MPC8250AVRIHBC - PowerQUICC II MPC82xx 200MHz MPU BGA-516 | NXP
MPN: MPC8250AVRIHBC ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.75 | $12,375.00 |
| 1,000 | $21.4 | $21,400.00 |
MPC8250AVRIHBC Overview
A PowerQUICC (Quad Integrated Communications Controller) processor is a specialized MPU that combines a PowerPC CPU core with one or more communications processor modules (CPMs) that offload serial protocol processing from the main core. This architecture - CPU plus CPM - is a member of the broader category of communications microprocessors, which sit within the larger hierarchy of embedded microprocessors, microcontrollers, and ultimately semiconductors. PowerQUICC II devices like the MPC8250 added HiPerMOS7 process technology and dual-RISC CPM architecture compared to PowerQUICC I, delivering higher CPM throughput and lower power per MHz.
Key features of the MPC8250AVRIHBC include integrated Ethernet MACs, ATM support, HDLC/SDLC controllers, a 64-bit system bus, 1.8 V core supply with 3.3 V I/O, and industrial-grade temperature operation to -40C. The 516-ball PBGA exposes full memory controller address/data buses plus dedicated CPM serial pins. The device is supplied in a lead-free plastic BGA compliant with current environmental standards. NXP and authorized distributors still ship this part as a long-life-cycle product for installed-base telecom and industrial customers, even as the broader PowerQUICC II family has transitioned to last-time-buy or obsolete status for many derivatives.
Typical applications for the MPC8250AVRIHBC include multi-channel WAN routers, DSLAM line cards, frame-relay access devices, ATM switches, ISDN modem pools, industrial serial protocol concentrators, and legacy telecommunications infrastructure. The integrated CPM handles up to three fast serial communications controllers (FCC), two multi-channel controllers (MCC), four serial communications controllers (SCC), and two serial management controllers (SMC), which together allow a single MPC8250 to terminate many T1/E1 or fractional T1/E1 channels without burdening the main PowerPC core.
When designing with this device, allocate generous PCB area for the 516-ball PBGA fanout and use at least 6 layers to escape the 1.0 mm pitch BGA. The core requires a clean 1.8 V rail with tight tolerance; a dedicated switching regulator with bulk ceramic decoupling near each VDD/VCC pair is recommended. For thermal management, the exposed die underneath the BGA spreads heat to the PCB, so a continuous ground plane and thermal vias directly beneath the package are essential in still-air enclosures.
This page synthesizes NXP/Freescale datasheet specifications, current distributor pricing, drop-in alternative guidance, and practical design notes not found on a single manufacturer product page.
Drop-in alternatives for MPC8250AVRIHBC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8250AVRIHBC (same form factor and footprint) — differing in Core Architecture, Package Type, Operating Temperature, Process Technology, Integrated Peripherals.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesMPC8250AVRIHBC Maximum Ratings & Electrical Characteristics
| Architecture | PowerPC G2 (PowerQUICC II) |
| Core | PowerPC 32-bit, 1 core |
| Data Bus Width | 64-bit |
| Instruction Set | RISC |
| Core Clock Speed | 200 MHz |
| Supply Voltage (Core) | 1.8 V |
| Supply Voltage (I/O) | 3.3 V |
| Package Type | BGA (Plastic, Lead-Free) |
| Package Code | 516-PBGA |
| Package Dimensions | 27 x 27 mm, 2.25 mm height |
| Ball Pitch | 1.0 mm |
| Pin Count | 516 |
| Operating Temperature Range | -40C to +105C (Industrial) |
| Mounting Type | Surface Mount |
| Family | MPC82xx (PowerQUICC II) |
| Communications Peripherals | FCC, MCC, SCC, SMC controllers (CPM) |
| RoHS Status | Compliant (Lead-Free PBGA) |
MPC8250AVRIHBC 27 x 27 mm, 2.25 mm height Pin Configuration Guide
Pin configuration for MPC8250AVRIHBC (27 x 27 mm, 2.25 mm height package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8250AVRIHBC.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8250AVRIHBC is suitable for 6 applications: Multi-Channel WAN Router, DSLAM Line Card, Frame-Relay / ISDN Access Multiplexer, Industrial Serial Protocol Concentrator, ATM Switch Line Card, Legacy Telecom Infrastructure Maintenance.
Multi-Channel WAN Router
The MPC8250AVRIHBC's integrated PowerQUICC II Communications Processor Module (CPM) handles up to three Fast Communication Controllers (FCC), four Serial Communication Controllers (SCC), and two Serial Management Controllers (SMC) without burdening the main 200 MHz PowerPC core. This makes the part ideal for WAN routers that must terminate multiple T1/E1 or fractional T1 lines simultaneously. The 64-bit system bus and 1.8 V low-power core keep the part efficient in fanless industrial routers. Designers place the device on a 6-layer PCB with a continuous ground plane and dedicated 1.8 V switching regulator. The lead-free 516-PBGA package is drop-in compatible across the MPC8250/MPC8260/MPC8270 family, simplifying inventory and rework.
Recommended
DSLAM Line Card
The MPC8250AVRIHBC supports DSLAM line cards that aggregate many subscriber channels onto an upstream network. The integrated CPM offloads ATM AAL2/AAL5 segmentation and reassembly, HDLC framing for VPI/VCI mapping, and Ethernet MAC handling for the uplink - all without consuming CPU cycles on the PowerPC core. Operating at 200 MHz with a 64-bit system bus, the device can drive 64-bit SDRAM directly while managing dozens of ATM channels. The industrial -40C to +105C temperature range supports outdoor cabinet deployments, and the lead-free 516-PBGA package meets RoHS compliance. The wide 1.8 V core voltage simplifies power-tree design versus higher-voltage legacy MPUs.
Recommended
Frame-Relay / ISDN Access Multiplexer
Frame-relay and ISDN access multiplexers benefit from the MPC8250AVRIHBC's multiple SCC channels and HDLC support. A single MPC8250 can terminate up to four independent HDLC links while maintaining the main PowerPC core for routing table management. The integrated CPM's RISC-based microsequencer handles flag insertion, CRC-16/32, and zero-bit stuffing in hardware, freeing the host CPU for higher-layer processing. With its 64-bit system bus and 516-PBGA footprint, the part fits cleanly into mid-density multiplexer designs that need to support dozens of subscriber ports per line card. Designers should allocate a dedicated 3.3 V LDO for the I/O ring and isolate the 1.8 V core plane.
Recommended
Industrial Serial Protocol Concentrator
Industrial serial concentrators aggregate Modbus, Profibus, DNP3, and other serial fieldbus protocols into Ethernet for SCADA systems. The MPC8250AVRIHBC's mix of SCC, SMC, and FCC channels maps well to multi-protocol serial aggregation, with the PowerPC core running the SCADA gateway stack. The -40C to +105C industrial temperature grade allows deployment in unheated outdoor enclosures and factory floors. The 1.8 V core voltage keeps power dissipation moderate for fanless industrial cabinets, and the 64-bit bus eases memory bandwidth for buffering time-series data. Lead-free 516-PBGA construction supports current environmental regulations. Designers should reserve dedicated JTAG pins for in-field firmware updates.
Recommended
ATM Switch Line Card
The MPC8250AVRIHBC's ATM AAL support and multiple FCC/SCC channels make it a strong fit for ATM switch line cards that must handle cell segmentation, reassembly, and congestion control at line-rate. Operating at 200 MHz with a 64-bit system bus, the part can sustain back-to-back ATM cell bursts without dropping frames. The on-chip CPM handles up to 256 simultaneous virtual circuits, which is more than enough for a single T1/E1 trunk aggregation card. The 516-PBGA package and 1.0 mm ball pitch allow dense switch fabric designs, though designers must use 6+ layer PCBs and dedicated thermal vias beneath the BGA to dissipate the heat from continuous full-duplex operation.
Recommended
Legacy Telecom Infrastructure Maintenance
Telecom carriers and industrial operators with installed PowerQUICC II systems use the MPC8250AVRIHBC for board-level repair and field replacements. The part's last-time-buy status means new production runs may not be available after 2027, so operators stockpile inventory now. Rochester Electronics and authorized distributors still ship NXP factory-sealed stock for repair use. In maintenance scenarios, the 516-PBGA footprint simplifies board-level replacement - existing PCB land patterns, decoupling networks, and JTAG fixtures work without modification. The 1.8 V core, 3.3 V I/O, and 200 MHz operation are well-documented, allowing repair technicians to swap units reliably in field service vans.
Recommended
Recommended Products Summary
Engineering reference data for MPC8250AVRIHBC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8250ACVRIHBC | MPC8250AZQIHBC | MPC8250VUPIBC | MPC8270ZQMIBA | MPC8270CVRMIBA |
|---|---|---|---|---|---|---|
| Package | 516-PBGA (27x27 mm, 1.0 mm pitch) | 516-PBGA (27x27 mm, 1.0 mm pitch) - same | 516-PBGA (27x27 mm, 1.0 mm pitch) - same | 516-PBGA (27x27 mm, 1.0 mm pitch) - same | 516-PBGA (27x27 mm, 1.0 mm pitch) - same | 516-PBGA (27x27 mm, 1.0 mm pitch) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Architecture / Family | PowerPC G2 / PowerQUICC II (MPC8250) | PowerPC G2 / PowerQUICC II (MPC8250) | PowerPC G2 / PowerQUICC II (MPC8250) | PowerPC G2 / PowerQUICC II (MPC8250) | PowerPC G2_LE / PowerQUICC II next-gen (MPC8270) | PowerPC G2_LE / PowerQUICC II next-gen (MPC8270) |
| System Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
| RoHS Compliance | Lead-free / RoHS compliant | Lead-free / RoHS compliant | Lead-free / RoHS compliant | Lead-free / RoHS compliant | Lead-free / RoHS compliant | Lead-free / RoHS compliant |
Key Differentiators
- True PowerQUICC II with integrated 200 MHz PowerPC G2 core and full CPM (vs MPC8247CVRTIEA)
- Same 516-PBGA footprint as MPC8270 family (vs MPC8270ZQMIBA)
- Industrial -40C to +105C temperature range (vs MPC8250AZQIHBC)
- 64-bit system bus at 200 MHz (vs MPC8250ACVRIHBC)
Design Notes
The 516-PBGA at 1.0 mm pitch requires at least 6 PCB layers for reliable fanout. Use 0.5 oz copper on outer layers and 1 oz on inner power/ground planes. Place the 1.8 V core plane and 3.3 V I/O plane as adjacent inner layers to maximize high-frequency decoupling. Route address and data signals on the outer layers with matched length matching within +/- 50 mils for SDRAM interface. Microvias-in-pad are recommended for the BGA fanout to reduce parasitic inductance on power balls.
The MPC8250AVRIHBC dissipates significant power under continuous CPM operation, particularly with multiple FCC channels active. Estimate: P_total approx V_core * I_core + V_IO * I_IO. Place a continuous ground plane directly beneath the BGA, with a thermal-via array of at least 9 vias per power ball cluster (0.3 mm drill, 1.0 mm pitch) tied to the inner ground plane. For fanless industrial enclosures, ensure ambient temperature inside the chassis stays below 85C to keep junction temperature under 105C.
Use a dedicated switching regulator for the 1.8 V core rail with +/- 3% tolerance and at least 20 mV peak-to-peak ripple. Place bulk ceramic capacitors (22 uF X5R) and high-frequency decoupling (0.1 uF + 10 nF) within 3 mm of each VDD ball cluster. The 3.3 V I/O rail can share a bus with other peripheral devices, but isolate it from the 1.8 V core plane with a ferrite bead to prevent digital switching noise coupling into the analog PLL supply.
Do not assume the 516-PBGA footprint across MPC8250, MPC8260, and MPC8270 is a guaranteed drop-in: while the package outline is identical, certain balls (especially CPM serial pins and JTAG pins) differ between families. Verify against the specific datasheet pin map before designing a PCB that accepts both families. Also note that the silicon revision encoded in the mask set differs across -AVR/-ACVR/-VUPI suffixes; firmware boot ROM behavior may vary slightly.
Keep the JTAG chain (TCK, TMS, TDI, TDO, TRST) isolated from high-speed data bus signals by at least 3x the trace spacing. Place a 33 ohm series resistor on each JTAG signal near the MPC8250 to dampen reflections. Route the system clock (PCI_SYNC_IN or equivalent) with controlled impedance (50 ohm) and length-matching, with a clean source termination. Avoid routing clock signals across plane splits.
Compliance Information
Lead-free PBGA package per NXP product page. RoHS and REACH compliant. Not AEC-Q100 qualified (industrial/telecom MPU, not automotive). Halogen-free status not explicitly stated in verified web data - set to unknown.
