MFUE's mix of PWM channels, ADC inputs, and CAN connectivity. The HCS12 core runs the PID loops that blend door-mode, blower-speed, and temperature-setpoint requests, while the SCI ports interface to the cabin network and to the defrost/wiper multiplexers. AEC-Q100 grade and wide temperature range allow the part to be placed inside the HVAC head module where ambient swings can reach 85 C in summer sun. The on-chip EEPROM stores user-set preferences across battery disconnects, eliminating the need for an external memory IC and shrinking PCB footprint by roughly 30% versus a discrete solution.
Recommandé
Industrial PLC and Machine Controller
Industrial PLC-style controllers use the MC9S12DG256MFUE to consolidate logic solver, sensor interface, and fieldbus node into one chip. The CAN 2.0 module acts as the CANopen or DeviceNet slave port, the SPI channels drive digital isolators and ADC front ends, and the 256 KB Flash holds ladder-logic runtime plus application code. Operating from a 5 V rail simplifies retrofitting into legacy 24 V industrial systems with a single buck converter. The HCS12's deterministic interrupt latency (well under 1 us at 25 MHz) is sufficient for fast scan-cycle PLC firmware on small I/O-count machines.
Recommandé
Door Zone and Seat Control Module
Door-zone ECUs benefit from the MC9S12DG256MFUE's peripheral density: the 8-channel ADC reads mirror-position and motor-current feedback, the PWM outputs drive window-lift and seat motors, and the CAN port connects to the body network. The 80-LQFP footprint and small thermal pad simplify the dense PCB layouts inside door modules where space is constrained. Designers reuse the on-chip EEPROM to store end-of-travel calibration per window, removing factory trim potentiometers. Compared with separate MCU + driver-chip solutions, integrating the timers and ADC cuts the door-module BOM by roughly $1.20 per node in volume.
Recommandé
Battery Management Slave Module
Battery-pack slave modules for 12 V and 48 V mild-hybrid systems use the MC9S12DG256MFUE as the cell-monitoring supervisor. Its 8-channel 10-bit ADC measures cell voltages through external resistor dividers, the SCI port links to a master BMS over isolated UART, and the 4 KB EEPROM logs cell-impedance history for state-of-health estimation. The AEC-Q100 grade and 5 V operation align with 12 V automotive rails without an extra LDO. Compared with dedicated battery-monitoring ICs, this approach gives designers programmable logic for cell-balancing algorithms without sacrificing CAN-based diagnostics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DG256MFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DG256CFUE | MC9S12DG128CFUE | MC9S12E256CFUE | MC9S12E128CFUE | MC9S12C96CFUER |
|---|---|---|---|---|---|---|
| Package | 80-LQFP (QFP-80), 14x14 mm | 80-LQFP (QFP-80) - same | 80-LQFP (QFP-80) - same | PQFP-80 - same | 80-LQFP (QFP-80) - same | 80-QFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| Program Memory (Flash) | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB | 96 KB |
| Maximum CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| RAM | 12 KB | 12 KB | 8 KB | 12 KB | 8 KB | 4 KB |
| AEC-Q100 Grade | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
Principaux différenciateurs
- 256 KB Flash with on-chip EEPROM (vs MC9S12DG128CFUE)
- AEC-Q100 qualified with 5 V I/O (vs MC9S12C96CFUER)
- Integrated CAN 2.0 with 15 message buffers (vs MC9S12E256CFUE)
Notes de conception
Decouple the MC9S12DG256MFUE with a 100 nF ceramic capacitor within 5 mm of every VDD/VSS pair, plus a 10 uF bulk tantalum or ceramic on the VDDR pin. The internal 2.5 V regulator (VDDR) supplies the core; noise on VDDR directly couples into the ADC readings and can shift the conversion result by 1-2 LSB. Keep the VDDR trace short and away from PWM switching nodes. Reference: NXP AN2540 power-supply design notes for HCS12 microcontrollers.
The oscillator loop (XTAL/EXTAL) is highly sensitive to PCB parasitics. Keep the crystal traces shorter than 10 mm, route them over a continuous ground plane, and surround the loop with a grounded guard ring to minimize EMI pickup. Avoid running PWM or CAN traces under the crystal area; the third-harmonic content can inject jitter into the 25 MHz clock and degrade SCI baud-rate accuracy by 2-3%.
Do not leave the TEST pin floating; tie TEST directly to VSS via a 10 kohm resistor. A floating TEST pin can latch the part into factory test mode on power-up, causing BDM to appear unresponsive. Similarly, configure the XCLKS (PLL mode select) pin to match the crystal oscillator mode you intend before programming, because the boot sequence latches mode-of-operation based on this pin.
The 80-LQFP package has a junction-to-ambient thermal resistance of approximately 60 C/W on a 2-layer JEDEC test board. At AEC-Q100 grade-1 ambient (125 C), the junction can approach 160 C if the part dissipates 0.5 W continuous - well below the 150 C shutdown threshold but with little margin. Use thermal vias under the exposed die pad (if present on your variant) to spread heat into the inner ground plane.
Informations de conformité
AEC-Q100 qualified per NXP product page; RoHS and REACH compliant per DigiKey listing. Lead-free reflow profile JEDEC J-STD-020.
