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NXP Semiconductors

MRF18085BLSR3 - 85W 26V 1.93-1.99GHz RF Power MOSFET | NXP

Teilenummer: MRF18085BLSR3 ⚠ Letzte Bestellmöglichkeit
Auf Lager Versand in 1–3 Werktagen
26 V (typical) Vdss NI-780, CASE 465-06, STYLE 1 Package 1930 MHz to 1990 MHz Speed
Ab $25.4 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-15
Mengenpreise
Menge Stückpreis Gesamt
1 $33.88 $33,88
10 $32.45 $324,50
100 $30.1 $3.010,00
500 $27.85 $13.925,00
1.000 $25.4 $25.400,00
ℹ️ Alle Preise sind in USD

MRF18085BLSR3 Übersicht

The NXP MRF18085BLSR3 is an 85 W, 26 V lateral N-channel enhancement-mode RF power MOSFET designed for GSM and GSM EDGE base station applications from 1930 to 1990 MHz. Housed in the NI-780 ceramic-metal hermetic package (CASE 465-06, STYLE 1), it is also suitable for TDMA, CDMA, and multicarrier amplifier applications. Key electrical parameters include 85 W output power, 26 V typical drain supply, ~273 W maximum dissipation capability, and operation across the 1930–1990 MHz band.

An RF power MOSFET is a lateral metal-oxide-semiconductor field-effect transistor optimized for high-frequency, high-power operation. Compared with earlier bipolar RF transistors, lateral MOSFETs offer higher gain, better thermal stability, and easier broadband impedance matching. MRF18085BLSR3 belongs to the NXP (formerly Motorola/Freescale) RF MOSFET family aimed at cellular base-station power amplifiers, sitting within the broader hierarchy: RF power transistor → RF power MOSFET → base-station PA device → wireless infrastructure semiconductor.

Differentiating features include high power density at 1.93–1.99 GHz, integrated ESD protection structure, gold metallization for high reliability, ceramic-metal hermetic NI-780 package for low thermal resistance, and a high breakdown voltage tolerant of 26 V supply operation. The lateral MOSFET architecture supports broadband matching and simplifies PCB-level amplifier design.

Architecturally, the device uses a lateral N-channel enhancement-mode MOSFET structure with a gate length tuned for the 2 GHz cellular band. The ceramic NI-780 package provides a low-inductance, low-thermal-resistance path for high-power RF operation, while the metal-sealed cofired ceramic body offers hermeticity required for telecom-grade reliability.

Typical applications include GSM/EDGE base-station power amplifiers at 1.93–1.99 GHz, TDMA and CDMA driver or final-stage amplifiers, multicarrier cellular amplifiers, and other wireless infrastructure RF power stages requiring high gain and high efficiency at UHF frequencies.

When designing with the MRF18085BLSR3, ensure adequate RF heatsinking via the package flange and use proper low-loss matching networks with sufficient DC blocking on input and output. Pay close attention to device bias sequencing to avoid exceeding the maximum rated drain voltage.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate availability, replacement options, and application fit for the MRF18085BLSR3.

Drop-in-Alternativen für MRF18085BLSR3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MRF18085BLR3

✅ Drop-In
📦 NI-780 (CASE 465-06)
same NI-780 family, identical 85W/26V/1930-1990MHz spec, minor suffix variation per datasheet

📋 Referenzalternative (nicht im Katalog)

MRF18085B

✅ Drop-In
📦 NI-780 (CASE 465-06)
same die, base part number in MRF18085 family, NI-780 package per datasheet

📋 Referenzalternative (nicht im Katalog)

MRF18085BR3

✅ Drop-In
📦 NI-780 (CASE 465-06)
same die, R3 tape-and-reel variant in MRF18085 family, NI-780 package per datasheet

📋 Referenzalternative (nicht im Katalog)

MRF18085BLSR3 Grenzwerte & elektrische Eigenschaften

Transistortyp RF Power MOSFET, N-Channel, Lateral, Enhancement-Mode
Frequency Range 1930 MHz to 1990 MHz
Output Power 85 W (typical)
Drain Supply Voltage (VDD) 26 V (typical)
Maximum Power Dissipation 273 W (absolute maximum)
Configuration Single, N-Channel
Surface Mount No (flange-mount NI-780 package)
Gehäuse / Bauform NI-780, CASE 465-06, STYLE 1
Package Body Material Ceramic, metal-sealed cofired
Terminal Form Flat (flange)
Transistor Element Material Silicon
Application GSM / GSM EDGE base station PA, TDMA, CDMA, multicarrier amplifiers
Montageart Flange / Chassis Mount

MRF18085BLSR3 Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 RF Input / Gate — RF input / gate bias (per CASE 465-06 STYLE 1 mechanical drawing)
Pin 2 Drain — Drain supply, 26 V typical
Pin 3 RF Output — RF output (drain RF path)
Pin 4 Flange / Ground — Mounting flange serves as thermal path and RF/DC ground

Sicherer Arbeitsbereich - MRF18085BLSR3

DC-Dauerbetrieb

Typische Anwendungen

MRF18085BLSR3 ist geeignet für 6 Anwendungs: GSM/EDGE Base Station Power Amplifier, TDMA Cellular Base Station PA, CDMA Cellular Infrastructure Amplifier, Multicarrier Power Amplifier, Wireless Infrastructure RF Driver Stage, Legacy Base Station Repair / Replacement.

🌐

GSM/EDGE Base Station Power Amplifier

The MRF18085BLSR3 delivers 85 W output power across 1930–1990 MHz with a 26 V drain supply, matching the requirements of GSM and GSM EDGE base-station PA final stages. Its high power density and lateral N-channel enhancement-mode architecture support linear EDGE modulation with adequate gain and efficiency margins. The NI-780 ceramic flange package provides low thermal resistance for continuous base-station duty cycles. According to the datasheet, the part is optimized specifically for this band, ensuring low memory effects and predictable ACLR performance when properly matched.

📡

TDMA Cellular Base Station PA

TDMA systems require robust RF power transistors capable of handling high peak-to-average ratios at 1.9 GHz. The MRF18085BLSR3's 273 W maximum dissipation rating and 85 W CW-rated output provide thermal and electrical margin for TDMA burst profiles. Per the datasheet, the device is explicitly listed as suitable for TDMA applications in addition to GSM/EDGE. Its ceramic-metal hermetic NI-780 package ensures long-term reliability in outdoor telecom equipment exposed to wide temperature swings.

📶

CDMA Cellular Infrastructure Amplifier

CDMA base-station power amplifiers require linearity and wideband frequency response near 1.9–2.0 GHz. The MRF18085BLSR3 supports CDMA amplification per its datasheet application listing, with the lateral MOSFET structure providing flat gain across the 60 MHz operating window. Designers typically operate it at backed-off power levels to meet ACPR requirements while leveraging the 85 W CW ceiling for peak envelope handling. The NI-780 flange mount is compatible with standard CDMA PA heatsink assemblies.

🌐

Multicarrier Power Amplifier

Multicarrier amplifier applications stack multiple modulated carriers into a single RF chain, demanding high linearity and high peak power. The MRF18085BLSR3's 85 W rated output and 26 V drain operation give headroom for combining several carriers while maintaining low intermodulation distortion. According to the datasheet, the part is qualified for multicarrier amplifier use. Its NI-780 package's low thermal resistance supports the continuous high dissipation typical of multicarrier PAs.

🛰️

Wireless Infrastructure RF Driver Stage

Higher-power final stages in macro-cell base stations often pair a driver transistor ahead of the final PA. The MRF18085BLSR3's 85 W rating makes it suitable as a driver for even larger NXP lateral MOSFET finals in the 1.9 GHz band, particularly in retrofit designs where matching networks were originally tuned for the NI-780 footprint. Per the datasheet, the device delivers stable gain and efficiency in driver configurations, with bias networks optimized for AB-class operation common in driver stages.

🔧

Legacy Base Station Repair / Replacement

Many deployed cellular base stations still require replacement of failed 1.9 GHz RF power MOSFETs on original PCB assemblies. The MRF18085BLSR3 is widely used in legacy GSM/EDGE infrastructure repair workflows, with the NI-780 flange-mount package allowing direct mechanical substitution on existing heatsinks. Because NXP has removed the part from active production, repair operations stock the MRF18085 family variants (LR3, B, BR3) as drop-in equivalents. Distributors like LCSC and Veswin list the part specifically for legacy telecom repair pipelines.

Zusammenfassung der empfohlenen Produkte

MRF18085BLR3 Drop-in family variant, same NI-780 package Verwendet in: GSM/EDGE Base Station Power Amplifier, TDMA Cellular Base Station PA, Wireless Infrastructure RF Driver Stage, Legacy Base Station Repair / Replacement MRF18085B Same-family base MPN in NI-780 package Verwendet in: GSM/EDGE Base Station Power Amplifier, CDMA Cellular Infrastructure Amplifier, Legacy Base Station Repair / Replacement MRF18085BR3 Family variant, same NI-780 package for multicarrier use Verwendet in: Multicarrier Power Amplifier
What is the MRF18085BLSR3 used for?
The MRF18085BLSR3 is an 85 W lateral N-channel RF power MOSFET designed primarily for GSM and GSM EDGE base-station power amplifiers operating from 1930 to 1990 MHz. According to the NXP/Motorola datasheet, it is also suitable for TDMA, CDMA, and multicarrier amplifier applications in cellular infrastructure. It is housed in the NI-780 ceramic-metal hermetic package (CASE 465-06, STYLE 1) for high-power RF stages.
What is the operating frequency range of the MRF18085BLSR3?
The MRF18085BLSR3 is specified for 1930 MHz to 1990 MHz continuous operation, covering the GSM 1800/1900 downlink band and adjacent DCS/PCS spectrum. According to the datasheet title block, this part is optimized for GSM/GSM EDGE base-station amplifier output stages. Designers should verify impedance matching networks are tuned within this band for full rated 85 W output.
What is the output power of the MRF18085BLSR3?
The MRF18085BLSR3 delivers 85 W typical output power at 26 V drain supply across the 1930–1990 MHz band. According to the NXP/Motorola datasheet, this power level targets the final stage of macro-cell base-station power amplifiers. Per the datasheet absolute maximums, dissipation is rated at 273 W, giving headroom for VSWR mismatches.
What package does the MRF18085BLSR3 use?
The MRF18085BLSR3 uses the NI-780 ceramic-metal hermetic package, CASE 465-06, STYLE 1, which is a flange-mount (chassis-mount) package with flat terminals. According to the datasheet, this package provides low thermal resistance and hermeticity required for high-reliability base-station applications. It is NOT a surface-mount part; PCB soldering is not used.
Is the MRF18085BLSR3 still in production?
No. According to the NXP product page, the MRF18085BLR3 and MRF18085BLSR3 have been removed from the active portfolio, placing them in last-time-buy / NRND lifecycle status. Engineers designing new equipment should consult the NXP Part Number Search for current recommended replacement parts. Existing designs may still obtain inventory via distributors carrying remaining stock.
Where can I buy the MRF18085BLSR3 today?
The MRF18085BLSR3 is available from distributors such as LCSC, Vyrian, Veswin, Xecor, and Octopart-listed resellers. According to LCSC listings, unit pricing starts near $33.88 as of 2026-10-16, with stock from NXP/Freescale. Because the part is no longer in active production, lead times may extend and pricing can fluctuate; check real-time inventory.
What is the price of the MRF18085BLSR3?
The MRF18085BLSR3 price starts around $33.88 at qty-1, dropping to roughly $25.40 at qty-1000 according to LCSC and Octopart distributor listings as of 2026-10-16. Because NXP has removed the part from its active portfolio, prices may rise as remaining inventory depletes. Request formal quotes for production volumes.
What is the lead time for the MRF18085BLSR3?
Lead time for the MRF18085BLSR3 is variable because the part is no longer in NXP's active portfolio. According to the NXP product page, it is removed from active production and routed to last-time-buy channels, so standard factory lead times do not apply. Distributors like LCSC and Vyrian may ship from existing stock immediately, or backorder from independent sources if stock is depleted.
Is the MRF18085BLSR3 in stock right now?
According to distributor listings as of 2026-10-16, the MRF18085BLSR3 shows in-stock availability at LCSC and other resellers, but inventory is finite because NXP has removed the part from active production. For confirmed stock and shipment timing, request a real-time quote from LCSC, Vyrian, Veswin, or your authorized distributor. Avoid assuming long-term supply from any single source.
What is the difference between MRF18085BLR3 and MRF18085BLSR3?
The MRF18085BLR3 and MRF18085BLSR3 are members of the same MRF18085 family of 85 W, 26 V, 1930–1990 MHz GSM/EDGE lateral N-channel RF power MOSFETs. According to NXP family documentation, both share the same NI-780 ceramic package (CASE 465-06), with the suffix indicating minor product/test variation. They are essentially drop-in equivalents in the same NI-780 footprint.
What is the best drop-in replacement for the MRF18085BLSR3?
The closest drop-in replacements for the MRF18085BLSR3 are its own family siblings: MRF18085BLR3 (NI-780, 85 W, 1930–1990 MHz) and the broader MRF18085 family of NXP RF power MOSFETs in the same NI-780 package. According to NXP's Part Number Search for this family, no third-party manufacturer offers a true pin-to-pin compatible ceramic NI-780 RF MOSFET; qualified drop-ins are limited to NXP/Freescale family members.
Where can I download the MRF18085BLSR3 datasheet PDF?
The MRF18085BLSR3 datasheet PDF is available from Mouser at https://www.mouser.com/catalog/specsheets/freescale_mrf18085b.pdf, and from archives including Alldatasheet and Datasheet4u. According to the datasheet title block, it covers the MRF18085B, MRF18085BR3, and MRF18085BLSR3 variants in 12 pages. The NXP product page (https://www.nxp.com/products/MRF18085BL) confirms part status but no longer hosts an active datasheet.
What is the pinout of the MRF18085BLSR3?
The MRF18085BLSR3 uses the NI-780 flange-mount ceramic package (CASE 465-06, STYLE 1), with RF input, RF output, gate bias, and drain supply routed through package leads and the mounting flange. Per the datasheet mechanical drawing, the flange serves as the main thermal and RF ground path. Refer to the package outline diagram on page 1 of the Mouser-hosted datasheet PDF for exact lead assignments.
MRF18085BLSR3 vs MRF18085BLR3 - which is better?
For new designs, both the MRF18085BLSR3 and MRF18085BLR3 deliver identical 85 W, 26 V, 1930–1990 MHz performance in the same NI-780 package per the family specification. According to NXP's product portfolio note, both parts have been removed from the active portfolio together, so neither offers a longevity advantage. Choose based on distributor stock and unit pricing rather than electrical differences.
When should I choose MRF18085BLSR3 vs newer RF MOSFET alternatives?
Choose the MRF18085BLSR3 only when you need a direct replacement for an existing 1930–1990 MHz base-station PA design where PCB and matching network geometry are already committed to the NI-780 footprint. According to NXP's product page, the part is removed from active portfolio, so for new designs prefer currently-active NXP RF power MOSFETs from the same family. Verify thermal and impedance-matching compatibility before substituting.

Technische Referenzdaten für MRF18085BLSR3 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MRF18085BLSR3 only when you must repair or maintain an existing 1.93–1.99 GHz GSM/EDGE base-station PA already designed around the NI-780 (CASE 465-06) ceramic flange package. The part has been removed from NXP's active portfolio, so for new designs prefer currently-active NXP RF power MOSFETs. For exact drop-in substitution on existing hardware, the MRF18085BLR3, MRF18085B, and MRF18085BR3 are functionally identical and share the same footprint. All alternatives are same-brand NXP family members; no cross-brand drop-in NI-780 ceramic RF MOSFET equivalents were found in the verified web data, which is consistent with the niche nature of this hermetic RF power package.

Vergleich mit Alternativen

Parameter Dieses Produkt MRF18085BLR3 MRF18085B MRF18085BR3
Package NI-780 (CASE 465-06) NI-780 (CASE 465-06) - same NI-780 (CASE 465-06) - same NI-780 (CASE 465-06) - same
Brand NXP Semiconductors NXP Semiconductors (same) NXP Semiconductors (same) NXP Semiconductors (same)
Output Power 85 W 85 W 85 W 85 W
Drain Supply Voltage 26 V 26 V 26 V 26 V
Frequency Range 1930-1990 MHz 1930-1990 MHz 1930-1990 MHz 1930-1990 MHz
Maximum Dissipation 273 W 273 W 273 W 273 W
Lifecycle Status last_time_buy last_time_buy last_time_buy last_time_buy
Channel Type N-Channel, Enhancement-Mode N-Channel, Enhancement-Mode N-Channel, Enhancement-Mode N-Channel, Enhancement-Mode

Wichtigste Unterscheidungsmerkmale

  • Family-internal drop-in compatibility across MRF18085 series (vs. MRF18085BLR3)
  • Suffix variant flexibility within the same die (vs. MRF18085B)
  • Hermetic ceramic NI-780 reliability (vs. Plastic-packaged RF MOSFETs)

Designhinweise

Estimated: at 26 V drain and 85 W RF output, the DC dissipation budget before RF conversion efficiency is roughly 100–150 W (depending on PA efficiency). The NI-780 ceramic flange must be bolted to a heatsink with thermal compound; without adequate heatsinking the junction will exceed 200 °C and trigger thermal runaway. Use a chassis-mount torque per the datasheet mechanical drawing to ensure proper thermal interface pressure.

The MRF18085BLSR3 is a flange-mount part, not a SMD. Design PCB cutouts to clear the NI-780 package body, with the RF input and output traces on 50 Ω microstrip lines exiting the package leads. Keep gate bias traces short and decoupled with 100 nF + 10 µF capacitors near the gate pin to suppress low-frequency oscillation. Ensure the flange is RF-grounded via short bond straps to the amplifier chassis.

Do not exceed 26 V on the drain for continuous operation - the datasheet rates the part at 26 V typical and absolute maximum dissipation at 273 W. Exceeding either limit destroys the device. Also ensure proper gate bias sequencing (negative gate voltage applied before drain) to avoid thermal runaway at startup. Avoid operating below the recommended idle current, which degrades linearity in EDGE/CDMA modes.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Compliant

Compliance details not present in verified web data; RoHS/lead-free marked unknown pending manufacturer confirmation. Not AEC-Q100 qualified - this is a base-station telecom part, not an automotive grade.

Daten verifiziert am: 2026-10-16 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

MRF18085BLSR3 datasheet MRF18085BLSR3 price MRF18085BLSR3 buy NXP MRF18085 85W RF MOSFET 85W 26V 2GHz RF power MOSFET NI-780 ceramic RF transistor GSM EDGE base station PA transistor MRF18085BLSR3 vs MRF18085BLR3 MRF18085BLSR3 replacement alternative MRF18085BLSR3 pinout NI-780 1930-1990 MHz RF power amplifier MOSFET NXP lateral N-channel RF MOSFET discontinued

Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor Motorola MRF18085BLSR3 MRF18085BLR3 MRF18085B MRF18085BR3 RF power MOSFET lateral MOSFET N-channel enhancement-mode MOSFET GSM GSM EDGE TDMA CDMA NI-780 package CASE 465-06 ceramic-metal hermetic package base station power amplifier multicarrier amplifier 1930-1990 MHz 26 V drain supply 85 W RF output PSRR RoHS AEC-Q100
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