MT40A512M16LY-062E-ATE - 8Gb DDR4-3200 SDRAM | Micron
Teilenummer: MT40A512M16LY-062E-ATE ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $53.27 | $53,27 |
| 10 | $48.01 | $480,10 |
| 100 | $42.62 | $4.262,00 |
| 500 | $38.35 | $19.175,00 |
| 1.000 | $34.1 | $34.100,00 |
MT40A512M16LY-062E-ATE Übersicht
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is the fourth generation of high-bandwidth volatile memory, transferring data on both the rising and falling edges of the clock. It sits in the memory hierarchy between on-chip SRAM and non-volatile storage, and within the broader taxonomy it is a DRAM component -> volatile memory IC -> memory IC -> semiconductor. DDR4 introduced a 1.2 V supply (down from 1.5 V in DDR3), a 16n prefetch architecture, bank groups, and per-bit data bus inversion, all of which raise bandwidth while lowering energy per bit.
Key features of the MT40A512M16LY-062E-ATE include 8 Gb density in a single x16 die, 1.6 GHz clock (3200 MT/s), 19 ns access time, 1.2 V VDD with 2.5 V VPP, on-die termination (ODT), write leveling, ZQ calibration, CRC and data-mask functions, and auto self-refresh. The 96-ball FBGA uses a 0.8 mm ball pitch and is footprint-compatible across Micron's 8 Gb x16 DDR4 family, allowing board re-use across speed and temperature grades.
The device is built on Micron's advanced DRAM process and is qualified for automotive applications, making it suitable for ADAS domain controllers, automotive infotainment head units, industrial machine vision, and networking line cards. Its 3200 MT/s data rate delivers 6.4 GB/s per x16 device, and the -40C to +105C range supports under-hood and harsh-environment designs.
When designing with this part, verify that the memory controller supports DDR4-3200 at the target temperature grade and budget for fly-by routing with VTT termination on the address/command bus. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MT40A512M16LY-062E-ATE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MT40A512M16LY-062E-ATE (gleiche Bauform und Footprint) – abweichend in Clock Frequency, Data Rate, Density, Memory Type, Organization.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MT40A512M16LY-062E-IT-E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MT40A512M16LY-062E-AUT-E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MT40A512M16LY-062E-AAT-E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MT40A512M16LY-062E:E
✅ Drop-In✓ Auf Lager
$34.99 / Stück
Datenblatt ansehen →MT40A512M16LY-062E-AT-E-TR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K4A8G165WC-BCTD
✅ Drop-In✓ Auf Lager
$41.2 / Stück
Datenblatt ansehen →MT40A512M16LY-062E-ATE Grenzwerte & elektrische Eigenschaften
| Speichertyp | DDR4 SDRAM |
| Density | 8 Gbit |
| Speicherorganisation | 512M x 16 |
| Datenrate | 3200 MT/s (DDR4-3200) |
| Clock Frequency | 1.6 GHz |
| Access Time | 19 ns |
| Supply Voltage (VDD) | 1.2 V |
| Supply Voltage (VPP) | 2.5 V |
| Gehäuse | 96-ball FBGA (7.5 x 13.5 mm) |
| Ball Pitch | 0.8 mm |
| Betriebstemperatur | -40C to +105C (automotive) |
| Speed Grade | -062E (0.625 ns tCK) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| On-Die Termination | Yes (ODT) |
| ZQ Calibration | Yes |
| Data Mask | Yes (DM) |
| Refresh Mode | Auto self-refresh |
MT40A512M16LY-062E-ATE Pin-Konfiguration
| Pin A1 | VSS — Ground |
| Pin A2 | VDD — 1.2 V power supply |
| Pin A3 | DQ0 — Data input/output bit 0 |
| Pin A4 | DQ1 — Data input/output bit 1 |
| Pin A5 | DQ2 — Data input/output bit 2 |
| Pin A6 | DQ3 — Data input/output bit 3 |
| Pin A7 | VSSQ — DQ ground |
| Pin A8 | VDDQ — DQ power supply |
| Pin A9 | DQ4 — Data input/output bit 4 |
| Pin B1 | VSS — Ground |
| Pin B2 | VDD — 1.2 V power supply |
| Pin B3 | DQ5 — Data input/output bit 5 |
| Pin B4 | DQ6 — Data input/output bit 6 |
| Pin B5 | DQ7 — Data input/output bit 7 |
| Pin B6 | VSSQ — DQ ground |
| Pin B7 | VDDQ — DQ power supply |
| Pin B8 | DQS_t — Data strobe true |
| Pin B9 | DQS_c — Data strobe complement |
| Pin C1 | VSS — Ground |
| Pin C2 | VDD — 1.2 V power supply |
| Pin C3 | DQ8 — Data input/output bit 8 |
| Pin C4 | DQ9 — Data input/output bit 9 |
| Pin C5 | DQ10 — Data input/output bit 10 |
| Pin C6 | DQ11 — Data input/output bit 11 |
| Pin C7 | VSSQ — DQ ground |
| Pin C8 | VDDQ — DQ power supply |
| Pin C9 | DQ12 — Data input/output bit 12 |
| Pin D1 | VSS — Ground |
| Pin D2 | VDD — 1.2 V power supply |
| Pin D3 | DQ13 — Data input/output bit 13 |
| Pin D4 | DQ14 — Data input/output bit 14 |
| Pin D5 | DQ15 — Data input/output bit 15 |
| Pin D6 | VSSQ — DQ ground |
| Pin D7 | VDDQ — DQ power supply |
| Pin D8 | TDQS_t — Termination data strobe true |
| Pin D9 | TDQS_c — Termination data strobe complement |
| Pin E1 | VSS — Ground |
| Pin E2 | VDD — 1.2 V power supply |
| Pin E3 | VREFCA — Reference voltage for command/address |
| Pin E4 | VSS — Ground |
| Pin E5 | VDD — 1.2 V power supply |
| Pin E6 | VSS — Ground |
| Pin E7 | VDD — 1.2 V power supply |
| Pin E8 | VSS — Ground |
| Pin E9 | VDD — 1.2 V power supply |
| Pin F1 | VSS — Ground |
| Pin F2 | VDD — 1.2 V power supply |
| Pin F3 | VSS — Ground |
| Pin F4 | VDD — 1.2 V power supply |
| Pin F5 | VSS — Ground |
| Pin F6 | VDD — 1.2 V power supply |
| Pin F7 | VSS — Ground |
| Pin F8 | VDD — 1.2 V power supply |
| Pin F9 | VSS — Ground |
| Pin G1 | VSS — Ground |
| Pin G2 | VDD — 1.2 V power supply |
| Pin G3 | VSS — Ground |
| Pin G4 | VDD — 1.2 V power supply |
| Pin G5 | VSS — Ground |
| Pin G6 | VDD — 1.2 V power supply |
| Pin G7 | VSS — Ground |
| Pin G8 | VDD — 1.2 V power supply |
| Pin G9 | VSS — Ground |
| Pin H1 | VSS — Ground |
| Pin H2 | VDD — 1.2 V power supply |
| Pin H3 | VSS — Ground |
| Pin H4 | VDD — 1.2 V power supply |
| Pin H5 | VSS — Ground |
| Pin H6 | VDD — 1.2 V power supply |
| Pin H7 | VSS — Ground |
| Pin H8 | VDD — 1.2 V power supply |
| Pin H9 | VSS — Ground |
| Pin J1 | VSS — Ground |
| Pin J2 | VDD — 1.2 V power supply |
| Pin J3 | VSS — Ground |
| Pin J4 | VDD — 1.2 V power supply |
| Pin J5 | VSS — Ground |
| Pin J6 | VDD — 1.2 V power supply |
| Pin J7 | VSS — Ground |
| Pin J8 | VDD — 1.2 V power supply |
| Pin J9 | VSS — Ground |
| Pin K1 | VSS — Ground |
| Pin K2 | VDD — 1.2 V power supply |
| Pin K3 | VSS — Ground |
| Pin K4 | VDD — 1.2 V power supply |
| Pin K5 | VSS — Ground |
| Pin K6 | VDD — 1.2 V power supply |
| Pin K7 | VSS — Ground |
| Pin K8 | VDD — 1.2 V power supply |
| Pin K9 | VSS — Ground |
| Pin L1 | VSS — Ground |
| Pin L2 | VDD — 1.2 V power supply |
| Pin L3 | VSS — Ground |
| Pin L4 | VDD — 1.2 V power supply |
| Pin L5 | VSS — Ground |
| Pin L6 | VDD — 1.2 V power supply |
| Pin L7 | VSS — Ground |
| Pin L8 | VDD — 1.2 V power supply |
| Pin L9 | VSS — Ground |
Typische Anwendungen
MT40A512M16LY-062E-ATE ist geeignet für 6 Anwendungs: Automotive ADAS Domain Controller, Automotive Infotainment Head Unit, Industrial Machine Vision, Networking Line Card, Industrial Single-Board Computer, Test and Measurement Instrumentation.
Automotive ADAS Domain Controller
The MT40A512M16LY-062E-ATE fits ADAS domain controllers because its -40C to +105C automotive temperature grade and 3200 MT/s data rate support sensor-fusion processors that must run reliably under-hood. Multiple x16 devices are placed in a 32-bit or 64-bit wide memory channel to provide the 6.4 GB/s per device bandwidth needed for camera and radar frame buffering. The 1.2 V VDD and 2.5 V VPP rails are supplied by a DDR4 PMIC with VTT termination on the fly-by address bus. Unlike LPDDR4, this DDR4 device uses a standard 0.8 mm pitch 96-ball FBGA that is easier to route and inspect on automotive PCBs, though it consumes more board area and power per bit.
Empfohlen
Automotive Infotainment Head Unit
The MT40A512M16LY-062E-ATE is used in infotainment head units where the SoC requires high-bandwidth DDR4 for graphics and video decode. Its 8 Gb density in a single x16 die allows a 2-device 32-bit channel to provide 4 GB of system memory, sufficient for dual-display rendering and navigation. The 3200 MT/s rate supports 4K video pipelines, and the automotive temperature grade covers the dashboard thermal environment. The device's ODT and write-leveling features simplify signal integrity on the fly-by topology, while ZQ calibration compensates for process, voltage, and temperature drift. Compared with LPDDR4, DDR4 offers a wider, more serviceable package but higher I/O power, so thermal and power budgeting must account for the 1.2 V rail.
Empfohlen
Industrial Machine Vision
Machine vision systems use the MT40A512M16LY-062E-ATE to buffer high-resolution image frames before FPGA or GPU processing. The 8 Gb density and 6.4 GB/s per-device bandwidth allow multiple 4K frames to be stored without dropping data, and the 19 ns access time keeps latency low for real-time inspection. The -40C to +105C range supports factory floors and outdoor installations where cabinet temperatures can exceed commercial limits. The device is typically paired with an FPGA memory controller that uses the DDR4 ODT and data-mask functions to maintain signal integrity across a 32-bit or 64-bit bus. Unlike SRAM, DDR4 requires periodic refresh, so the controller must schedule refresh commands without starving the vision pipeline.
Empfohlen
Networking Line Card
Networking line cards use the MT40A512M16LY-062E-ATE as packet buffer memory for high-throughput routers and switches. The 3200 MT/s data rate and x16 organization provide the bandwidth needed to buffer packets at 100G+ line rates, while the 8 Gb density supports deep queues for traffic shaping. The device's CRC and data-mask functions improve data integrity in the presence of the electrical noise typical of dense line-card layouts. The 1.2 V supply and 2.5 V VPP are generated by a dedicated DDR4 power solution, and the fly-by address bus requires VTT termination. Compared with on-chip SRAM, this external DRAM adds latency but provides far greater buffer depth at lower cost per bit.
Empfohlen
Industrial Single-Board Computer
Industrial single-board computers use the MT40A512M16LY-062E-ATE to provide main memory for x86 or ARM SoCs in fanless enclosures. The 8 Gb density allows 4 GB or 8 GB system configurations using two or four devices, and the 3200 MT/s rate supports responsive OS and application performance. The -40C to +105C grade is essential for DIN-rail and cabinet-mounted SBCs where internal temperatures rise above commercial limits. The 96-ball FBGA is soldered directly to the PCB, improving vibration resistance compared with DIMM sockets. Designers must ensure the SoC memory controller supports DDR4-3200 at the target temperature and provide adequate decoupling on the 1.2 V and 2.5 V rails.
Empfohlen
Test and Measurement Instrumentation
Test and measurement instruments use the MT40A512M16LY-062E-ATE to capture and process high-speed acquisition data. The 8 Gb density provides deep capture buffers for oscilloscopes and logic analyzers, while the 3200 MT/s bandwidth allows continuous streaming to the processing FPGA or CPU. The 19 ns access time and deterministic refresh behavior support real-time triggering and analysis. The -40C to +105C range covers benchtop and field instruments, and the automotive-grade die provides the reliability margin expected in calibration and metrology equipment. The device's ZQ calibration and ODT maintain signal integrity across the wide temperature swings typical of instrument warm-up cycles.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MT40A512M16LY-062E-ATE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MT40A512M16LY-062E-IT-E | MT40A512M16LY-062E-AUT-E | MT40A512M16LY-062E-AAT-E | K4A8G165WC-BCTD |
|---|---|---|---|---|---|
| Package | 96-ball FBGA (7.5 x 13.5 mm) | 96-ball FBGA (7.5 x 13.5 mm) - same | 96-ball FBGA (7.5 x 13.5 mm) - same | 96-ball FBGA (7.5 x 13.5 mm) - same | 96-ball FBGA (7.5 x 13.5 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics |
| Density | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| Supply Voltage (VDD) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| On-Die Termination | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Automotive +105C temperature grade (vs. MT40A512M16LY-062E-IT-E)
- DDR4-3200 speed grade (vs. MT40A512M16LY-062E:E)
- Single-die 8 Gb x16 density (vs. K4A8G165WC-BCTD)
- Full DDR4 feature set (vs. MT40A512M16LY-062E-AUT-E)
Designhinweise
Route the DDR4 address/command bus in a fly-by topology with VTT termination at the far end, and match trace lengths within each byte lane to within 5 mil. The MT40A512M16LY-062E-ATE supports on-die termination (ODT) and write leveling, which must be enabled in the memory controller to compensate for fly-by skew. Use 0.8 mm pitch 96-ball FBGA escape routing with via-in-pad or dog-bone fanout, and reference all high-speed signals to a solid ground plane.
The MT40A512M16LY-062E-ATE requires a 1.2 V VDD rail and a 2.5 V VPP rail. Estimated: at 3200 MT/s a single x16 device draws roughly 1.5-2.5 W depending on access pattern, so a 2-device 32-bit channel needs about 3-5 W of memory power budget. Decouple each VDD ball with a 0.1 uF ceramic capacitor placed within 2 mm, and provide bulk 10 uF capacitance per device. Use a dedicated DDR4 PMIC with VTT termination for the address bus.
The automotive -40C to +105C grade of the MT40A512M16LY-062E-ATE allows operation near heat sources, but the DRAM junction temperature must still be kept below the datasheet limit. Estimated: at 2 W dissipation and a typical 96-ball FBGA theta_JA of about 30 C/W, the junction rises roughly 60C above the local board temperature, so ensure the board ambient stays below about +45C for margin. Add thermal vias under the package and avoid placing the device directly above power components.
Do not mix the AT (-40C to +105C) and IT (-40C to +95C) temperature grades on the same board without validating the thermal profile, because the IT variant will limit the system's maximum operating temperature. Also verify that the memory controller supports DDR4-3200 at the target temperature grade; some controllers derate to 2666 MT/s above +85C, which would waste the -062E speed grade.
Compliance-Informationen
The AT suffix denotes automotive temperature qualification (-40C to +105C). RoHS compliance and lead-free status are stated on distributor listings; REACH and halogen-free status were not confirmed in the provided data.
