RTAX250SL-1LG624EV - 250K-Gate Rad-Tolerant FPGA | Microchip
Teilenummer: RTAX250SL-1LG624EV ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
RTAX250SL-1LG624EV Übersicht
A radiation-tolerant FPGA is a field-programmable gate array qualified for spaceflight environments, where high-energy particles would upset configuration memory in SRAM-based FPGAs. The RTAX-SL family sits within the broader hierarchy: FPGA -> radiation-tolerant FPGA -> space-grade programmable logic -> spacecraft digital electronics. Because the RTAX-SL uses non-volatile antifuse interconnect, its configuration cannot be disturbed by single-event upsets, and the device is live at power-up with no external boot PROM required.
Key features include 2816 CLB-based logic cells with 250K equivalent gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources and chip-wide highway routing, and single-chip operation that eliminates the configuration device needed by reprogrammable space FPGAs. The -1 speed grade and LG624 package maximize I/O and logic access for high-gate-count payloads.
Architecturally, RTAX-SL is derived from the commercial Axcelerator family, adding total-ionizing-dose-hardened processing and design rules. The 0.15 um CMOS antifuse technology provides low static power and strong SEU immunity for on-board data handling, telemetry, and payload processing chains.
Typical applications include satellite on-board computers, spacecraft payload controllers, telecommand/telemetry processing, and radiation-tolerant glue logic replacing multiple ASIC or discrete functions. The EV ordering suffix denotes a space-flight qualification flow intended for final flight hardware.
Design consideration: RTAX-SL devices are one-time programmable. Use the footprint-compatible RTAX prototyping flow (adaptor boards and EDIF netlist conversion) with the RTAX250SL-1LG624PROTO companion part before committing flight units.
This page synthesizes drop-in same-family alternatives, prototyping-flow guidance, and sourcing context not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für RTAX250SL-1LG624EV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit RTAX250SL-1LG624EV (gleiche Bauform und Footprint) – abweichend in Family, Package, Radiation Tolerance, Process Technology, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RTAX250SL-1LG624E
✅ Drop-In✓ Auf Lager
$2350 / Stück
Datenblatt ansehen →RTAX250SL-1LG624V
✅ Drop-In✓ Auf Lager
$950 / Stück
Datenblatt ansehen →RTAX250SL-LG624E
✅ Drop-In✓ Auf Lager
$1000 / Stück
Datenblatt ansehen →RTAX250SL-LG624V
✅ Drop-In✓ Auf Lager
$1620 / Stück
Datenblatt ansehen →RTAX250S-1LG624E
✅ Drop-In✓ Auf Lager
$1 / Stück
Datenblatt ansehen →RTAX250S-1LG624V
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX250S-LG624EV
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX250SL-1LG624EV Grenzwerte & elektrische Eigenschaften
| Family | RTAX-SL (Radiation-Tolerant FPGA) |
| Equivalent System Gates | 250,000 gates |
| Logic Cells (CLBs) | 2816 |
| Total Cells (CMOS architecture) | 4224 |
| Maximum Toggle Rate | 649 MHz |
| Process Technology | 0.15 um CMOS antifuse |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| Gehäuse | 624-pin ceramic LGA (LG624) |
| Configuration Type | One-time programmable antifuse, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Radiation Tolerance | Radiation-tolerant (spaceflight qualified flow) |
| Application Flow | Space-flight (EV qualification suffix) |
| Montageart | Surface Mount |
RTAX250SL-1LG624EV 624-pin ceramic lga (lg624) Pinbelegungsleitfaden
Pinbelegung für RTAX250SL-1LG624EV (624-pin ceramic lga (lg624)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für RTAX250SL-1LG624EV.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RTAX250SL-1LG624EV ist geeignet für 6 Anwendungs: Satellite On-Board Computer (OBC), Payload Data Processing, Telemetry and Telecommand Interfaces, Radiation-Tolerant Glue Logic Consolidation, Spacecraft Instrument Control, Launch Vehicle and Avionics Digital Logic.
Satellite On-Board Computer (OBC)
The RTAX250SL-1LG624EV fits satellite on-board computers because its antifuse configuration fabric is immune to configuration upsets from single-event effects, eliminating the scrubbing circuitry that SRAM-based space FPGAs require. With 250K equivalent gates and 2816 logic cells, it can integrate a soft processor core, memory controllers, and telecommand/telemetry interfaces in a single chip, reducing board area and mass. The 1.5V core and 0.15 um antifuse process keep static power low, and live-at-power-up operation removes boot delay and the external configuration PROM. Its 624-pin LG ceramic package provides ample I/O for redundant MIL-STD-style data buses and sensor interfaces in flight hardware.
Empfohlen
Payload Data Processing
For spacecraft payload controllers processing imaging or science data, the RTAX250SL-1LG624EV offers 649 MHz toggle capability at the -1 speed grade and embedded SRAM with built-in FIFO control logic, well suited to implementing DMA-style data path buffering and stream formatting. The chip-wide highway routing and segmentable clocks support multiple processing domains on one device, and the 4224-cell CMOS architecture provides the density to replace several smaller glue-logic devices. Because the antifuse fabric does not upset under radiation, the payload can rely on continuous operation without configuration reload, an important reliability advantage for high-availability scientific missions.
Empfohlen
Telemetry and Telecommand Interfaces
Telecommand decoders and telemetry encoders benefit from the RTAX250SL-1LG624EV's deterministic, live-at-power-up behavior: the interface is functional the instant power is applied, with no configuration loading window during which commands could be lost. The LG624 ceramic package exposes sufficient user I/O for redundant command links, and 250K gates accommodate frame formatting, CRC, and protocol state machines. Low 1.5V core power suits always-on housekeeping chains that run continuously through eclipse periods, and the radiation-tolerant construction maintains link integrity across the total ionizing dose expected in low-Earth-orbit and deep-space environments.
Empfohlen
Radiation-Tolerant Glue Logic Consolidation
Many flight designs still contain dozens of rad-hard ASICs, PALs, and discrete logic devices for bus interfacing, arbitration, and I/O expansion. The RTAX250SL-1LG624EV consolidates such logic into a single 250K-gate antifuse FPGA, cutting component count, board area, and assembly points - each of which is a reliability and radiation concern in spaceflight electronics. Because the device is one-time programmable, consolidated logic is fixed at programming time, avoiding configuration-upset failure modes. The Microchip prototyping flow using the footprint-compatible RTAX250SL-1LG624PROTO and EDIF netlist conversion lets teams validate consolidated designs before committing flight units.
Empfohlen
Spacecraft Instrument Control
Instrument controller functions such as detector sequencing, actuator drive timing, and housekeeping ADC interfacing map well onto the RTAX250SL-1LG624EV. The 2816 logic cells provide room for sequencer state machines plus FIFO-based sample buffering in embedded SRAM, while segmentable clocks let timing-critical detector interfaces run independently from slower housekeeping domains. The 649 MHz toggle capability supports tight timing resolution at the -1 speed grade, and the radiation-tolerant antifuse fabric guarantees that instrument control logic cannot be corrupted by SEUs in orbit - critical for instruments with long, uninterrupted integration cycles on science missions.
Empfohlen
Launch Vehicle and Avionics Digital Logic
Launch vehicle avionics and expendable-stage electronics operate in severe radiation and vibration environments for short but absolutely critical missions. The RTAX250SL-1LG624EV's ceramic LG624 package withstands mechanical stress better than plastic packaging, and the antifuse configuration cannot corrupt during flight. Live-at-power-up behavior removes configuration delay in fast-turnaround launch sequences, and 250K gates suffice for flight-event sequencers, discrete I/O, and redundant voting logic. Using the same RTAX-SL footprint across prototyping (PROTO) and flight (EV) units simplifies qualification testing and reduces board respins between development and flight lots.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RTAX250SL-1LG624EV – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RTAX250SL-1LG624E | RTAX250SL-1LG624V | RTAX250S-1LG624V | RTAX250SL-LG624V |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 624-pin ceramic LGA (LG624) | LG624 - same | LG624 - same | LG624 - same | LG624 - same |
| Equivalent Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 2816 | 2816 | 2816 | 2816 | 2816 |
| Speed Grade | -1 | -1 | -1 | -1 | Standard |
| Qualification Flow | EV (space-flight) | E (engineering) | V (standard rad-tolerant) | V (standard rad-tolerant) | V (standard rad-tolerant) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration | Antifuse OTP, live at power-up | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP |
Wichtigste Unterscheidungsmerkmale
- Space-flight (EV) qualification flow (vs. RTAX250SL-1LG624V)
- Fastest SL speed grade in the footprint (vs. RTAX250SL-LG624V)
- SL die performance in same footprint as RTAX-S (vs. RTAX250S-1LG624V)
Designhinweise
RTAX-SL devices are one-time programmable: a burned flight unit cannot be reprogrammed, and a mis-programmed EV part is a scrap cost of thousands of dollars plus schedule loss. Always validate the programming file on the footprint-compatible RTAX250SL-1LG624PROTO device first. Microchip's documented methodology uses a footprint-compatible adaptor board with an EDIF netlist and pinout converter to migrate designs from prototyping devices to RTAX-S/SL flight devices - see the application note 'Prototyping for RTAX-S and RTAX-SL Devices.' Never skip design-rule and timing sign-off before burning flight units.
The RTAX250SL operates at a 1.5V core supply with the antifuse fabric contributing very low static power, but I/O bank supplies and switching activity dominate total board power in high-utilization designs. Estimate power in Libero SoC using actual toggle rates before finalizing the spacecraft power budget, and provide margin for worst-case temperature and radiation-end-of-life conditions. Decouple each VCC/VCCA bank with low-ESR ceramic capacitors placed close to the LG624 pins, and follow the datasheet power-up sequencing requirements to avoid latch-up during turn-on.
The 624-pin LG ceramic LGA uses a dense land-pattern grid that requires careful PCB escape routing; follow the Microchip-recommended land pattern and via fanout exactly, as rework of ceramic-column packages on flight boards is essentially impossible. Assign unused I/O per datasheet recommendations (typically grounded or tri-stated with termination), maintain controlled impedance on high-speed clock and bus nets, and segregate analog and digital returns. Because flight hardware cannot be respun cheaply, run full DFM and signal-integrity review before fabrication.
Compliance-Informationen
Space-flight ceramic-packaged device; environmental compliance data was not present in the retrieved web data and must be obtained from Microchip product documentation.
