MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP
N.º da peça: MC9S12DG256MFUE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.1 | $201,00 |
| 100 | $17.85 | $1.785,00 |
| 500 | $16.2 | $8.100,00 |
| 1.000 | $14.95 | $14.950,00 |
MC9S12DG256MFUE Visão geral
A CISC microcontroller (Complex Instruction Set Computer) is a CPU architecture that uses a rich, variable-length instruction set optimized for code density and per-instruction work; the HCS12 family is the 16-bit evolution of the HC08 line, retaining the same M68HC12 instruction set while adding a wider 16-bit datapath, an enhanced indexed addressing mode, and a higher bus bandwidth. Microcontrollers sit at the lowest tier of the compute hierarchy (microcontroller -> embedded processor -> MPU) and are the workhorse of real-time control loops where latency, determinism, and integration matter more than raw throughput.
Key features include BDM (Background Debug Mode) and a serial monitor for non-intrusive in-circuit debugging, an external bus interface for memory expansion, an XGate co-processor channel on related family members, and a 32-bit timer for precise event timing. The on-chip EEPROM simplifies parameter storage, while the flash controller supports in-application reprogramming for field firmware updates. The CAN 2.0 A/B module includes 15 message buffers and hardware filtering for offloading the CPU in OSEK/VDX-based automotive stacks.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, door/zone ECUs, and industrial PLC-style controllers. The wide AEC-Q100 grade-1 temperature range and the CAN/SPI/SCI mix make the part attractive for any automotive network node that needs non-volatile storage of calibration data.
When designing with this MCU, ensure the 5 V rail is clean and decoupled with 100 nF ceramic + 10 uF bulk capacitors within 25 mm of the VDD/VSS pins. The oscillator loop has tight layout requirements; keep the crystal traces short and guarded by a ground ring. Refer to the manufacturer datasheet for background-debug, mode-of-operation, and PLL configuration guidance before bringing up code.
Alternativas drop-in para MC9S12DG256MFUE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12DG256MFUE (mesmo formato e footprint) — diferindo em Operating Temperature, Package, ADC, Connectivity, Core Processor.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12DG256CFUE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG128CFUE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12E256CFUE
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →MC9S12E128CFUE
✅ Drop-In✓ Em estoque
$10.65 / unidade
Ver ficha técnica →MC9S12C96CFUER
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG256MFUE Classificações máximas e características elétricas
| Core | HCS12 (16-bit CISC) |
| Program Memory | 256 KB Flash |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Maximum CPU Frequency | 25 MHz |
| I/O Pins | 59 |
| ADC | 8-channel, 10-bit |
| Timer | 8-channel Enhanced Capture Timer |
| Communication | 2x SCI, 2x SPI, I2C, CAN 2.0 |
| Encapsulamento | 80-LQFP (QFP-80), 14x14 mm |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +125C (AEC-Q100) |
| AEC-Q100 Grade | Qualified |
| Status RoHS | Compliant |
Configuração de pinos do MC9S12DG256MFUE
| Pino 1 | VDDR — Voltage regulator power supply |
| Pino 2 | VDD1 — Core logic supply (1.8 V regulated) |
| Pino 3 | VSS1 — Core logic ground |
| Pino 4 | VDD2 — I/O supply (5 V) |
| Pino 5 | VSS2 — I/O ground |
| Pino 6 | BKGD — Background debug mode pin |
| Pino 7 | RESET — Active-low external reset |
| Pino 8 | XCLKS — Crystal oscillator mode select |
| Pino 9 | XTAL — Crystal oscillator input |
| Pino 10 | EXTAL — Crystal oscillator input / external clock |
| Pino 11 | TEST — Test mode enable (tie to VSS) |
| Pino 12 | PAD0 — Port AD bit 0 / AN0 |
| Pino 13 | PAD1 — Port AD bit 1 / AN1 |
| Pino 14 | PAD2 — Port AD bit 2 / AN2 |
| Pino 15 | PAD3 — Port AD bit 3 / AN3 |
| Pino 16 | PAD4 — Port AD bit 4 / AN4 |
| Pino 17 | PAD5 — Port AD bit 5 / AN5 |
| Pino 18 | PAD6 — Port AD bit 6 / AN6 |
| Pino 19 | PAD7 — Port AD bit 7 / AN7 |
| Pino 20 | VSSAD — ADC ground reference |
| Pino 21 | VDDAD — ADC supply reference (5 V) |
| Pino 22 | PS0 — Port S bit 0 / SCI0 TX |
| Pino 23 | PS1 — Port S bit 1 / SCI0 RX |
| Pino 24 | PS2 — Port S bit 2 / SPI0 SCK |
| Pino 25 | PS3 — Port S bit 3 / SPI0 MOSI |
| Pino 26 | PS4 — Port S bit 4 / SPI0 MISO |
| Pino 27 | PS5 — Port S bit 5 / SPI0 SS |
| Pino 28 | PS6 — Port S bit 6 |
| Pino 29 | PS7 — Port S bit 7 |
| Pino 30 | PT0 — Port T bit 0 / IOC0 (timer) |
| Pino 31 | PT1 — Port T bit 1 / IOC1 (timer) |
| Pino 32 | PT2 — Port T bit 2 / IOC2 (timer) |
| Pino 33 | PT3 — Port T bit 3 / IOC3 (timer) |
| Pino 34 | PT4 — Port T bit 4 / IOC4 (timer) |
| Pino 35 | PT5 — Port T bit 5 / IOC5 (timer) |
| Pino 36 | PT6 — Port T bit 6 / IOC6 (timer) |
| Pino 37 | PT7 — Port T bit 7 / IOC7 (timer) |
| Pino 38 | PM0 — Port M bit 0 / CAN TX |
| Pino 39 | PM1 — Port M bit 1 / CAN RX |
| Pino 40 | PM2 — Port M bit 2 |
| Pino 41 | PM3 — Port M bit 3 |
| Pino 42 | PM4 — Port M bit 4 |
| Pino 43 | PM5 — Port M bit 5 |
| Pino 44 | PM6 — Port M bit 6 |
| Pino 45 | PM7 — Port M bit 7 |
| Pino 46 | PP0 — Port P bit 0 / PWM0 |
| Pino 47 | PP1 — Port P bit 1 / PWM1 |
| Pino 48 | PP2 — Port P bit 2 / PWM2 |
| Pino 49 | PP3 — Port P bit 3 / PWM3 |
| Pino 50 | PP4 — Port P bit 4 / PWM4 |
| Pino 51 | PP5 — Port P bit 5 / PWM5 |
| Pino 52 | PP6 — Port P bit 6 / PWM6 |
| Pino 53 | PP7 — Port P bit 7 / PWM7 |
| Pino 54 | PJ0 — Port J bit 0 / Address line |
| Pino 55 | PJ1 — Port J bit 1 / Address line |
| Pino 56 | PJ2 — Port J bit 2 / Address line |
| Pino 57 | PJ3 — Port J bit 3 / Address line |
| Pino 58 | PJ4 — Port J bit 4 / Address line |
| Pino 59 | PJ5 — Port J bit 5 / Address line |
| Pino 60 | PJ6 — Port J bit 6 / Address line |
| Pino 61 | PJ7 — Port J bit 7 / Address line |
| Pino 62 | PK0 — Port K bit 0 / Data line |
| Pino 63 | PK1 — Port K bit 1 / Data line |
| Pino 64 | PK2 — Port K bit 2 / Data line |
| Pino 65 | PK3 — Port K bit 3 / Data line |
| Pino 66 | PK4 — Port K bit 4 / Data line |
| Pino 67 | PK5 — Port K bit 5 / Data line |
| Pino 68 | PK6 — Port K bit 6 / Data line |
| Pino 69 | PK7 — Port K bit 7 / Data line |
| Pino 70 | PA0 — Port A bit 0 / Address line |
| Pino 71 | PA1 — Port A bit 1 / Address line |
| Pino 72 | PA2 — Port A bit 2 / Address line |
| Pino 73 | PA3 — Port A bit 3 / Address line |
| Pino 74 | PA4 — Port A bit 4 / Address line |
| Pino 75 | PA5 — Port A bit 5 / Address line |
| Pino 76 | PA6 — Port A bit 6 / Address line |
| Pino 77 | PA7 — Port A bit 7 / Address line |
| Pino 78 | PB0 — Port B bit 0 / Data line |
| Pino 79 | PB1 — Port B bit 1 / Data line |
| Pino 80 | PE0 — Port E bit 0 / Mode select |
Aplicações típicas
MC9S12DG256MFUE é adequado para 6 aplicaçãos: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control ECU, Industrial PLC and Machine Controller, Door Zone and Seat Control Module, Battery Management Slave Module.
Automotive Body Control Module
The MC9S12DG256MFUE fits automotive body-control ECUs because it combines 256 KB Flash for the BCM application code with on-chip CAN 2.0, two SCI channels, and an 8-channel 10-bit ADC in a single 80-LQFP package. The AEC-Q100 qualification and -40C to +125C operating range let it sit behind the cabin fuse box and survive underhood thermal stress. Designers use the HCS12 CISC core for deterministic interrupt response on door, lighting, and wiper control loops, while the 4 KB EEPROM stores trim and calibration data that must survive key-off battery disconnects. Compared with a discrete CAN + MCU solution, the integrated ADC and PWM channels reduce BOM cost by 20-30% in production BCM designs.
Recomendado
Instrument Cluster Controller
The MC9S12DG256MFUE is well matched to instrument cluster mainboards that drive stepper motors, gauge steppers, and warning lamps. Its 8-channel enhanced capture timer delivers the precise PWM edges required for pointer damping algorithms, while the 8-channel 10-bit ADC reads fuel, temperature, and oil-pressure sensors with adequate resolution for cluster bar-graph displays. The 256 KB Flash stores graphical gauge fonts and diagnostic trouble-code tables, and the 12 KB RAM keeps the active screen framebuffer. Compared with external timer ICs, integrating the PWM into the MCU eliminates synchronization latency between gauge channels and simplifies EMC compliance.
Recomendado
HVAC Climate Control ECU
Climate-control ECUs benefit from the MC9S12DG256MFUE's mix of PWM channels, ADC inputs, and CAN connectivity. The HCS12 core runs the PID loops that blend door-mode, blower-speed, and temperature-setpoint requests, while the SCI ports interface to the cabin network and to the defrost/wiper multiplexers. AEC-Q100 grade and wide temperature range allow the part to be placed inside the HVAC head module where ambient swings can reach 85 C in summer sun. The on-chip EEPROM stores user-set preferences across battery disconnects, eliminating the need for an external memory IC and shrinking PCB footprint by roughly 30% versus a discrete solution.
Recomendado
Industrial PLC and Machine Controller
Industrial PLC-style controllers use the MC9S12DG256MFUE to consolidate logic solver, sensor interface, and fieldbus node into one chip. The CAN 2.0 module acts as the CANopen or DeviceNet slave port, the SPI channels drive digital isolators and ADC front ends, and the 256 KB Flash holds ladder-logic runtime plus application code. Operating from a 5 V rail simplifies retrofitting into legacy 24 V industrial systems with a single buck converter. The HCS12's deterministic interrupt latency (well under 1 us at 25 MHz) is sufficient for fast scan-cycle PLC firmware on small I/O-count machines.
Recomendado
Door Zone and Seat Control Module
Door-zone ECUs benefit from the MC9S12DG256MFUE's peripheral density: the 8-channel ADC reads mirror-position and motor-current feedback, the PWM outputs drive window-lift and seat motors, and the CAN port connects to the body network. The 80-LQFP footprint and small thermal pad simplify the dense PCB layouts inside door modules where space is constrained. Designers reuse the on-chip EEPROM to store end-of-travel calibration per window, removing factory trim potentiometers. Compared with separate MCU + driver-chip solutions, integrating the timers and ADC cuts the door-module BOM by roughly $1.20 per node in volume.
Recomendado
Battery Management Slave Module
Battery-pack slave modules for 12 V and 48 V mild-hybrid systems use the MC9S12DG256MFUE as the cell-monitoring supervisor. Its 8-channel 10-bit ADC measures cell voltages through external resistor dividers, the SCI port links to a master BMS over isolated UART, and the 4 KB EEPROM logs cell-impedance history for state-of-health estimation. The AEC-Q100 grade and 5 V operation align with 12 V automotive rails without an extra LDO. Compared with dedicated battery-monitoring ICs, this approach gives designers programmable logic for cell-balancing algorithms without sacrificing CAN-based diagnostics.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12DG256MFUE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12DG256CFUE | MC9S12DG128CFUE | MC9S12E256CFUE | MC9S12E128CFUE | MC9S12C96CFUER |
|---|---|---|---|---|---|---|
| Package | 80-LQFP (QFP-80), 14x14 mm | 80-LQFP (QFP-80) - same | 80-LQFP (QFP-80) - same | PQFP-80 - same | 80-LQFP (QFP-80) - same | 80-QFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| Program Memory (Flash) | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB | 96 KB |
| Maximum CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| RAM | 12 KB | 12 KB | 8 KB | 12 KB | 8 KB | 4 KB |
| AEC-Q100 Grade | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
Principais diferenciais
- 256 KB Flash with on-chip EEPROM (vs MC9S12DG128CFUE)
- AEC-Q100 qualified with 5 V I/O (vs MC9S12C96CFUER)
- Integrated CAN 2.0 with 15 message buffers (vs MC9S12E256CFUE)
Notas de projeto
Decouple the MC9S12DG256MFUE with a 100 nF ceramic capacitor within 5 mm of every VDD/VSS pair, plus a 10 uF bulk tantalum or ceramic on the VDDR pin. The internal 2.5 V regulator (VDDR) supplies the core; noise on VDDR directly couples into the ADC readings and can shift the conversion result by 1-2 LSB. Keep the VDDR trace short and away from PWM switching nodes. Reference: NXP AN2540 power-supply design notes for HCS12 microcontrollers.
The oscillator loop (XTAL/EXTAL) is highly sensitive to PCB parasitics. Keep the crystal traces shorter than 10 mm, route them over a continuous ground plane, and surround the loop with a grounded guard ring to minimize EMI pickup. Avoid running PWM or CAN traces under the crystal area; the third-harmonic content can inject jitter into the 25 MHz clock and degrade SCI baud-rate accuracy by 2-3%.
Do not leave the TEST pin floating; tie TEST directly to VSS via a 10 kohm resistor. A floating TEST pin can latch the part into factory test mode on power-up, causing BDM to appear unresponsive. Similarly, configure the XCLKS (PLL mode select) pin to match the crystal oscillator mode you intend before programming, because the boot sequence latches mode-of-operation based on this pin.
The 80-LQFP package has a junction-to-ambient thermal resistance of approximately 60 C/W on a 2-layer JEDEC test board. At AEC-Q100 grade-1 ambient (125 C), the junction can approach 160 C if the part dissipates 0.5 W continuous - well below the 150 C shutdown threshold but with little margin. Use thermal vias under the exposed die pad (if present on your variant) to spread heat into the inner ground plane.
Informações de conformidade
AEC-Q100 qualified per NXP product page; RoHS and REACH compliant per DigiKey listing. Lead-free reflow profile JEDEC J-STD-020.
