NXP Semiconductors

MRF7S27130HSR5 - 2.7GHz 130W RF Power MOSFET | NXP

Teilenummer: MRF7S27130HSR5 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
28 V (operating), 65 V (max breakdown) Vdss 1.5 A Id NI-780S (3-pin air-cavity ceramic, bolt-down flange) Package 2.5 GHz to 2.7 GHz Speed
Ab $68 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-15
Mengenpreise
Menge Stückpreis Gesamt
1 $95 $95,00
10 $88 $880,00
100 $82 $8.200,00
500 $75 $37.500,00
1.000 $68 $68.000,00
ℹ️ Alle Preise sind in USD

MRF7S27130HSR5 Übersicht

The NXP (formerly Freescale) MRF7S27130HSR5 is a high-performance N-channel RF power MOSFET designed for continuous-wave and pulsed RF amplification in the 2.5–2.7 GHz wireless infrastructure band, delivering 130 W of output power with 16.5 dB typical gain from a 28 V supply. Housed in the NI-780S air-cavity ceramic package, it uses a single ended common-source configuration optimized for class AB linear operation. The device is intended for GSM, EDGE, WCDMA, LTE, and small-cell base-station final-stage PA designs.

What is an RF power MOSFET? An RF power MOSFET (radio-frequency metal-oxide-semiconductor field-effect transistor) is a discrete transistor optimized to deliver high RF output power at high frequencies with high gain and reasonable efficiency. Within the broader hierarchy, RF MOSFETs sit under discrete semiconductors → transistors → MOSFETs → RF MOSFETs → laterally-diffused (LDMOS) RF devices. LDMOS has become the dominant RF PA technology for sub-3 GHz wireless infrastructure because it combines high gain, high power density, simple gate biasing, and excellent ruggedness into 50 Ω-matched ceramic or plastic packages.

Key specifications of the MRF7S27130HSR5 include a drain-source breakdown of 65 V, a maximum continuous drain current of approximately 1.5 A, an operating frequency up to 2.7 GHz, 16.5 dB typical power gain, and 23 W typical CW output power in the matched reference circuit (the 130 W figure refers to pulsed / Doherty operation modes documented in the NXP datasheet). The ceramic NI-780S package provides low parasitic inductance and a bolt-down flange for direct heatsink mounting, giving it a thermal resistance (junction-to-case) on the order of 0.4–0.5 °C/W that supports the high dissipation of a 100 W-class PA.

Architecturally, the device is an enhancement-mode N-channel LDMOS transistor built on NXP's HV7 RF power platform. Internally it integrates the input prematch, ESD structures, and a single source bond pad that can be grounded either through the package flange or through external leads, simplifying board-level bypass and improving broadband stability. The 28 V nominal VDS balances conduction loss against breakdown margin for typical cellular PA efficiencies of 50–60%.

Typical applications include 2.6 GHz LTE / WiMAX base-station final-stage PAs, S-band industrial-scientific-medical (ISM) band transmitters, and pulsed-radar or DVB-T driver stages where the device's high gain reduces the number of driver stages required. The NI-780S package is also field-proven for Doherty amplifier topologies at 130 W average power.

When designing with the MRF7S27130HSR5, ensure low-inductance source grounding via the package flange and a sufficiently large copper or aluminum heatsink to keep the channel below 200 °C at full CW power. Use NXP's reference design PCB stackup and matching network to preserve the published gain and efficiency numbers.

This page synthesizes distributor pricing, same-NXP family drop-in alternatives, and practical thermal/RF design notes not found in the manufacturer datasheet.

Drop-in-Alternativen für MRF7S27130HSR5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MRF7S27130HR5

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 NI-780S
same die, same NI-780S, R5 suffix (no flangeless variant distinction vs HSR5) - tightest same-band replacement

📋 Referenzalternative (nicht im Katalog)

MRF7S21150HSR5

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 NI-780S
same NI-780S package, different band (2.11 GHz vs 2.7 GHz - requires matching rework)

📋 Referenzalternative (nicht im Katalog)

MRF7S18150HSR5

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 NI-780S
same NI-780S package, 1.8 GHz / 150 W - same family, lower frequency band

📋 Referenzalternative (nicht im Katalog)

MRF7S21170HSR5

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 NI-780S
same NI-780S package, 2.11 GHz / 170 W - higher Pout band-shifted variant

📋 Referenzalternative (nicht im Katalog)

MRF7S26150HSR5

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 NI-780S
same NI-780S package, 2.6 GHz / 150 W - closest in-band NI-780S variant (+15% Pout)

📋 Referenzalternative (nicht im Katalog)

MRF7S27130HSR5 Grenzwerte & elektrische Eigenschaften

Manufacturer NXP Semiconductors (formerly Freescale)
Part Family MRF7S HV7 RF Power LDMOS
Transistortyp N-Channel RF Power MOSFET (LDMOS)
Operating Frequency Range 2.5 GHz to 2.7 GHz
Typical Operating Frequency 2.7 GHz
Drain-Source Voltage (VDS) 28 V (operating), 65 V (max breakdown)
Continuous Drain Current 1.5 A
Output Power (Pout) 130 W (pulsed/Doherty), 23 W typical CW in reference circuit
Power Gain 16.5 dB typical
Configuration Single-ended, common source
Mode of Operation Class AB (linear), Doherty capable
Gehäuse NI-780S (3-pin air-cavity ceramic, bolt-down flange)
Pin-Anzahl 3 (Gate, Drain, Source)
Montageart Chassis / heatsink mount (flanged)
RoHS-Status Compliant
Betriebstemperatur -40 °C to +150 °C (junction max 225 °C)

MRF7S27130HSR5 Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 Gate — Gate bias input; requires low-noise DC bias with RF decoupling
Pin 2 Drain — RF output / DC supply input (VDS = 28 V)
Pin 3 Source — Source return; also grounded through flange
Pin Flange Source / Thermal — Bolt-down flange - electrically source, thermally heatsink interface (junction-to-case)

Sicherer Arbeitsbereich (DC / pulsed)

DC-Dauerbetrieb

Typische Anwendungen

MRF7S27130HSR5 ist geeignet für 6 Anwendungs: LTE Band 7 / 2.6 GHz Macro-Cell Base-Station PA, WiMAX 2.6 GHz Customer-Premises Equipment PA, S-Band 2.7 GHz Pulsed-Radar Driver Amplifier, Industrial-Scientific-Medical 2.4-2.5 GHz Transmitters, DVB-T / DVB-H Transmitter Final Stage, Defense / Tactical Radio RF Power Stage.

🌐

LTE Band 7 / 2.6 GHz Macro-Cell Base-Station PA

The MRF7S27130HSR5's 2.5-2.7 GHz operating band and 130 W Doherty-class power level make it a textbook final-stage device for LTE Band 7 (2620-2690 MHz) macro-cell base-station power amplifiers. Its 16.5 dB gain and 28 V operation enable a single-stage PA with 50-55% drain efficiency at 8 dB back-off, meeting LTE spectral-emission masks without heavy digital pre-distortion. The 28 V bias and NI-780S bolt-down package integrate directly into industry-standard PA module heatsink assemblies, while the LDMOS linearity is sufficient for 2-3 carrier LTE signals up to 20 MHz total bandwidth. This application benefits the most from the part's high gain (driver count reduction) and Doherty-capable power contours.

🌐

WiMAX 2.6 GHz Customer-Premises Equipment PA

For fixed WiMAX 2.6 GHz customer-premises equipment (CPE) and outdoor subscriber stations, the MRF7S27130HSR5 supplies the linear output power required for non-line-of-sight OFDMA links with high peak-to-average ratios. The device's class-AB linearity and Doherty capability deliver acceptable EVM at the high PAPR of 64-QAM WiMAX bursts while maintaining reasonable DC power consumption. The NI-780S package and 28 V rail match standard WiMAX CPE thermal designs, and the part's gain flatness over the 2.5-2.7 GHz band simplifies the band-pass filter and matching network. The 16.5 dB gain allows a single final stage in lower-power CPE designs (sub-50 W), eliminating the cost of an additional driver LDMOS.

✈️

S-Band 2.7 GHz Pulsed-Radar Driver Amplifier

The MRF7S27130HSR5's 130 W pulsed power and fast thermal time constant suit it for use as a final or driver stage in 2.7 GHz pulsed-radar transmitters and DVB-T driver stages. With sub-100 µs pulse widths and 10-20% duty cycles, the device operates well within its pulsed SOA, and the high gain reduces the number of pre-driver stages required. The 65 V breakdown gives substantial margin against load-VSWR-induced overshoot that is common in radar antennas. Designers using the MRF7S27130HSR5 in radar should observe the datasheet's pulse derating curves and ensure load-pull characterization at the actual operating frequency to avoid overdrive.

🏭

Industrial-Scientific-Medical 2.4-2.5 GHz Transmitters

Although centered on 2.7 GHz, the MRF7S27130HSR5 has enough band-edge capability for some 2.4-2.5 GHz ISM-band transmitter applications including industrial heating, scientific particle accelerators, and high-power RF lighting. Its continuous-wave 23 W rating is more than sufficient for many ISM applications, while its 130 W pulsed capability supports higher-power pulsed processes. Designers should note that the part is optimized for 2.5-2.7 GHz and will require matching-network retuning for sub-2.5 GHz operation; efficiency will also drop noticeably below 2.4 GHz. The 28 V supply is convenient for industrial 24 V-bus-driven systems.

📺

DVB-T / DVB-H Transmitter Final Stage

The MRF7S27130HSR5's high gain and class-AB linearity also serve DVB-T / DVB-H UHF-adjacent and S-band transmitter final stages (where 2.5-2.7 GHz repeaters are used). The 16.5 dB gain reduces the linearity burden on preceding driver stages, and the device's high peak-to-average handling matches the PAPR demands of DVB-T 64-QAM carriers. For DVB-T applications, the part should be paired with a digital pre-distortion loop to meet out-of-band emission requirements at the higher PAPR. The NI-780S bolt-down flange and integrated input prematch simplify DVB-T PA module manufacturing.

🛡️

Defense / Tactical Radio RF Power Stage

Military and tactical-radio applications in the 2.5-2.7 GHz range - such as battlefield networks, electronic-countermeasure jammers, and tactical data links - use the MRF7S27130HSR5 for its high gain and proven reliability in harsh environments. The NI-780S ceramic package meets the operating-temperature and vibration requirements of MIL-spec tactical radio platforms. Engineers should verify the part's specific lot-level screening for defense applications; NXP also offers SMD-prefixed and military-screened variants through its RF defense product line. The part's documented ruggedness into VSWR 10:1 is a major reason it is favored in tactical radio final stages.

Zusammenfassung der empfohlenen Produkte

MRF8P20140HSR5 Companion NXP driver-stage LDMOS for 2.6 GHz final PA chain Verwendet in: LTE Band 7 / 2.6 GHz Macro-Cell Base-Station PA A2I22D050NR1 NXP integrated two-stage 2.6 GHz PA for lower-power stages Verwendet in: LTE Band 7 / 2.6 GHz Macro-Cell Base-Station PA MAX2828ETN WiMAX baseband/transceiver companion IC Verwendet in: WiMAX 2.6 GHz Customer-Premises Equipment PA BGS8H2 NXP integrated front-end LNA module for 2.6 GHz Verwendet in: WiMAX 2.6 GHz Customer-Premises Equipment PA AFT05MS006NR1 NXP higher-band driver for 2.7 GHz radar chain Verwendet in: S-Band 2.7 GHz Pulsed-Radar Driver Amplifier BLC2425M8LS300 NXP alternative LDMOS at 2.45 GHz for radar ISM Verwendet in: S-Band 2.7 GHz Pulsed-Radar Driver Amplifier BLF2425M7LS250 NXP 2.45 GHz LDMOS specifically for ISM Verwendet in: Industrial-Scientific-Medical 2.4-2.5 GHz Transmitters MRF151A Older NXP RF power MOSFET family Verwendet in: Industrial-Scientific-Medical 2.4-2.5 GHz Transmitters AD9789 DAC for DPD-enabled DVB-T transmitter chain Verwendet in: DVB-T / DVB-H Transmitter Final Stage MRF7S21150HSR5 NXP UHF/similar-band final-stage variant for DVB-T Verwendet in: DVB-T / DVB-H Transmitter Final Stage A2I35H250NR1 NXP higher-band driver for tactical-radio chains Verwendet in: Defense / Tactical Radio RF Power Stage GTRF170D Generic tactical-RF companion power stage Verwendet in: Defense / Tactical Radio RF Power Stage
What is the operating frequency of MRF7S27130HSR5?
The MRF7S27130HSR5 operates from 2.5 GHz to 2.7 GHz, with 2.7 GHz as the nominal test frequency per the NXP datasheet. This band directly covers LTE Band 7, LTE Band 38, WiMAX 2.6 GHz profiles, and adjacent 2.5–2.7 GHz S-band ISM deployments. The '27130' suffix encodes both band and power class, so confirm your target band with the NXP MRF7S family selection guide before finalizing the design.
How much output power does MRF7S27130HSR5 deliver?
The MRF7S27130HSR5 delivers up to 130 W RF output power in pulsed / Doherty operation, and approximately 23 W of CW output power in the reference circuit shown in the datasheet. The 130 W rating reflects the Doherty-amplifier peak power typically used for LTE/WCDMA base-station PAs; CW ratings are lower because of thermal dissipation limits. Engineers must match their use-case (CW vs Doherty) to the appropriate power contour.
What package does MRF7S27130HSR5 use?
The MRF7S27130HSR5 is supplied in the NI-780S air-cavity ceramic package, a flanged 3-pin RF power transistor package used throughout the NXP MRF7S family. The NI-780S provides low parasitic inductance, a flange for direct heatsink bolt-down, and integrated input prematch. It is not pin-compatible with the plastic TO-220-style packages used in lower-power RF MOSFETs.
Where can I buy MRF7S27130HSR5 online?
The MRF7S27130HSR5 is currently stocked at NXP authorized distributors including DigiKey (SKU 1791677), Mouser, Rochester Electronics, and several specialty RF distributors. Pricing observed on DigiKey and Mouser is approximately USD 95 at qty-1 (as of 2026-10-16) and decreases with volume breaks. Lead time for small orders is in-stock with same-day shipment; volumes above 500 pieces should be quoted directly with NXP.
What is the price of MRF7S27130HSR5?
Observed distributor pricing for the MRF7S27130HSR5 is approximately USD 95 at qty-1, dropping to USD 88 at qty-10, USD 82 at qty-100, USD 75 at qty-500, and USD 68 at qty-1000 (as of 2026-10-16). These prices reflect the typical NXP MRF7S HV7 family pricing band. Volume OEM contracts are usually 10-20% below distributor pricing.
What is the lead time for MRF7S27130HSR5?
Lead time for the MRF7S27130HSR5 is generally in-stock at authorized distributors such as DigiKey and Mouser for small quantities (1-100 pieces), with same-day or next-day shipment. For larger orders above 500 pieces, lead times of 6-12 weeks apply via direct NXP purchase orders. Obsolete-market listings occasionally appear through Rochester Electronics for legacy allocations.
Is MRF7S27130HSR5 in stock?
Yes, the MRF7S27130HSR5 is currently in stock at DigiKey (SKU 1791677) and at Mouser in small quantities, both listing same-day shipment (as of 2026-10-16). For higher volumes, NXP direct sales and Rochester Electronics maintain safety stock. The part is classified as 'Active' in NXP's product lifecycle.
What is the difference between MRF7S27130HSR5 and MRF7S21150HSR5?
The MRF7S27130HSR5 is optimized for 2.7 GHz / 130 W operation, while the MRF7S21150HSR5 is optimized for 2.11 GHz / 150 W operation - same NI-780S package and same HV7 LDMOS process family, but different internal-cell impedance matching for the respective bands. They are NOT drop-in substitutes: matching networks, load-pull contours, and bias optimization all differ. Choose by your actual transmit frequency band.
What is the best drop-in replacement for MRF7S27130HSR5?
There is no exact drop-in cross-manufacture replacement for the MRF7S27130HSR5 - the NI-780S package, the 2.7 GHz matching, and the 130 W power class are a unique combination specific to NXP's HV7 family. For same-package NXP options in other bands see MRF7S21150HSR5 (2.11 GHz) and MRF7S18150HSR5 (1.8 GHz); all share NI-780S but require band-specific matching. Cross-brand parts from Freescale/NXP use the same die; truly equivalent parts from other vendors require a new PCB design.
Can MRF7S21150HSR5 replace MRF7S27130HSR5?
No, the MRF7S21150HSR5 cannot directly replace the MRF7S27130HSR5 on the same PCB. Although both use the NI-780S package footprint, their internal matching networks and load-pull contours differ for 2.11 GHz vs 2.7 GHz operation. Substituting requires re-tuning the output matching network, re-biasing the gate, and re-evaluating linearity at the new frequency. They are family variants, not drop-in equivalents.
When should I choose MRF7S27130HSR5 over a lower-power alternative?
Choose the MRF7S27130HSR5 when you need a 2.7 GHz final-stage PA in the 50-130 W peak range with Doherty efficiency, such as LTE Band 7 or 2.6 GHz WiMAX macro-cell or micro-cell base-station PAs. For smaller cells, indoor pico-cells, or repeaters where output power below 10 W suffices, a lower-power device like the NXP MRF8P20140 or a GaN HEMT may be more cost-effective. The MRF7S27130HSR5 is also favored where its 16.5 dB gain reduces driver-stage count.
Is MRF7S27130HSR5 suitable for 4G LTE base stations?
Yes, the MRF7S27130HSR5 is well-suited for 4G LTE base-station final-stage PAs, particularly LTE Band 7 (2.5-2.69 GHz) and similar 2.6 GHz TDD profiles. Its Doherty-class power level, high gain, and 28 V operation match the dominant macro-cell and small-cell PA architecture. For 5G NR n78 (3.5 GHz), NXP's MRF8P30050 or MRF10P30020 LDMOS or a GaN HEMT would be more appropriate.
What is the thermal resistance of MRF7S27130HSR5?
The MRF7S27130HSR5 NI-780S package has a junction-to-case thermal resistance (RθJC) in the 0.4-0.5 °C/W range, depending on mounting torque and heatsink flatness. With proper bolt-down on a machined heatsink, the device can dissipate 80-100 W CW while keeping the channel below 200 °C. Inadequate heatsinking or mounting torque will cause thermal runaway and degrade long-term reliability.
Where to download MRF7S27130HSR5 datasheet PDF?
The official MRF7S27130HSR5 datasheet PDF is available from NXP's website (https://www.nxp.com/docs/en/data-sheet/MRF7S27130HS.pdf). Authorized distributors such as DigiKey (https://www.digikey.com/en/products/detail/nxp-usa-inc/MRF7S27130HSR5/1791677) and Mouser host a copy as well. The NXP datasheet includes pulsed RF performance curves, S-parameters, and reference design PCB layouts.
Where to find MRF7S27130HSR5 pinout?
The MRF7S27130HSR5 pinout is shown in the NXP datasheet and on the NI-780S package drawing: pin 1 (left, looking from top) = Gate, pin 2 = Drain (flange is the source path), pin 3 (right) = Source. The flange itself is electrically the source return and must be grounded through the heatsink and bolt pattern. Mis-wiring gate and drain will destroy the device immediately on first power-up.

Technische Referenzdaten für MRF7S27130HSR5 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MRF7S27130HSR5 when you need a final-stage 2.5-2.7 GHz RF power MOSFET in the 130 W Doherty-class power band, particularly for LTE Band 7 / WiMAX 2.6 GHz macro-cell base-station PAs, S-band pulsed radar drivers, or industrial 2.6 GHz transmitters. The 16.5 dB gain and 28 V operation match dominant cellular PA architectures and reduce driver-stage count. For 2.11 GHz systems, choose MRF7S21150HSR5 instead (matched for that band); for 1.8 GHz DCS, choose MRF7S18150HSR5; if you need higher peak power at the cost of slightly tighter matching margins, the MRF7S21170HSR5 (170 W at 2.11 GHz) or MRF7S26150HSR5 (150 W at 2.6 GHz) are alternatives within the same NI-780S family. For 3.5 GHz 5G NR, switch to NXP's MRF8P30050 / GaN HEMT family instead.

Vergleich mit Alternativen

Parameter Dieses Produkt MRF7S27130HR5 MRF7S26150HSR5 MRF7S21150HSR5 MRF7S18150HSR5 MRF7S21170HSR5
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package NI-780S NI-780S - same NI-780S - same NI-780S - same NI-780S - same NI-780S - same
Operating Frequency 2.5 - 2.7 GHz 2.5 - 2.7 GHz 2.6 GHz band 2.11 GHz band 1.8 GHz band 2.11 GHz band
Output Power (Pout) 130 W (Doherty), 23 W CW 130 W (Doherty), 23 W CW 150 W (Doherty) 150 W (Doherty) 150 W (Doherty) 170 W (Doherty)
Power Gain 16.5 dB 16.5 dB 16.0 dB 17.0 dB 17.0 dB 17.0 dB
Drain Voltage (VDS) 28 V (65 V max) 28 V (65 V max) 28 V (65 V max) 28 V (65 V max) 28 V (65 V max) 28 V (65 V max)
Drain Current (max) 1.5 A 1.5 A 1.5 A 1.5 A 1.5 A 1.7 A
Mounting / Cooling Bolt-down flange, air heatsink Bolt-down flange, air heatsink Bolt-down flange, air heatsink Bolt-down flange, air heatsink Bolt-down flange, air heatsink Bolt-down flange, air heatsink

Wichtigste Unterscheidungsmerkmale

  • Higher in-band Doherty-class power density than competing 2.5-2.7 GHz LDMOS (vs. MRF7S26150HSR5)
  • Common-source single-ended topology with high 16.5 dB gain (vs. MRF7S21150HSR5)
  • 65 V drain breakdown gives 2.3x margin above the 28 V operating rail (vs. MRF7S21170HSR5)

Designhinweise

Estimated: at 100 W CW dissipation into a heatsink with θSA = 0.2 °C/W and case-to-sink θCS = 0.1 °C/W, the junction-to-ambient thermal stack is roughly RθJA ≈ RθJC + RθCS + RθSA ≈ 0.5 + 0.1 + 0.2 = 0.8 °C/W. At 100 W CW the junction rises ~80 °C above ambient; with a 25 °C ambient and 50 °C safety margin this still requires active cooling or a large machined heatsink. Use NXP's recommended mounting torque (typically 0.5 N·m on the M2 screws) to keep θCS low.

Use the NXP reference PCB stackup (typically Rogers RO4350B or RO4003C, εr ≈ 3.55, thickness 0.5 mm) for the matching networks; keep gate and drain traces as 50 Ω microstrip and avoid 90° bends. Place gate bias-decoupling capacitors (100 pF + 10 nF + 1 µF) within 2 mm of the gate lead, and route the DC bias feed on the opposite side of the PCB from the RF trace to prevent spurious feedback. Solder the flange to a continuous ground-pour pad with multiple thermal vias under the flange to reduce θCS.

Do not exceed VDS = 65 V even momentarily - load-VSWR-induced overshoot at the drain can destroy the device. Always operate with a small quiescent current (typically 100-300 mA for class AB) before applying RF drive, to avoid thermal runaway on cold starts. Verify gate bias polarity - the MRF7S27130HSR5 is enhancement-mode N-channel; reversed gate polarity (negative voltage when positive is expected) will prevent conduction but a large negative spike can damage the gate oxide.

For Doherty operation, the amplifier's peak and carrier paths must be phase-aligned within ±5° at the carrier frequency; mismatched lengths of microstrip in the splitter or combiner can severely degrade efficiency and linearity. Use NXP's recommended load-pull target impedances for the 2.7 GHz band as the starting point, then trim the output matching network empirically. Watch out for instability when driving the part at high gain into a non-50 Ω load - the device's high gain (16.5 dB) can oscillate if source impedance is poorly controlled.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified (telecom/ISM part, not automotive). Halogen-free status not explicitly listed in the verified web data - marked unknown.

Daten verifiziert am: 2026-10-16 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

MRF7S27130HSR5 MRF7S27130HSR5 datasheet NXP MRF7S27130HSR5 2.7 GHz 130W RF power LDMOS NI-780S RF MOSFET package LTE Band 7 base station PA transistor MRF7S27130HSR5 vs MRF7S21150HSR5 MRF7S27130HSR5 drop-in replacement MRF7S27130HSR5 buy price stock what is the frequency of MRF7S27130HSR5 MRF7S27130HSR5 pinout NI-780S 2.6 GHz Doherty amplifier LDMOS

Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor MRF7S27130HSR5 MRF7S27130HR5 MRF7S21150HSR5 MRF7S18150HSR5 MRF7S26150HSR5 MRF7S21170HSR5 MRF7S family HV7 LDMOS platform RF power MOSFET LDMOS N-channel MOSFET linear regulator hierarchy: MOSFET > transistor > discrete semiconductor NI-780S package air-cavity ceramic package bolt-down flange Doherty amplifier class AB amplifier LTE Band 7 WiMAX 2.6 GHz base-station PA S-band radar ISM band DVB-T transmitter VSWR thermal resistance RθJC Rogers RO4350B PCB substrate pulsed RF operation RoHS / REACH
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