RTAX250SL-1LG624EV - 250K-Gate Rad-Tolerant FPGA | Microchip
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Drop-in alternatives for RTAX250SL-1LG624EV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250SL-1LG624E
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View Datasheet →RTAX250SL-1LG624EV Maximum Ratings & Electrical Characteristics
| Family | RTAX-SL (Radiation-Tolerant FPGA) |
| Equivalent System Gates | 250,000 gates |
| Logic Cells (CLBs) | 2816 |
| Total Cells (CMOS architecture) | 4224 |
| Maximum Toggle Rate | 649 MHz |
| Process Technology | 0.15 um CMOS antifuse |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| Package | 624-pin ceramic LGA (LG624) |
| Configuration Type | One-time programmable antifuse, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Radiation Tolerance | Radiation-tolerant (spaceflight qualified flow) |
| Application Flow | Space-flight (EV qualification suffix) |
| Mounting Type | Surface Mount |
RTAX250SL-1LG624EV 624-pin ceramic lga (lg624) Pin Configuration Guide
Complete pinout information for RTAX250SL-1LG624EV (624-pin ceramic lga (lg624) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-1LG624EV.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-1LG624EV is suitable for 6 applications: Satellite On-Board Computer (OBC), Payload Data Processing, Telemetry and Telecommand Interfaces, Radiation-Tolerant Glue Logic Consolidation, Spacecraft Instrument Control, Launch Vehicle and Avionics Digital Logic.
Satellite On-Board Computer (OBC)
The RTAX250SL-1LG624EV fits satellite on-board computers because its antifuse configuration fabric is immune to configuration upsets from single-event effects, eliminating the scrubbing circuitry that SRAM-based space FPGAs require. With 250K equivalent gates and 2816 logic cells, it can integrate a soft processor core, memory controllers, and telecommand/telemetry interfaces in a single chip, reducing board area and mass. The 1.5V core and 0.15 um antifuse process keep static power low, and live-at-power-up operation removes boot delay and the external configuration PROM. Its 624-pin LG ceramic package provides ample I/O for redundant MIL-STD-style data buses and sensor interfaces in flight hardware.
Recommended
Payload Data Processing
For spacecraft payload controllers processing imaging or science data, the RTAX250SL-1LG624EV offers 649 MHz toggle capability at the -1 speed grade and embedded SRAM with built-in FIFO control logic, well suited to implementing DMA-style data path buffering and stream formatting. The chip-wide highway routing and segmentable clocks support multiple processing domains on one device, and the 4224-cell CMOS architecture provides the density to replace several smaller glue-logic devices. Because the antifuse fabric does not upset under radiation, the payload can rely on continuous operation without configuration reload, an important reliability advantage for high-availability scientific missions.
Recommended
Telemetry and Telecommand Interfaces
Telecommand decoders and telemetry encoders benefit from the RTAX250SL-1LG624EV's deterministic, live-at-power-up behavior: the interface is functional the instant power is applied, with no configuration loading window during which commands could be lost. The LG624 ceramic package exposes sufficient user I/O for redundant command links, and 250K gates accommodate frame formatting, CRC, and protocol state machines. Low 1.5V core power suits always-on housekeeping chains that run continuously through eclipse periods, and the radiation-tolerant construction maintains link integrity across the total ionizing dose expected in low-Earth-orbit and deep-space environments.
Recommended
Radiation-Tolerant Glue Logic Consolidation
Many flight designs still contain dozens of rad-hard ASICs, PALs, and discrete logic devices for bus interfacing, arbitration, and I/O expansion. The RTAX250SL-1LG624EV consolidates such logic into a single 250K-gate antifuse FPGA, cutting component count, board area, and assembly points - each of which is a reliability and radiation concern in spaceflight electronics. Because the device is one-time programmable, consolidated logic is fixed at programming time, avoiding configuration-upset failure modes. The Microchip prototyping flow using the footprint-compatible RTAX250SL-1LG624PROTO and EDIF netlist conversion lets teams validate consolidated designs before committing flight units.
Recommended
Spacecraft Instrument Control
Instrument controller functions such as detector sequencing, actuator drive timing, and housekeeping ADC interfacing map well onto the RTAX250SL-1LG624EV. The 2816 logic cells provide room for sequencer state machines plus FIFO-based sample buffering in embedded SRAM, while segmentable clocks let timing-critical detector interfaces run independently from slower housekeeping domains. The 649 MHz toggle capability supports tight timing resolution at the -1 speed grade, and the radiation-tolerant antifuse fabric guarantees that instrument control logic cannot be corrupted by SEUs in orbit - critical for instruments with long, uninterrupted integration cycles on science missions.
Recommended
Launch Vehicle and Avionics Digital Logic
Launch vehicle avionics and expendable-stage electronics operate in severe radiation and vibration environments for short but absolutely critical missions. The RTAX250SL-1LG624EV's ceramic LG624 package withstands mechanical stress better than plastic packaging, and the antifuse configuration cannot corrupt during flight. Live-at-power-up behavior removes configuration delay in fast-turnaround launch sequences, and 250K gates suffice for flight-event sequencers, discrete I/O, and redundant voting logic. Using the same RTAX-SL footprint across prototyping (PROTO) and flight (EV) units simplifies qualification testing and reduces board respins between development and flight lots.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-1LG624EV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-1LG624E | RTAX250SL-1LG624V | RTAX250S-1LG624V | RTAX250SL-LG624V |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 624-pin ceramic LGA (LG624) | LG624 - same | LG624 - same | LG624 - same | LG624 - same |
| Equivalent Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 2816 | 2816 | 2816 | 2816 | 2816 |
| Speed Grade | -1 | -1 | -1 | -1 | Standard |
| Max Toggle Rate | 649 MHz | 649 MHz | 649 MHz | [DATA_NEEDED] | [DATA_NEEDED] |
| Qualification Flow | EV (space-flight) | E (engineering) | V (standard rad-tolerant) | V (standard rad-tolerant) | V (standard rad-tolerant) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration | Antifuse OTP, live at power-up | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP |
Key Differentiators
- Space-flight (EV) qualification flow (vs RTAX250SL-1LG624V)
- Fastest SL speed grade in the footprint (vs RTAX250SL-LG624V)
- SL die performance in same footprint as RTAX-S (vs RTAX250S-1LG624V)
Design Notes
RTAX-SL devices are one-time programmable: a burned flight unit cannot be reprogrammed, and a mis-programmed EV part is a scrap cost of thousands of dollars plus schedule loss. Always validate the programming file on the footprint-compatible RTAX250SL-1LG624PROTO device first. Microchip's documented methodology uses a footprint-compatible adaptor board with an EDIF netlist and pinout converter to migrate designs from prototyping devices to RTAX-S/SL flight devices - see the application note 'Prototyping for RTAX-S and RTAX-SL Devices.' Never skip design-rule and timing sign-off before burning flight units.
The RTAX250SL operates at a 1.5V core supply with the antifuse fabric contributing very low static power, but I/O bank supplies and switching activity dominate total board power in high-utilization designs. Estimate power in Libero SoC using actual toggle rates before finalizing the spacecraft power budget, and provide margin for worst-case temperature and radiation-end-of-life conditions. Decouple each VCC/VCCA bank with low-ESR ceramic capacitors placed close to the LG624 pins, and follow the datasheet power-up sequencing requirements to avoid latch-up during turn-on.
The 624-pin LG ceramic LGA uses a dense land-pattern grid that requires careful PCB escape routing; follow the Microchip-recommended land pattern and via fanout exactly, as rework of ceramic-column packages on flight boards is essentially impossible. Assign unused I/O per datasheet recommendations (typically grounded or tri-stated with termination), maintain controlled impedance on high-speed clock and bus nets, and segregate analog and digital returns. Because flight hardware cannot be respun cheaply, run full DFM and signal-integrity review before fabrication.
Compliance Information
Space-flight ceramic-packaged device; environmental compliance data was not present in the retrieved web data and must be obtained from Microchip product documentation.
